ETC 74ALVC16373/D

74ALVC16373
Low-Voltage 1.8/2.5/3.3 V
16-Bit Transparent Latch
With 3.6 V–Tolerant Inputs and Outputs
(3–State, Non–Inverting)
The 74ALVC16373 is an advanced performance, non–inverting
16–bit transparent latch. It is designed for very high–speed, very
low–power operation in 1.8 V, 2.5 V or 3.3 V systems. The
ALVC16373 is byte controlled, with each byte functioning identically,
but independently. Each byte has separate Output Enable and Latch
Enable inputs. These control pins can be tied together for full 16–bit
operation.
The 74ALVC16373 contains 16 D–type latches with 3–state
3.6 V–tolerant outputs. When the Latch Enable (LEn) inputs are
HIGH, data on the Dn inputs enters the latches. In this condition, the
latches are transparent, (a latch output will change state each time its D
input changes). When LE is LOW, the latch stores the information that
was present on the D inputs a setup time preceding the
HIGH–to–LOW transition of LE. The 3–state outputs are controlled
by the Output Enable (OEn) inputs. When OE is LOW, the outputs are
enabled. When OE is HIGH, the standard outputs are in the high
impedance state, but this does not interfere with new data entering into
the latches.
• Designed for Low Voltage Operation: VCC = 1.65–3.6 V
• 3.6V Tolerant Inputs and Outputs
• High Speed Operation: 3.6 ns max for 3.0 to 3.6 V
•
•
•
•
•
•
•
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MARKING DIAGRAM
48
48
74ALVC16373DT
1
AWLYYWW
TSSOP–48
DT SUFFIX
CASE 1201
A
WL
YY
WW
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
PIN NAMES
4.5 ns max for 2.3 to 2.7 V
6.8 ns max for 1.65 to 1.95 V
Static Drive: ±24 mA Drive at 3.0 V
±12 mA Drive at 2.3 V
±4 mA Drive at 1.65 V
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0 V†
Near Zero Static Supply Current in All Three Logic States (40 A)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds ±250 mA @ 125°C
ESD Performance: Human Body Model >2000 V; Machine Model
>200 V
Second Source to Industry Standard 74ALVC16373
Pins
Function
OEn
LEn
D0–D15
O0–O15
Output Enable Inputs
Latch Enable Inputs
Inputs
Outputs
ORDERING INFORMATION
Device
Package
Shipping
74ALVC16373DTR
TSSOP
2500/Tape & Reel
†To ensure the outputs activate in the 3–state condition, the output enable pins
should be connected to VCC through a pull–up resistor. The value of the resistor is
determined by the current sinking capability of the output connected to the OE pin.
 Semiconductor Components Industries, LLC, 2002
July, 2002 – Rev. 0
1
Publication Order Number:
74ALVC16373/D
74ALVC16373
OE1 1
O0 2
48 LE1
47 D0
O1 3
GND 4
O2 5
46 D1
45 GND
OE1
LE1
D0
44 D2
43 D3
O3 6
VCC 7
42 VCC
41 D4
O4 8
O5 9
40 D5
39 GND
GND 10
O6 11
38 D6
37 D7
O7 12
O8 13
36 D8
35 D9
O9 14
GND 15
O10 16
34 GND
33 D10
O11 17
VCC 18
32 D11
31 VCC
O12 19
O13 20
30 D12
29 D13
GND 21
O14 22
28 GND
27 D14
O15 23
OE2 24
26 D15
25 LE2
D1
D2
D3
D4
D5
D6
D7
1
OE2
48
LE2
nLE
47
D
nLE
46
D
nLE
44
D
nLE
43
D
nLE
41
D
nLE
40
D
nLE
38
D
nLE
37
Figure 1. 48–Lead Pinout
(Top View)
D
2
Q
3
Q
5
Q
6
Q
8
Q
9
Q
11
Q
12
Q
O0
24
25
36
D8
O1
35
D9
O2
33
D10
O3
32
D11
O4
30
D12
O5
29
D13
O6
27
D14
O7
26
D15
nLE
D
nLE
D
nLE
D
nLE
D
nLE
D
nLE
D
nLE
D
nLE
D
13
Q
14
Q
16
Q
17
Q
19
Q
20
Q
22
Q
23
Q
O8
O9
O10
O11
O12
O13
O14
O15
Figure 2. Logic Diagram
1
OE1 48
LE1 25
LE2 24
OE2
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
EN1
EN2
EN3
EN4
1
1∇
1
2∇
1
3∇
1
4∇
2
3
5
6
8
9
11
12
13
14
16
17
19
20
22
23
O0
O1
O2
O3
O4
O5
O6
O7
O8
O9
O10
O11
O12
O13
O14
O15
Figure 3. IEC Logic Diagram
Inputs
Outputs
Inputs
Outputs
LE1
OE1
D0:7
O0:7
LE2
OE2
D8:15
O8:15
X
H
X
Z
X
H
X
Z
H
L
L
L
H
L
L
L
H
L
H
H
H
L
H
H
L.
