ETC 74VCXH16245/D

74VCXH16245
Low-Voltage 1.8/2.5/3.3V
16-Bit Transceiver
With 3.6 V–Tolerant Inputs and Outputs
(3–State, Non–Inverting)
The 74VCXH16245 is an advanced performance, non–inverting
16–bit transceiver. It is designed for very high–speed, very low–power
operation in 1.8 V, 2.5 V or 3.3 V systems.
When operating at 2.5 V (or 1.8 V) the part is designed to tolerate
voltages it may encounter on either inputs or outputs when interfacing
to 3.3 V busses. It is guaranteed to be over–voltage tolerant to 3.6 V.
The VCXH16245 is designed with byte control. It can be operated
as two separate octals, or with the controls tied together, as a 16–bit
wide function. The Transmit/Receive (T/Rn) inputs determine the
direction of data flow through the bi–directional transceiver. Transmit
(active–HIGH) enables data from A ports to B ports; Receive
(active–LOW) enables data from B to A ports. The Output Enable
inputs (OEn), when HIGH, disable both A and B ports by placing them
in a HIGH Z condition. The data inputs include active bushold
circuitry, eliminating the need for external pull–up resistors to hold
unused or floating inputs at a valid logic state.
• Designed for Low Voltage Operation: VCC = 1.65–3.6 V
• 3.6 V Tolerant Inputs and Outputs
• High Speed Operation: 2.5 ns max for 3.0 to 3.6 V
•
•
•
•
•
•
•
3.0 ns max for 2.3 to 2.7 V
6.0 ns max for 1.65 to 1.95 V
Static Drive: ±24 mA Drive at 3.0 V
±18 mA Drive at 2.3 V
±6 mA Drive at 1.65 V
Supports Live Insertion and Withdrawal
Includes Active Bushold to Hold Unused or Floating Inputs at a Valid
Logic State
IOFF Specification Guarantees High Impedance When VCC = 0 V†
Near Zero Static Supply Current in All Three Logic States (20 µA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds ±250 mA @ 125°C
ESD Performance: Human Body Model >2000 V; Machine Model >200 V
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MARKING DIAGRAM
48
48
74VCXH16245DT
1
AWLYYWW
TSSOP–48
DT SUFFIX
CASE 1201
A
WL
YY
WW
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Package
Shipping
74VCXH16245DT
Device
TSSOP
39 / Rail
74VCXH16245DTR
TSSOP
2500 / Reel
†NOTE: To ensure the outputs activate in the 3–state condition, the output
enable pins should be connected to VCC through a pull–up resistor. The
value of the resistor is determined by the current sinking capability of the
output connected to the OE pin.
 Semiconductor Components Industries, LLC, 2001
January, 2001 – Rev. 1
1
Publication Order Number:
74VCXH16245/D
74VCXH16245
48 OE1
T/R1 1
B0 2
47 A0
B1 3
46 A1
GND 4
T/R1
1
OE1
T/R2
48
24
OE2
25
45 GND
B2 5
44 A2
B3 6
43 A3
VCC 7
42 VCC
B4 8
41 A4
B5 9
40 A5
GND 10
A0:7
B0:7
A8:15
B8:15
One of Eight
39 GND
B6 11
38 A6
B7 12
37 A7
B8 13
36 A8
B9 14
35 A9
GND 15
34 GND
B10 16
33 A10
B11 17
32 A11
VCC 18
31 VCC
B12 19
30 A12
B13 20
29 A13
GND 21
28 GND
B14 22
27 A14
B15 23
26 A15
T/R2 24
25 OE2
Figure 2. Logic Diagram
1
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
Figure 1. 48–Lead Pinout
(Top View)
PIN NAMES
Pins
Function
OEn
T/Rn
A0–A15
B0–B15
Output Enable Inputs
Transmit/Receive Inputs
Side A Inputs or 3–State Outputs
Side B Inputs or 3–State Outputs
EN1
