ETC VSC834UB

VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Features
• 17 Input by 17 Output Crosspoint Switch
• On-Chip 50Ω Input Terminations
• 2.5Gb/s NRZ Data Bandwidth
• 50Ω Source Terminated PECL Output Drivers
• 42 Gb/s Aggregate Bandwidth
• Single 3.3V Supply
• TTL Compatible µP Interface
• 9W Maximum Power Dissipation
• Differential PECL Data Inputs
• High Performance 256-Pin BGA Package
General Description
The VSC834 is a monolithic 17x17 asynchronous crosspoint switch designed to carry broadband data
streams at up to 2.5Gb/s. The non-blocking switch core is programmed through a parallel microprocessor interface that allows random access programming of each output port. A high degree of signal integrity is maintained through the chip through fully differential signal paths.
The crosspoint function is based on a multiplexer tree architecture. Each data output is driven by a 17:1
multiplexer tree that can be programmed to one and only one of its 17 inputs, and each data input can be programmed to multiple outputs. The signal path is unregistered, so no clock is required for the data inputs. The
signal path is asynchronous, so there are no restrictions on the phase, frequency, or signal pattern at each input.
Each input channel has an activity monitor function that can be used to identify loss of activity (LOA). An interrupt pin is provided to signal LOA, after which an external controller can query the chip to determine the channel(s) on which the fault occurred.
Each output driver is a fully differential switched current driver with on-die back-terminations for maximum signal integrity. Data inputs are terminated on die through 50Ω resistors connected to VTERM.
The parallel interface uses TTL levels, and provides address, data, and control pins that are compatible with
a microprocessor-style interface. The control port provides access to all chip functions, including LOA, and
programming. Program buffering is provided to allow multiple program assignments to be queued and issued
simultaneously via a single configure command.
VSC834 Block Diagram
A0
Y0
A16
Y16
Control Logic
µP Interface
G52247-0, Rev 4.3
06/01/01
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
Internet: www.vitesse.com
Page 1
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
17x17
Switch Core
LOA
Monitor
A, AN[16:0]
17
Program Memory
Output Drivers
Figure 1: Detailed Block Diagram:
Y, YN[16:0]
Control Interface
DATA[4:0], ADDR[5:0]
ALE, CSB, WRB, RDB INTB,
MONCLK, CONFIG
Functional Description
Data Paths
All input data must be differential and biased to PECL levels. On-chip terminations are provided, with a
nominal impedance of 50Ω. All input termination resistors are tied to VTERM.
Data outputs are provided through differential current switches with on-chip terminations that produce a
PECL level output swing. The drive level of the output circuit is designed to produce standard PECL levels
when terminated in 50Ω to 2.0V. Other termination voltages are possible, such as to VCC or 1.3V, but the voltage level of the output swing will be shifted from its nominal value. The common-mode voltage of the output
swing can be adjusted using the VCOM pin. The adjustment range is not calibrated, but typically allows for
about +200mV of adjustment in the output common-mode voltage.
Output channels can be powered off in pairs if fewer than 17 outputs are required. By connecting the VEE
pin associated with a given pair of outputs to VCC, the output pairs will pull to VCC and chip power will be
reduced by roughly 200mW.
Page 2
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
Internet: www.vitesse.com
G52247-0, Rev 4.3
06/01/01
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Programming Interface
The switch core is programmed through a parallel interface circuit that allows random reads or writes to the
program memory array. The program memory array is buffered to allow multiple programming instructions to
be loaded simultaneously with the CONFIG pin. Parallel programing can be clocked at up to a 50MHz rate.
The program data is composed of two parts: output address and input address. The output address, denoted
by ADDR[5:0], specifies which output channel is to be programmed. The input address, denoted by DATA[4:0],
specifies which input port the switch slice should connect to. The format of the program data is simple binary,
where the binary value maps directly to the switch slice position and/or input port number. For example:
ADDR[5:0] (000100) / DATA[4:0] (00110) would direct output channel Y4 to connect to input channel A6. The
programming state may be verified (read back) by applying the address of the desired output and asserting
RDB. The programming state is unknown at power-on. Additional address space is provided for access to the
monitor registers (See Table 2). The microprocessor interface consists of the following signals. Levels are TTL
(see Table 6).
