TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module Applications Small Cell BTS 3G/4G Wireless infrastructure Linearized Transmitter W-CDMA/ LTE/ CDMA Heterogeneous Networks Product Features 20 Pin 20x20 mm Plastic Package Functional Block Diagram 2110-2170 MHz 2.5 W RMS Output Power Integrated Doherty Final Stage Three Stage Power Added Efficiency: 35 % 50 Ω Input / Output Power Gain: 34 dB Peak Power: 18 W Package Dimensions: 20 x 20 x 1.5 mm 100 % DC and RF tested General Description The TGA2450-SM is a fully integrated surface mount 3stage Power Amplifier Module ideally suited for 3G and 4G small cell base station applications with 1 W RMS at the antenna. The module is 50 Ω input and output and requires minimal external components. The module is also compact and offers a much smaller footprint than traditional discrete component solutions. The TGA2450-SM incorporates a Doherty final stage delivering high power added efficiency of 35 % for the entire module at 2.5 W average power. The TGA2450-SM supports multi-mode and multicarrier signals. The module includes InGaP/GaAs HBT device technology to provide a combination of high efficiency and DPD friendliness. Pin Configuration Pin No. Label 1 2 3, 8, 18 4, 5, 7, 10, 12-16, 20 6 9 11 17 19 Backside Paddle PA EN VCC1 N/C GND RF IN VCC4 RF OUT VCC3 VCC2 RF/DC GND Lead-free and RoHS compliant. Evaluation Board is available upon request. Datasheet: Rev B 08-14-13 © 2013 TriQuint Ordering Information Part No. Description TGA2450-SM TGA2450-SM-PCB Small Cell PAM 2110-2170 MHz Eval Board - 1 of 9 - Disclaimer: Subject to change without notice www.triquint.com TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module Absolute Maximum Ratings Recommended Operating Conditions Parameter Parameter Min Typ Operating Temperature VCC1 VCC2, VCC3, VCC4 PA Enable On PA Enable Off ICQ1 (at VCC1) ICQ2 (at VCC2) ICQ3 (at VCC3) Tj for > 106 hours MTTF −40 +25 5 18 1.2-5.5 0 60 25 90 Rating Collector Voltage (VCC1) 6V Collector Voltage (VCC2, VCC3, VCC4) 19 V RF Input Power Over Drive above 8 dB PIN at 34 dBm POUT, 50 Ω, T = 25C VSWR at POUT with 1 dB PAR 5:1 compression with WCDMA signal Storage Temperature −65°C to 150°C Case Temperature (Backside Pads) 120°C Operation of this device outside the parameter ranges given above may cause permanent damage. 1.15 Max Units +90 6 0.6 200 °C V V V V mA mA mA °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications at TCASE = 25°C Test conditions unless otherwise noted: VCC1 = 5 V, VCC2 = 18 V, VCC3 = 18 V, VCC4 = 18 V, ICQ1 = 60 mA, ICQ2 = 25 mA, ICQ3 = 90 mA, POUT = 34 dBm, System impedance = 50 Ω Parameter RF Frequency Range ICQ1 ICQ2+ICQ3 Power Gain Gain flatness across any 40 MHz in-band Average Output Power P3dB Power Added Efficiency ACLR DPD corrected Input/Output Impedance Input Return Loss Group delay Group delay ripple Noise Figure Datasheet: Rev B 08-14-13 © 2013 TriQuint Conditions Min Typ VCC1 = 5 V VCC2 = VCC3 = 18 V POUT = 34 dBm average 2110 35 90 32.2 60 115 34.4 POUT = 34 dBm average Pulsed, 10 µsec width, 1 msec period POUT = 34 dBm average 5-20 MHz SBW UMTS/LTE POUT = 34 dBm average - 2 of 9 - 1 +41.9 33.2 +34 +42.6 35.4 −55 50 13 Max Units 2170 80 140 MHz mA mA 2 dB 11 5 750 3 dBm dBm % dBc ohm dB nS pS dB Disclaimer: Subject to change without notice www.triquint.com TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module Electrical Specifications at TCASE = −40°C to +90°C Test conditions unless otherwise noted: VCC1 = 5 V, VCC2 = 18 V, VCC3 = 18 V, VCC4 = 18 V, ICQ1 = 60 mA, ICQ2 = 25 mA, ICQ3 = 90 mA, POUT = 34 dBm, System impedance = 50 Ω Parameter Conditions Min Typ Max Units Power Gain ICQ1 ICQ2+ICQ3 ICC1 Gain flatness across any 40 MHz in-band P3dB Power Added Efficiency Input Return Loss POUT = 34 dBm average VCC1 = 5 V VCC2 = VCC3 = 18 V VCC1 = 5 V, Pout = 34 dBm average 29.9 29 84 60 115 38.6 86 146 95 dB mA mA mA 1 2 dB 11 dBm % dB −43 dBc −37 dBc 5 750 nS pS dB °C/W Second Harmonic Third Harmonic Group delay Group delay ripple |S12|-|S21| Thermal Resistance, θjc (1) POUT = 34 dBm average Pulsed, 10 µsec width, 1 msec period POUT = 34 dBm average POUT = 34 dBm average POUT = 34 dBm at f0 with WCDMA, 3.84 MHz IBW POUT = 34 dBm at f0 with WCDMA, 3.84 MHz IBW 41 30 13 15 (junction to case), TCASE = 90°C 14.8 Notes: 1. Measured carrier amplifier junction