EN2
EN3
EN4
T/R1
48
OE1
25
OE2
24
T/R2
47
1
46
1∇
2
3
5
44
43
41
1
2∇
6
8
40
9
38
11
37
36
1
3∇
12
13
35
14
33
16
32
30
1
4∇
17
19
29
20
27
22
26
23
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
Figure 3. IEC Logic Diagram
Inputs
Inputs
OE1
T/R1
L
L
L
H
O tp ts
Outputs
O tp ts
Outputs
OE2
T/R2
Bus B0:7 Data to Bus A0:7
L
L
Bus B8:15 Data to Bus A8:15
H
Bus A0:7 Data to Bus B0:7
L
H
Bus A8:15 Data to Bus B8:15
X
High Z State on A0:7, B0:7
H
X
High Z State on A8:15, B8:15
H = High Voltage Level; L = Low Voltage Level; X = High or Low Voltage Level and Transitions Are Acceptable
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2
74VCXH16245
ABSOLUTE MAXIMUM RATINGS*
Symbol
Parameter
VCC
DC Supply Voltage
VI
VO
Value
Condition
Unit
–0.5 to +4.6
V
DC Input Voltage
–0.5 ≤ VI ≤ +4.6
V
DC Output Voltage
–0.5 ≤ VO ≤ +4.6
Output in 3–State
V
–0.5 ≤ VO ≤ VCC + 0.5
Note 1.; Outputs Active
V
IIK
DC Input Diode Current
–50
VI < GND
mA
IOK
DC Output Diode Current
–50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
–65 to +150
°C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions
is not implied.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Operating
Data Retention Only
Min
Typ
Max
Unit
1.65
1.2
3.3
3.3
3.6
3.6
V
–0.3
3.6
V
0
0
VCC
3.6
V
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
IOH
HIGH Level Output Current, VCC = 3.0V – 3.6V
–24
mA
IOL
LOW Level Output Current, VCC = 3.0V – 3.6V
24
mA
IOH
HIGH Level Output Current, VCC = 2.3V – 2.7V
–18
mA
IOL
LOW Level Output Current, VCC = 2.3V – 2.7V
18
mA
IOH
HIGH Level Output Current, VCC = 1.65 – 1.95V
–6
mA
IOL
LOW Level Output Current, VCC = 1.65 – 1.95V
6
mA
TA
Operating Free–Air Temperature
–40
+85
°C
∆t/∆V
Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V, VCC = 3.0V
0
10
ns/V
(Active State)
(3–State)
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3
74VCXH16245
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C
Symbol
VIH
VIL
VOH
VOL
Condition
Min
HIGH Level Input Voltage (Note 2.)
1.65V ≤ VCC < 2.3V
0.65 x VCC
2.3V ≤ VCC ≤ 2.7V
1.6
2.7V < VCC ≤ 3.6V
2.0
LOW Level Input Voltage (Note 2.)
HIGH Level Output Voltage
LOW Level Output Voltage
II
Input Leakage Current
II(HOLD)
(
)
Minimum Bushold Input Current
II ((OD))
Minimum Bushold Over–Drive
C
Current
tN
Needed
d d tto Ch
Change St
State
t
IOZ
3–State Output Current
IOFF
Power–Off Leakage Current
ICC
Quiescent Supply Current (Note 5.)
∆ICC
2.
3.
4.
5.
Characteristic
Increase in ICC per Input
Max
V
1.65V ≤ VCC < 2.3V
0.35 x VCC
2.3V ≤ VCC ≤ 2.7V
0.7
2.7V < VCC ≤ 3.6V
0.8
1.65V ≤ VCC ≤ 3.6V; IOH = –100µA
VCC – 0.2
VCC = 1.65V; IOH = –6mA
1.25
VCC = 2.3V; IOH = –6mA
2.0
VCC = 2.3V; IOH = –12mA
1.8
VCC = 2.3V; IOH = –18mA
1.7
VCC = 2.7V; IOH = –12mA
2.2
VCC = 3.0V; IOH = –18mA
2.4
VCC = 3.0V; IOH = –24mA
2.2
0.2
VCC = 1.65V; IOL = 6mA
0.3
VCC = 2.3V; IOL = 12mA
0.4
VCC = 2.3V; IOL = 18mA
0.6
VCC = 2.7V; IOL = 12mA
0.4
VCC = 3.0V; IOL = 18mA
0.4
VCC = 3.0V; IOL = 24mA
0.55
1.65V ≤ VCC ≤ 3.6V; 0V ≤ VI ≤ 3.6V
±5.0
75
VCC = 3.0V, VIN = 2.0V
–75
VCC = 2.3V, VIN = 0.7V
45
VCC = 2.3V, VIN = 1.6V
–45
VCC = 1.65V, VIN = 0.57V
25
VCC = 1.65V, VIN = 1.07V
–25
VCC = 3.6V, (Note 3.)