Table 1: Signal Table
Pin
I/O
Description
D[5:0]
B
Bidirectional data bus to transfer data to/from internal program registers
A[5:0]
I
Address bus to select internal program registers for read-write operations
ALE
I
Address Latch Enable: for use with multiplexed address/data buses. Latches the address bus internally
when low.
CSB
I
Chip Select (Active Low): assert this pin whenever the part is being read or programmed.
WRB
I
Write (Active Low): program data will be transferred to the first level internal registers on the rising
edge of this signal (when CSB is also low).
RDB
I
Read (Active Low): program data from the internal program or monitor registers will be read out on the
data bus when this signal goes low (with CSB also low).
INTB
O
Interrupt (Active Low): this signal is asserted when an LOA condition is found
CONFIG
I
Configure (Active High): assert this signal to transfer queued program information from the first-level
internal registers to the second-level registers, making the programming take effect. This signal may be
tied high to leave the second-level registers transparent so all programming will take effect
immediately. CSB must be active (low) when CONFIG is asserted. CONFIG may be tied to a highorder bit of the address bus
MONCLK
I
Monitor states are transferred to monitor registers on the rising edge of this signal. MONCLK is not
expected to exceed 3MHz.
Loss of Activity (LOA) Monitoring
The LOA function consists of an activity monitor on each input channel, connected directly to the pads.
The state of a monitor (whether or not it has been toggled by an input transition) can be observed by applying
the address (See Table 2) of the monitor register corresponding to the signal of interest and asserting RDB. Each
monitor register is four bits in length, covering the state of four inputs or outputs. There is one extra one-bit
monitor for each of the 17th input and 17th output. The state of each monitor is transferred to the register periodically on the rising edge of MONCLK, whereupon the activity monitor is clered until more activity is detected.
G52247-0, Rev 4.3
06/01/01
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
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VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
If any change in a monitor state occurs after sampling by MONCLK, an interrupt will be signalled by
asserting INTB, and the user must identify the offending channel by reading the monitor states. The interrupt
will be cleared when the corresponding activity monitor is read, but the monitor state will not be changed. If
multiple monitors have triggered the interrupt, it will persist until all the corresponding monitors have been
read.
The LOA circuitry requires a minimum signal level of 30-150 mV peak-peak to recognize an input as
active. This is required to distinguish noise on an unconnected signal (where both inputs float to the termination
voltage) from activity on a live signal. A minimum of two transitions defines activity. The threshold signal
level can be adjusted with the VHYS pin, which can set the threshold from zero to the maximum allowed input
swing. The VHYS pin will self-bias to a nomial value that will be appropriate for most applications (30-150mV
p-p input level). Although uncalibrated for nominal level, gain and linearity, the VHYS pin can be externally
set to adjust the threshold level over the entire range of the input signal, from zero to the maximum level
allowed at the input.
Table 2: Memory Map
Page 4
Address
Access
00h
R/W
Output Y0’s programmed input channel (write and then assert CONFIG to program)
01h
R/W
Output Y1’s programmed input channel
...
...
10h
R/W
Output Y16’s programmed input channel
11h
R/W
Internal output Y17’s programmed input channel
...
...
20h
R/W
Description
...
...
Internal output Y32’s programmed input channel
21h
R/O
Rx Activity monitor for inputs A0, A1,A2,A3
22h
R/O
Rx Activity monitor for inputs A4, A5,A6,A7
( Logic ‘1’=No activity)
23h
R/O
Rx Activity monitor for inputs A8, A9,A10,A11
24h
R/O
Rx Activity monitor for inputs A12, A13,A14,A15
25h
R/O
Rx Activity monitor for input A16
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
Internet: www.vitesse.com
G52247-0, Rev 4.3
06/01/01
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
AC Characteristics
Table 3: Data Path
Parameter
Description
FRATE
Data rate
TISKW
Input channel delay skew(1)
Min
Typ
Max
Units
2.5
Gb/s
300
(2)
ps
TOSKW
Output channel delay skew
tR, tF
High-speed input rise/fall times, 20% to 80%(3)
300
ps
tR, tF
High-speed output rise/fall times, 20% to 80%
150
ps
tjP
Output data eye jitter, peak-peak, 223 PRBS(4)
100
ps
150
ps
Note: Unless otherwise stated, all specifications are guaranteed but not tested.