to package backside. Datasheet: Rev B 08-14-13 © 2013 TriQuint - 3 of 9 - Disclaimer: Subject to change without notice www.triquint.com TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module PC Board Layout and Evaluation Board Diagram Driver Vcc Line width test 30/40/50 mils PA EN R2 C3 C4 R1 C1 C2 TGA245X - EVB AE EVB1-CH-T-1-20 TACONIC RF35A2 20 MIL C5 Bill of Material − TGA2450-SM-PCB Evaluation Board Reference Des. Value Description Manuf. Part Number Connector n/a N-type Connector R2 0Ω Jumper 1206 0 ohm resistor R1 10 kΩ Resistor 1206 10K resistor 33 pF Capacitor ATC 0603 600S 33pF capacitor 10 µF Capacitor TDK 2220 X7R 10uF 50V C1, C2 C3, C4, C5 (1) PCB n/a Huber+Suhner Taconic RF35 A2 20 mils 23_N-50-0-16/133_NE AE EVB1 CH-T-1-20 Notes: 1. C3, C4, C5 can be replaced by 10 µF 50 V Electrolytic capacitor if it is needed. Bias-up Procedure Bias-down Procedure 1. Attach input and output loads onto evaluation board. 2. Turn on 18 V power supply VCC2, VCC3, VCC4. 3. Turn on 5 V power supply VCC1. 4. Apply RF signal. 5. Turn on RF power. 1. Turn off RF power. 2. Turn off PA EN. 3. Turn off 5 V power supply VCC1. 4. Turn off 18 V power supply VCC2, VCC3, VCC4. Datasheet: Rev B 08-14-13 © 2013 TriQuint - 4 of 9 - Disclaimer: Subject to change without notice www.triquint.com TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module Performance Plots Test conditions unless otherwise noted: VCC1 = 5 V, VCC2 = 18 V, VCC3 = 18 V, VCC4 = 18 V, ICQ1 = 60 mA, ICQ2 = 25 mA, ICQ3 = 90 mA Datasheet: Rev B 08-14-13 © 2013 TriQuint - 5 of 9 - Disclaimer: Subject to change without notice www.triquint.com TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module Performance Plots Test conditions unless otherwise noted: VCC1 = 5 V, VCC2 = 18 V, VCC3 = 18 V, VCC4 = 18 V, ICQ1 = 60 mA, ICQ2 = 25 mA, ICQ3 = 90 mA Datasheet: Rev B 08-14-13 © 2013 TriQuint - 6 of 9 - Disclaimer: Subject to change without notice www.triquint.com TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module Performance Plots Test conditions unless otherwise noted: VCC1 = 5 V, VCC2 = 18 V, VCC3 = 18 V, VCC4 = 18 V, ICQ1 = 60 mA, ICQ2 = 25 mA, ICQ3 = 90 mA Pin Configuration and Description Pin No. Label Description 1 2 3, 8, 18 4, 5, 7, 10, 12-16, 20 6 9 11 17 19 PA EN VCC1 N/C GND RF In VCC4 RF Out VCC3 VCC2 Control Voltage. See Recommended Operating Conditions on page 2. Bias Voltage for pre-driver stage. No electrical connection. Provide grounded land pads for PCB mounting integrity. Internal grounding; must be grounded on PCB. RF Output matched to 50 Ω. Bias Voltage for output stage. RF Output matched to 50 Ω. Bias Voltage for output stage. Bias Voltage for driver stage. Datasheet: Rev B 08-14-13 © 2013 TriQuint - 7 of 9 - Disclaimer: Subject to change without notice www.triquint.com TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module Package Marking and Dimensions Marking: Part number – TGA2450A Year/week/country code – YYWW CCCC Lot code – AaXXXX 3.5 BSC TERMINAL #1 IDENTIFIER A TGA2450A YYWW CCCC AaXXXX 20 TERMINAL #1 IDENTIFIER 0.3x45° 2.0 4.25 0.1 3.0 BSC 16 1 X 1 (20X) 0.1 1.8 SIDE VIEW 11.5 20 TOP VIEW 16 BOTTOM VIEW DETAIL A Notes: 1. All dimensions are in millimeters. Angles are in degrees. PCB Mounting Pattern Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. 3. Ground / thermal vias are critical for the proper performance of this device. Vias should use a 0.508 mm diameter drill and have a final plated thru diameter of 0.35 mm. Datasheet: Rev B 08-14-13 © 2013 TriQuint - 8 of 9 - Disclaimer: Subject to change without notice www.triquint.com TGA2450-SM 2100 MHz, 2.5 W, Small Cell PA Module Product Compliance Information ESD Sensitivity Ratings Solderability Compatible with both lead-free (260°C maximum reflow temperature) and tin/lead (245°C maximum reflow temperature) soldering processes. Caution! ESD-Sensitive Device Contact plating: NiPdAu ESD Rating: Value: Test: Standard: Class 1C Passes ≥ 1000 V Human Body Model (HBM) JEDEC Standard JESD22-A114 RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). MSL Rating MSL Rating: Level 3 Test: 260°C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.972.994.8465 +1.972.994.8504 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev B 08-14-13 © 2013 TriQuint - 9 of 9 - Disclaimer: Subject to change without notice www.triquint.com