450
VCC = 3.6V, (Note 4.)
–450
VCC = 2.7V, (Note 3.)
300
VCC = 2.7V, (Note 4.)
–300
VCC = 1.95V, (Note 3.)
200
VCC = 1.95V, (Note 4.)
–200
V
V
1.65V ≤ VCC ≤ 3.6V; IOL = 100µA
VCC = 3.0V, VIN = 0.8V
Unit
V
µA
µA
µA
1.65V ≤ VCC ≤ 3.6V; 0V ≤ VO ≤ 3.6V;
VI = VIH or VIL
±10
µA
VCC = 0V; VI or VO = 3.6V
10
µA
1.65V ≤ VCC ≤ 3.6V; VI = GND or VCC
20
µA
1.65V ≤ VCC ≤ 3.6V; 3.6V ≤ VI, VO ≤ 3.6V
±20
µA
2.7V < VCC ≤ 3.6V; VIH = VCC – 0.6V
750
µA
These values of VI are used to test DC electrical characteristics only.
An external driver must source at least the specified current to switch from LOW–to–HIGH.
An external driver must source at least the specified current to switch from HIGH–to–LOW.
Outputs disabled or 3–state only.
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74VCXH16245
AC CHARACTERISTICS (Note 6.; tR = tF = 2.0ns; CL = 30pF; RL = 500Ω)
Limits
TA = –40°C to +85°C
VCC = 3.0V to 3.6V
Symbol
Parameter
VCC = 2.3V to 2.7V
VCC = 1.65 to1.95V
Waveform
Min
Max
Min
Max
Min
Max
Unit
tPLH
tPHL
Propagation Delay
Input to Output
1
0.8
0.8
2.5
2.5
1.0
1.0
3.0
3.0
1.5
1.5
6.0
6.0
ns
tPZH
tPZL
Output Enable Time to
High and Low Level
2
0.8
0.8
3.8
3.8
1.0
1.0
4.9
4.9
1.5
1.5
9.3
9.3
ns
tPHZ
tPLZ
Output Disable Time From
High and Low Level
2
0.8
0.8
3.7
3.7
1.0
1.0
4.2
4.2
1.5
1.5
7.6
7.6
ns
tOSHL
tOSLH
Output–to–Output Skew
(Note 7.)
0.75
0.75
ns
0.5
0.5
0.5
0.5
6. For CL = 50pF, add approximately 300ps to the AC maximum specification.
7. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
VOLP
VOLV
VOHV
Characteristic
Condition
Typ
Unit
Dynamic LOW Peak Voltage
VCC = 1.8V, CL = 30pF, VIH = VCC, VIL = 0V
0.25
V
(Note 8.)
VCC = 2.5V, CL = 30pF, VIH = VCC, VIL = 0V
0.6
VCC = 3.3V, CL = 30pF, VIH = VCC, VIL = 0V
0.8
Dynamic LOW Valley Voltage
VCC = 1.8V, CL = 30pF, VIH = VCC, VIL = 0V
–0.25
(Note 8.)
VCC = 2.5V, CL = 30pF, VIH = VCC, VIL = 0V
–0.6
VCC = 3.3V, CL = 30pF, VIH = VCC, VIL = 0V
–0.8
Dynamic HIGH Valley Voltage
VCC = 1.8V, CL = 30pF, VIH = VCC, VIL = 0V
1.5
(Note 9.)
VCC = 2.5V, CL = 30pF, VIH = VCC, VIL = 0V
1.9
VCC = 3.3V, CL = 30pF, VIH = VCC, VIL = 0V
2.2
V
V
8. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the LOW state.
9. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the HIGH state.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
Note 10.
6
pF
COUT
Output Capacitance
Note 10.