Note 1: Skew between any two input channels to a given output.
Note 2: Skew between any two output channels from the same input channel.
Note 3: Required for high-speed output rise/fall spec at FRATE = 2.5Gb/s. For lower rate signals, use 0.375/FRATE
Note 4: Broadband jitter added to a jitter-free signal; jitter is primarily in the form of ISI for random data
Figure 2: Interrupt Timing (Change in Monitor State Registers)
MONCLK
Monitor State
Monitor State Reg
INTB
CSB
RDB
TsRDB
ThRDB
ADDR[5:0]
TtsDATA
DATA[4:0]
Figure 3: Interrupt Timing (No Change in Monitor State Registers)
MONCLK
Monitor State
Monitor State Reg
INTB
G52247-0, Rev 4.3
06/01/01
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
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VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Figure 4: Program Timing
ADDR[5:0]
DATA[4:0]
CSB
TsCSB
WRB
TsWRB
ThWRB
RDB
TsCONFIG
CONFIG
Table 4: Programing Port Interface Timing
Parameter
Description
Min
Max
Units
Tconfig
Switch configuration delay
6
ns
TpdADDR
Data read propagation delay from ADDR
30
ns
TpdRDB
Data read propagation delay from RDB(1)
7
ns
Tpdint
Interrupt propagation delay from MONCLK(2)
50
ns
Tpdstate
MONCLK to internal state register change delay(2)
TsRDB
ADDR to RDB setup time
5
ns
ThRDB
RDB to ADDR hold time
3
ns
TsWRB
WRB setup time (for either ADDR or DATA)
5
ns
ThWRB
WRB hold time (for either ADDR or DATA)
3
ns
TsCONFIG
WRB to CONFIG setup time
1
ns
TsCSB
CSB setup time (to either WRB or RDB)
0
ns
TpwCONFIG
CONFIG pulse width (high)
10
ns
TpwWRB
WRB pulse width (low and high)
10
ns
TpwRDB
RDB pulse width (low and high)
10
ns
TtsDATA
DATA tri-state delay (from either RDB or CSB)(2)
TsALE
ALE setup time (for multiplexed ADDR/DATA bus)
6
10
5
ns
ns
ns
Note 1: Measured from falling edge.
Note 2: Measured from rising edge.
Page 6
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G52247-0, Rev 4.3
06/01/01
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
DC Characteristics
All characteristics are over the specified operating conditions.
Table 5: Power
Parameter
Description
ICC
VCC supply current
Min
Typ
(1)
Max
Units
2600
mA
PT
Total chip power (VCC = 3.45V and +85ºC case)
9
W
ITERM-V
VTERM supply current with VTERM =VCC-1.3V
~0
mA
ITERM-E
VTERM supply current with VTERM =VCC-2.0V
-600
mA
Max
Units
Conditions
NOTE: ICC specified with outputs terminated with 50Ω to +2.0V and chip VTERM=+2.0V.
Table 6: Control Port Input Levels
Parameter
Description
Min
VVCOM
VCOM bias voltage (L and R)
VVHYS
VHYS bias voltage
VIH
Input HIGH voltage (TTL)
2.0
VIL
Input LOW voltage (TTL)
0
IIH
Input HIGH current (TTL)
IIL
Input LOW current (TTL)
IOZ
Tristate output current (TTL)
Typ
2.0
1.65
3.5
-100
Conditions
V
VCC=3.3V
V
VCC=3.3V
V
0.8
V
500
µA
VIN = 2.4V
-500
µA
VIN = 0.5V
100
µA
VOUT = 0.4V-2.4V
Max
Units
Table 7: Data Input Levels (Differential PECL)
Parameter
Description
Min
Typ
VID
Input differential voltage
200
1000
mV
VICM
Input common-mode voltage
1.8
2.2
V
Max
Units
Conditions
VCC=3.3V
Table 8: Data Output Levels (Differential PECL)
Parameter
Description
Min
Typ
Conditions
VOD
Output differential voltage
600
1000
mV
See Note 1
VOCM
Output common-mode voltage
1.8
2.2
V
See Note 1
NOTE: (1) Nominal PECL mode, VCC=VCCP=3.3V, VEE=0, terminated 50Ω to +2.0V.
