AP9120GH/J-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
P-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Lower On-resistance
D
▼ Simple Drive Requirement
▼ Fast Switching Characteristic
▼ RoHS Compliant & Halogen-Free
BVDSS
-200V
RDS(ON)
680mΩ
ID
G
-8A
S
Description
G
The TO-252 package is widely preferred for all commercial-industrial
surface mount applications and suited for low voltage applications
such as DC/DC converters. The through-hole version (AP9120GJ) is
available for low-profile applications.
D S
TO-252(H)
G
D
S
TO-251(J)
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
-200
V
VGS
Gate-Source Voltage
+20
V
ID@TC=25℃
Continuous Drain Current, VGS @ 10V
-8
A
ID@TC=100℃
Continuous Drain Current, VGS @ 10V
-5
A
1
IDM
Pulsed Drain Current
30
A
PD@TC=25℃
Total Power Dissipation
96
W
Linear Derating Factor
0.77
W/℃
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-c
Parameter
Maximum Thermal Resistance, Junction-case
3
Value
Units
1.3
℃/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient (PCB mount)
62.5
℃/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient
110
℃/W
Data and specifications subject to change without notice
1
201005242
AP9120GH/J-HF
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
-200
-
-
V
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=-250uA
RDS(ON)
Static Drain-Source On-Resistance2
VGS=-10V, ID=-4A
-
-
680
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=-250uA
-2
-
-4
V
gfs
Forward Transconductance
VDS=-10V, ID=-5A
-
7
-
S
IDSS
Drain-Source Leakage Current
VDS=-200V, VGS=0V
-
-
-25
uA
Drain-Source Leakage Current (T j=125oC) VDS=-160V, VGS=0V
-
-
-250
uA
Gate-Source Leakage
VGS= +20V, VDS=0V
-
-
+100
nA
ID=-5A
-
35
56
nC
IGSS
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=-160V
-
6
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=-10V
-
15
-
nC
VDS=-100V
-
13.5
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=-5A
-
16
-
ns
td(off)
Turn-off Delay Time
RG=10Ω
-
52
-
ns
tf
Fall Time
VGS=-10V
-
25
-
ns
Ciss
Input Capacitance
VGS=0V
-
1210
-
pF
Coss
Output Capacitance
VDS=-25V
-
170
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
45
-
pF
Rg
Gate Resistance
f=1.0MHz
-
3.6
5.4
Ω
Min.
Typ.
IS=-5A, VGS=0V
-
-
-1.3
V
IS=-5A, VGS=0V,
-
200
-
ns
dI/dt=-100A/µs
-
2
-
uC
Source-Drain Diode
Symbol
VSD
Parameter
2
Forward On Voltage
2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
Max. Units
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP9120GH/J-HF
12
20
-10V
-8.0V
-7.0V
-ID , Drain Current (A)
16
-6.0V
12
8
V G = - 5.0V
-10V
-8.0V
-7.0V
-6.0V
TC=150oC
10
-ID , Drain Current (A)
T C =25 o C
8
V G = -5.0V
6
4
4
2
0
0
0
4
8
12
16
20
0
24
4
8
12
16
20
-V DS , Drain-to-Source Voltage (V)
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
2.4
700
I D = -4 A
T C =25 ℃
I D =- 4 A
V G =-10V
Normalized RDS(ON)
RDS(ON) (mΩ )
660
620
580
1.9
1.4
0.9
540
0.4
500
4
5
6
7
8
9
-50
10
Fig 3. On-Resistance v.s. Gate Voltage
50
100
150
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.5
Normalized -VGS(th) (V)
4
3
-IS(A)
0
T j , Junction Temperature ( o C)
-V GS , Gate-to-Source Voltage (V)
o
o
T j =150 C
T j =25 C
2
1.1
0.7
1
0
0.3
0
0.2
0.4
0.6
0.8
1
-V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP9120GH/J-HF
f=1.0MHz
2000
I D = -5A
V DS = -160V
10
1600
C iss
8
C (pF)
-VGS , Gate to Source Voltage (V)
12
6
1200
800
4
400
2
C oss
C rss
0
0
0
10
20
30
40
1
50
5
9
13
17
21
25
29
-V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
Normalized Thermal Response (Rthjc)
1
100us
Operation in this area
limited by RDS(ON)
-ID (A)
10
1ms
10ms
100ms
DC
1
o
T C =25 C
Single Pulse
0.1
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
1
10
100
1000
0.00001
0.0001
0.001
0.01
0.1
1
-V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VDS
VG
90%
QG
-10V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4