L
X
O0
L
L
X
O0
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions Are Acceptable, for
ICC reasons, DO NOT FLOAT Inputs. O0 = No Change.
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2
74ALVC16373
MAXIMUM RATINGS (Note 1)
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
0.5 to 4.6
V
VI
DC Input Voltage
0.5 to 4.6
V
VO
DC Output Voltage
0.5 to 4.6
V
IIK
DC Input Diode Current
VI < GND
50
mA
IOK
DC Output Diode Current
VO < GND
50
mA
IO
DC Output Sink/Source Current
50
mA
ICC
DC Supply Current per Supply Pin
100
mA
IGND
DC Ground Current per Ground Pin
100
mA
TSTG
Storage Temperature Range
65 to 150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
JA
Thermal Resistance (Note 2)
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
2000
200
N/A
V
ILATCH–UP
Latch–Up Performance
Above VCC and Below GND at 125°C (Note 6)
250
mA
260
°C
150
°C
90
°C/W
Level 1
Oxygen Index: 30% – 35%
UL–94 V–0 @ 0.125 in
Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
1. IO absolute maximum rating must be observed.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow.
3. Tested to EIA/JESD22–A114–A.
4. Tested to EIA/JESD22–A115–A.
5. Tested to JESD22–C101–A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Typ
Max
Unit
Operating
Data Retention Only
1.65
1.2
3.3
3.3
3.6
3.6
V
(Note 7)
–0.5
3.6
V
0
0
VCC
3.6
V
–40
+85
°C
0
0
20
10
ns/V
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free–Air Temperature
t/V
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
(Active State)
(3–State)
7. Unused inputs may not be left open. All inputs must be tied to a high–logic voltage level or a low–logic input voltage level.
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3
74ALVC16373
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C
Symbol
VIH
VIL
VOH
VOL
Characteristic
HIGH Level Input Voltage (Note 8)
LOW Level Input Voltage (Note 8)
HIGH Level Output Voltage
LOW Level Output Voltage
Condition
Min
1.65 V ≤ VCC < 2.3 V
0.65 x VCC
2.3 V ≤ VCC ≤ 2.7 V
1.7
2.7 V < VCC ≤ 3.6 V
2.0
Max
V
1.65 V ≤ VCC < 2.3 V
0.35 x VCC
2.3 V ≤ VCC ≤ 2.7 V
0.7
2.7 V < VCC ≤ 3.6 V
0.8
1.65 V ≤ VCC ≤ 3.6 V; IOH = –100 A
VCC – 0.2
VCC = 1.65 V; IOH = –4 mA
1.2
VCC = 2.3 V; IOH = –6 mA
2.0
VCC = 2.3 V; IOH = –12 mA
1.7
VCC = 2.7 V; IOH = –12 mA
2.2
VCC = 3.0 V; IOH = –12 mA
2.4
VCC = 3.0 V; IOH = –24 mA
2.0
Unit
V
V
1.65 V ≤ VCC ≤ 3.6 V; IOL = 100 A
0.2
VCC = 1.65 V; IOL = 4 mA
0.45
VCC = 2.3 V; IOL = 6 mA
0.4
VCC = 2.3 V; IOL = 12 mA
0.7
VCC = 2.7 V; IOL = 12 mA
0.4
V
VCC = 3.0 V; IOL = 24 mA
0.55
II
Input Leakage Current
1.65 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 3.6 V
±5.0
A
IOZ
3–State Output Current
1.65 V ≤ VCC ≤ 3.6 V; 0 V ≤ VO ≤ 3.6 V;
VI = VIH or VIL
±10
A
IOFF
Power–Off Leakage Current
ICC
Quiescent Supply Current (Note 9)