G52247-0, Rev 4.3
06/01/01
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
Internet: www.vitesse.com
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VITESSE
SEMICONDUCTOR CORPORATION
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
Data Sheet
VSC834
Absolute Maximum Ratings(1)
Power Supply Voltage (VCC) Potential to GND ..............................................................................-0.5V to +4.0V
TTL Input Voltage Applied ....................................................................................................-0.5V to VCC +0.5V
ECL Input Voltage Applied ....................................................................................................-0.5V to VCC +0.5V
Output Current (IOUT) .................................................................................................................................... 50mA
Input Current (IIN)........................................................................................................................................ ±50mA
VTERM Current (ITERM) ............................................................................................................................. ±800mA
Case Temperature Under Bias (TC) .............................................................................................. -55oC to +125oC
Storage Temperature (TSTG) ........................................................................................................ -65oC to +150oC
NOTE: (1) Caution: Stresses listed under “Absolute Maximum Ratings” may be applied to devices one at a time without causing
permanent damage. Functionality at or exceeding the values listed is not implied. Exposure to these values for extended
periods may affect device reliability.
Recommended Operating Conditions
Supply voltage (VEE) .......................................................................................................................................... 0V
Supply voltage (VCC).............................................................................................................................+3.3V ±5%
Supply voltage (VCCP) ...........................................................................................................................+3.3V ±5%
Termination voltage (VTERM)..................................................................................................................VCC -1.3V
Case Temperature Operating Range (T)........................................................................................... 0oC to +85oC
ESD Ratings
Proper ESD procedures should be used when handling this product. The VSC834 is rated to the following
ESD voltages based on the human body model:
1. All pins are rated at or above 1000V.
Page 8
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G52247-0, Rev 4.3
06/01/01
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
I/O Equivalent Circuits
VCC
VCC
VTERM
VCC
15Ω
VCC
50Ω
50Ω
Pad
VCC
50Ω
Pad
Pad
iSIG
PECL Output Equivalent Circuit
PECL Input Equivalent Circuit
VCC
VCC
VCC
1.3kΩ
(On-die bias network)
Pad
iSIG
VCC
5kΩ
25kΩ
(On-die bias network)
Pad
2kΩ
5kΩ
VEE
VCOM (L or R) Input
Equivalent Circuit
G52247-0, Rev 4.3
06/01/01
VEE
VHYS (C or L) Input
Equivalent Circuit
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VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Package Pin Descriptions
The VSC834 is packaged in a 27x27mm 256 pin ball grid array package. The 256 BGA package is thermally enhanced and carries the high-speed signals over controlled impedance lines from the solder ball to the
circuit die. The following sections describe the pinout and mechanical details of the VSC834.
Figure 5: Functional Pinout Floorplan
Programming
Interface
A0 A2 A4
A16
I/P LOA and Termination
Y0
Control Logic
17:1 Switch Slice Pair
17:1 Switch Slice Pair
Y2
Y16
Y1
17:1 Switch Slice Pair
17:1 Switch Slice Pair
Y3
17:1 Switch Slice Pair
Y15
17:1 Switch Slice Pair
Control Logic
I/P LOA and Termination
A1 A3 A5
Page 10
A15
Programming
Interface
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
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G52247-0, Rev 4.3
06/01/01
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Figure 6: Pinout Diagram
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
BALL
GRID
INDEX
ALE MONCLK
A0
A6
A12
A
ADR0 ADR3
B
ADR2 ADR4
C
A2
A4
A8
A10
A14
A16
ADR1 ADR5
D
E
F
VCC
Y0
G
Y2
Y1
Y4
VEE
Y3
Y6
VTERM
Y5
H
J
Y7
K
L
Y8
BOTTOM VIEW
Y10
Y9
Y12
M
Y11
Y14
N
Y13
Y16
Y15
P
R
T
D2
VCOML
INTB
U
A3
A5
A9
A11
A15
D1
D0
VHYS
VCOMR
V
D3
RDB CONFIG
W
D5
A1
G52247-0, Rev 4.3
06/01/01
A7
D4
WRB
CSB
A13
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Y
Page 11
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Table 9: Pin Identification
Signal
Name
Pin
Function
Level
High Speed Data Inputs
A0, NA0
A15, A14
Data Input
PECL
A1, NA1
Y15, Y14
Data Input
PECL
A2, NA2
D14, C14
Data Input
PECL
A3, NA3
U14, V14
Data Input
PECL
A4, NA4
C13, D13
Data Input
PECL
A5, NA5
V13, U13
Data Input
PECL
A6, NA6
A13, A12
Data Input
PECL
A7, NA7
Y13, Y12
Data Input
PECL
A8, NA8
D12, C12
Data Input
PECL
A9, NA9
U12, V12
Data Input
PECL
A10, NA10
C11, D11
Data Input
PECL
A11, NA11
V11, U11
Data Input
PECL
A12, NA12
A11, A10
Data Input
PECL
A13, NA13
Y11, Y10
Data Input
PECL
A14, NA14
D10, C10
Data Input
PECL
A15, NA15
U10, V10
Data Input
PECL
A16, NA16
C9, D9
Data Input
PECL
G18, G17
Data Output
PECL
Y1, YN1
G1, H1
Data Output
PECL
Y2, YN2
G20, H20
Data Output
PECL
Y3, YN3
H4, H3
Data Output
PECL
Y4, YN4
H17, H18
Data Output
PECL
Y5, YN5
J3, J4
Data Output
PECL
Y6, YN6
J18, J17
Data Output
PECL
Y7, YN7
J1, K1
Data Output
PECL
Y8, YN8
L20, M20
Data Output
PECL
Y9, YN9
M4, M3
Data Output
PECL
Y10, YN10
M17, M18
Data Output
PECL
Y11, YN11
N3, N4
Data Output
PECL
Y12, YN12
N18, N17
Data Output
PECL
High Speed Data Outputs
Y0, YN0
Y13, YN13
N1, P1
Data Output
PECL
Y14, YN14
N20, P20
Data Output
PECL
Y15, YN15
P4, P3
Data Output
PECL
Page 12
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G52247-0, Rev 4.3
06/01/01
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Table 9: Pin Identification
Signal
Name
Pin
Function
Level
Y16, YN16
P17, P18
Data Output
PECL
Programming Port
ADR0
B8
Program data address
TTL
ADR1
D8
Program data address
TTL
ADR2
C8
Program data address
TTL
ADR3
B7
Program data address
TTL
ADR4
C7
Program data address
TTL
ADR5
D7
Program data address
TTL
D0
V7
Program data
TTL
D1
V8
Program data
TTL
D2
U8
Program data
TTL
D3
W8
Program data
TTL
D4
Y8
Program data
TTL
D5
Y9
Program data
TTL
ALE
A7
Address latch enable (active high)
TTL
INTB
U7
Interrupt (active low)
TTL
RDB
W7
Read enable (active low)
TTL
WRB
Y7
Write enable (active low)
TTL
CONFIG
W6
Configuration strobe (active high)
TTL
CSB
Y6
Chip select (active low)
TTL
MONCLK
A6
Loss of activity monitor clock (active high)
TTL
Power Supplies
VCC
G52247-0, Rev 4.3
06/01/01
A1, A2, A3, A4, A5, A16, A17, A18,
A19, A20, B1, B2, B3, B4, B5, B15, B16,
B17, B18, B19, B20, C1, C2, C3, C4, C5,
C6, C16, C17, C18, C19, C20, D1, D2,
D3, D4, D5, D16, D17, D18, D19, D20,
E1, E2, E3, E4, E17, E18, E19, E20, F1,
F2, F3, F4, F19, F20, G3, G4, G19, H2,
J20, K2, K3, K4, K17, K18, K19, K20,
L1, L2, L3, L4, L17, L18, L19, M1, P2,
R1, R2, R4, R17, R18, R20, T1, T2, T3,
T4, T17, T18, T19, T20, U1, U2, U3, U4,
U16, U17, U18, U19, U20, V1, V2, V3,
V4, V16, V17, V18, V19, V20, W1, W2,
W3, W4, W5, W16, W17, W18, W19,
W20, Y1, Y2, Y3, Y4, Y5, Y16, Y17,