ICC
Increase in ICC per Input
VCC = 0 V; VI or VO = 3.6 V
10
A
1.65 V ≤ VCC ≤ 3.6 V; VI = GND or VCC
40
A
1.65 V ≤ VCC ≤ 3.6 V; 3.6 V ≤ VI, VO ≤ 3.6 V
±40
A
2.7 V < VCC ≤ 3.6 V; VIH = VCC – 0.6 V
750
A
8. These values of VI are used to test DC electrical characteristics only.
9. Outputs disabled or 3–state only.
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4
74ALVC16373
AC CHARACTERISTICS (Note 10; tR = tF = 2.0 ns; CL = 30 pF; RL = 500 )
Limits
TA = –40°C to +85°C
VCC = 3. 0V to 3.6 V
Symbol
Parameter
VCC = 2.3 V to 2.7 V
VCC = 1.65 to 1.95 V
Waveform
Min
Max
Min
Max
Min
Max
Unit
tPLH
tPHL
Propagation Delay
Dn to On
1
1.1
1.1
3.6
3.6
1.0
1.0
4.5
4.5
1.5
1.5
6.8
6.8
ns
tPLH
tPHL
Propagation Delay
LE to On
1
1.0
1.0
3.9
3.9
1.0
1.0
4.9
4.9
1.5
1.5
7.8
7.8
ns
tPZH
tPZL
Output Enable Time to
High and Low Level
2
1.0
1.0
4.7
4.7
1.0
1.0
6.0
6.0
1.5
1.5
9.2
9.2
ns
tPHZ
tPLZ
Output Disable Time From
High and Low Level
2
1.4
1.4
4.1
4.1
1.2
1.2
5.1
5.1
1.5
1.5
6.8
6.8
ns
ts
Setup Time, High or Low Dn to LE
3
1.1
1.0
2.5
ns
th
Hold Time, High or Low Dn to LE
3
1.4
1.5
1.0
ns
tw
LE Pulse Width, High
3
3.3
3.3
4.0
ns
tOSHL
tOSLH
Output–to–Output Skew
(Note 11)
0.5
0.5
0.5
0.5
0.75
0.75
ns
10. For CL = 50 pF, add approximately 300 ps to the AC maximum specification.
11. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
Note 12
6
pF
COUT
Output Capacitance
Note 12
7
pF
CPD
Power Dissipation Capacitance
Note 12, 10 MHz
20
pF
12. VCC = 1.8, 2.5 or 3.3 V; VI = 0 V or VCC.
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5
74ALVC16373
VIH
Vm
Dn
Vm
0V
tPLH
tPHL
Vm
On
VOH
Vm
VOL
WAVEFORM 1 - PROPAGATION DELAYS
tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns
Figure 4. AC Waveforms
VIH
Vm
OEn
VIH
Dn
Vm
Vm
Vm
0V
tPZH
VOH
Vy
Vm
On
0V
ts
tPHZ
LEn
tw
Vm
On
tPLZ
≈ VCC
VIH
Vm
0V
≈ 0V
tPZL
th
tPLH, tPHL
On
VOH
Vm
Vm
VOL
Vx
VOL
WAVEFORM 3 - LE to On PROPAGATION DELAYS, LE MINIMUM
PULSE WIDTH, Dn to LE SETUP AND HOLD TIMES
tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns except when noted
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns
Figure 5. AC Waveforms
VCC
Symbol
3.3V ±0.3V
2.5V ±0.2V
1.8V ±0.15V
VIH
2.7V
VCC
VCC
Vm
1.5V
VCC/2
VCC/2
Vx
VOL + 0.3V
VOL + 0.15V
VOL + 0.15V
Vy
VOH – 0.3V
VOH – 0.15V
VOH – 0.15V
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6
74ALVC16373
VCC
PULSE
GENERATOR
RL
DUT
RT
CL
TEST
RL
SWITCH
tPLH, tPHL
Open
tPZL, tPLZ
6 V at VCC = 3.3 ±0.3 V;
VCC× 2 at VCC = 2.5 ±0.2 V; 1.8 V ±0.15 V
tPZH, tPHZ
GND
CL = 30 pF or equivalent (Includes jig and probe capacitance)
RL = 500 or equivalent
RT = ZOUT of pulse generator (typically 50 )
Figure 6. Test Circuit
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7
6V or VCC × 2
OPEN
GND
74ALVC16373
P0
K
t
P2
D
TOP
COVER
TAPE
E
A0
+
K0
SEE
NOTE 2
B1
10 PITCHES
CUMULATIVE
TOLERANCE ON
TAPE
±0.2 mm
(±0.008")
SEE NOTE 2
F
+
B0
W
+
D1
FOR COMPONENTS
2.0 mm × 1.2 mm
AND LARGER
P
EMBOSSMENT
FOR MACHINE REFERENCE
ONLY
INCLUDING DRAFT AND RADII
CONCENTRIC AROUND B0
CENTER LINES
OF CAVITY
USER DIRECTION OF FEED
*TOP COVER
TAPE THICKNESS (t1)
0.10 mm
(0.004") MAX.