Y18, Y19, Y20
Power
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
Internet: www.vitesse.com
+3.3V
Page 13
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Table 9: Pin Identification
Signal
Name
Pin
Function
Level
VEE
A8, A9, B6, B10, B11, B13, B14, C15,
D6, D15, F18, M19, R3, U5, U6, U9, V9,
V15, W10, W11, W13, W14, W15
Power
GND
VEE
H19
Power for output channels 0, 2
GND
VEE
G2
Power for output channels 1, 3
GND
VEE
J19
Power for output channels 4, 6
GND
VEE
J2
Power for output channels 5, 7
GND
VEE
N19
Power for output channels 8, 10
GND
VEE
M2
Power for output channels 9, 11
GND
VEE
P19
Power for output channels 12, 14
GND
VEE
N2
Power for output channels 13, 15
GND
VEE
R19
Power for output channel 16
GND
VTERM
B9, B12, F17, W9, W12
Termination power
+2.0V
Slicing level for Y0 - YN16 (even)
ANALOG
Miscellaneous
Page 14
VCOML
U15
VCOMR
V5
Slicing level for Y1 - YN15 (odd)
ANALOG
VHYS
V6
Loss of activity hysterisis threshold
ANALOG
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
Internet: www.vitesse.com
G52247-0, Rev 4.3
06/01/01
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Package Information
27mm 256 BGA Package Drawing
g
BOTTOM VIEW
10
e
19 17 15 13 11 9 7 5 3 1
20 18 16 14 12 10 8 6 4 2
DETAIL B
A
C
E
e
B
g
D
F
G
J
H
K
E1
0.30 S C A S B S
b
L
M
N
P
R
T
U
V
W
Y
0.10 S C
4
0.10
D
-A-
CORNER
DETAIL B
-B-
D1
11
A1
c
F
A
TOP VIEW
//
P
ccc
C
E
-C-
5
6
aaa C
45 DEGREE 0.5MM CHAMFER (4 PLCS)
DIMENSIONAL REFERENCES
NOM.
MAX.
REF.
MIN.
1.65
1.80
A
1.95
0.70
0.65
A1
0.60
26.80
27.00
27.20
D
24.13 (BSC.)
D1
26.80
27.00
27.20
E
24.13 (BSC.)
E1
0.65
0.75
0.85
b
c
1.15
1.25
1.05
20
M
256
N
aaa
0.25
ccc
0.25
e
1.27 TYP.
0.15
P
g
0.40
0.50
F
G52247-0, Rev 4.3
06/01/01
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. "e" REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
3. "M" REPRESENTS THE BASIC SOLDER BALL MATRIX SIZE,
AND SYMBOL "N" IS THE MAXIMUM ALLOWABLE NUMBER OF
BALLS AFTER DEPOPULATING.
4. "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER
PARALLEL TO PRIMARY DATUM -C- .
5.
DIMENSION "aaa" IS MEASURED PARALLEL TO PRIMARY DATUM -C- .
6. PRIMARY DATUM -C- AND SEATING PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
7. PACKAGE SURFACE SHALL BE BLACK OXIDE.
8. CAVITY DEPTH VARIOUS WITH DIE THICKNESS
9. SUBSTRATE MATERIAL BASE IS COPPER.
10. BILATERAL TOLENANCE ZONE IS APPLIED TO EACH SIDE OF PACKAGE BODY
11. 45 DEG 0.5 mm CHAMFER CORNER AND WHITE DOT FOR PIN 1 IDENTIFICATION.
12. DIMENSION F IS THE MAX. ENCAP. HEIGHT
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
Internet: www.vitesse.com
Page 15
VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Ordering Information
The order number for this product is formed by a combination of the device number, and package type.
VSC834
Device Type
2.5Gb/s 17x17 Crosspoint Switch with
Input Signal Activity (ISA) Monitoring
XX
Package Style
UB: 256-pin BGA package
Notice
Vitesse Semiconductor Corporation (“Vitesse”) provides this document for informational purposes only. All information in this document, including descriptions of features, functions, performance, technical specifications and availability, is subject to change without notice at any time. Nothing contained in this document shall be construed as extending any warranty or promise, express or implied, that any Vitesse product will be
available as described or will be suitable for or will accomplish any particular task.
Vitesse products are not intended for use in life support appliances, devices or systems. Use of a Vitesse product in such applications without written consent is prohibited.
Page 16
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: [email protected]
Internet: www.vitesse.com
G52247-0, Rev 4.3
06/01/01