R MIN.
BENDING RADIUS
10°
TAPE AND COMPONENTS
SHALL PASS AROUND RADIUS R"
WITHOUT DAMAGE
EMBOSSED
CARRIER
100 mm
(3.937")
MAXIMUM COMPONENT ROTATION
EMBOSSMENT
1 mm MAX
TYPICAL
COMPONENT CAVITY
CENTER LINE
TAPE
1 mm
(0.039") MAX
TYPICAL
COMPONENT
CENTER LINE
250 mm
(9.843")
CAMBER (TOP VIEW)
ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm
Figure 7. Carrier Tape Specifications
EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2)
Tape
Size
B1
Max
24mm
20.1mm
(0.791")
D
D1
E
F
K
P
P0
P2
R
T
W
1.5 + 0.1mm
-0.0
(0.059
+0.004" -0.0)
1.5mm
Min
(0.060")
1.75
±0.1 mm
(0.069
±0.004")
11.5
±0.10 mm
(0.453
±0.004")
11.9 mm
Max
(0.468")
16.0
±0.1 mm
(0.63
±0.004")
4.0
±0.1 mm
(0.157
±0.004")
2.0
±0.1 mm
(0.079
±0.004")
30 mm
(1.18")
0.6 mm
(0.024")
24.3 mm
(0.957")
1. Metric Dimensions Govern–English are in parentheses for reference only.
2. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity.
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74ALVC16373
t MAX
13.0 mm ±0.2 mm
(0.512" ±0.008")
1.5 mm MIN
(0.06")
A
20.2 mm MIN
(0.795")
50 mm MIN
(1.969")
FULL RADIUS
G
Figure 8. Reel Dimensions
REEL DIMENSIONS
Tape Size
A Max
G
t Max
24 mm
360 mm
(14.173")
24.4 mm + 2.0 mm, -0.0
(0.961" + 0.078", -0.00)
30.4 mm
(1.197")
DIRECTION OF FEED
BARCODE LABEL
POCKET
Figure 9. Reel Winding Direction
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9
HOLE
74ALVC16373
CAVITY
TAPE
TOP TAPE
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
TAPE LEADER
NO COMPONENTS
400 mm MIN
COMPONENTS
DIRECTION OF FEED
Figure 10. Tape Ends for Finished Goods
User Direction of Feed
Figure 11. Reel Configuration
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
K
L
G
48 Leads
Figure 12. Package Footprint
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10
F
74ALVC16373
PACKAGE DIMENSIONS
TSSOP
DT SUFFIX
CASE 1201–01
ISSUE A
48X
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
K
K1
K REF
0.12 (0.005)
M
T U
S
V
S
T U
S
J J1
48
25
0.254 (0.010)
M
SECTION N–N
B
–U–
L
N
1
24
A
–V–
PIN 1
IDENT.
N
F
DETAIL E
D
0.076 (0.003)
–T– SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
C
M
0.25 (0.010)
–W–
DETAIL E
G
H
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11
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
12.40
12.60
6.00
6.20
--1.10
0.05
0.15
0.50
0.75
0.50 BSC
0.37
--0.09
0.20
0.09
0.16
0.17
0.27
0.17
0.23
7.95
8.25
0
8
INCHES
MIN
MAX
0.488
0.496
0.236
0.244
--0.043
0.002
0.006
0.020
0.030
0.0197 BSC
0.015
--0.004
0.008
0.004
0.006
0.007
0.011
0.007
0.009
0.313
0.325
0
8
74ALVC16373
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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