7
pF
CPD
Power Dissipation Capacitance
Note 10., 10MHz
20
pF
10. VCC = 1.8, 2.5 or 3.3V; VI = 0V or VCC.
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5
74VCXH16245
VIH
Vm
An, Bn
Vm
tPLH
0V
tPHL
Vm
Bn, An
VOH
Vm
VOL
WAVEFORM 1 - PROPAGATION DELAYS
tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns
VIH
Vm
OEn, T/Rn
Vm
0V
tPZH
tPHZ
VOH
Vy
Vm
An, Bn
≈ 0V
tPZL
tPLZ
≈ VCC
Vm
An, Bn
Vx
VOL
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns
Figure 4. AC Waveforms
VCC
Symbol
3.3V ±0.3V
2.5V ±0.2V
1.8V ±0.15V
VIH
2.7V
VCC
VCC
Vm
1.5V
VCC/2
VCC/2
Vx
VOL + 0.3V
VOL + 0.15V
VOL + 0.15V
Vy
VOH – 0.3V
VOH – 0.15V
VOH – 0.15V
VCC
PULSE
GENERATOR
RL
DUT
RT
CL
TEST
RL
SWITCH
tPLH, tPHL
Open
tPZL, tPLZ
6V at VCC = 3.3 ±0.3V;
VCC× 2 at VCC = 2.5 ±0.2V; 1.8V ±0.15V
tPZH, tPHZ
GND
CL = 30pF or equivalent (Includes jig and probe capacitance)
RL = 500Ω or equivalent
RT = ZOUT of pulse generator (typically 50Ω)
Figure 5. Test Circuit
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6
6V or VCC × 2
OPEN
GND
74VCXH16245
VIH
Vm
An, Bn
Vm
tPLH
0V
tPHL
Vm
Bn, An
VOH
Vm
VOL
WAVEFORM 3 - PROPAGATION DELAYS
tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns
VIH
Vm
OEn, T/Rn
Vm
0V
tPZH
tPHZ
VOH
Vy
Vm
An, Bn
≈ 0V
tPZL
tPLZ
≈ VCC
Vm
An, Bn
Vx
VOL
WAVEFORM 4 - OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns
Figure 6. AC Waveforms
VCC
Symbol
3.3V ±0.3V
2.7V
VIH
2.7V
2.7V
Vm
1.5V
1.5V
Vx
VOL + 0.3V
VOL + 0.3V
Vy
VOH – 0.3V
VOH – 0.3V
VCC
PULSE
GENERATOR
RL
DUT
RT
CL
TEST
RL
SWITCH
tPLH, tPHL
Open
tPZL, tPLZ
6V at VCC = 3.3 ±0.3V;
VCC × 2 at VCC = 2.5 ±0.2V; 1.8 ±0.15V
tPZH, tPHZ
GND
CL = 50pF or equivalent (Includes jig and probe capacitance)
RL = 500Ω or equivalent
RT = ZOUT of pulse generator (typically 50Ω)
Figure 7. Test Circuit
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7
6V or VCC × 2
OPEN
GND
74VCXH16245
AC CHARACTERISTICS (tR = tF = 2.0ns; CL = 50pF; RL = 500Ω)
Limits
TA = –40°C to +85°C
VCC = 3.0V to 3.6V
Symbol
Parameter
VCC = 2.7V
Waveform
Min
Max
Max
Unit
tPLH
tPHL
Propagation Delay
Input to Output
3
1.0
1.0
3.0
3.0
Min
3.6
3.6
ns
tPZH
tPZL
Output Enable Time to
High and Low Level
4
1.0
1.0
4.4
4.4
5.4
5.4
ns
tPHZ
tPLZ
Output Disable Time From
High and Low Level
4
1.0
1.0
4.1
4.1
4.6
4.6
ns
tOSHL
tOSLH
Output–to–Output Skew
(Note 11.)
0.5
0.5
0.5
0.5
ns
11. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter
guaranteed by design.
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8
74VCXH16245
P0
K
t
P2
D
TOP
COVER
TAPE
E
A0
+
K0
SEE
NOTE 2
B1
10 PITCHES
CUMULATIVE
TOLERANCE ON
TAPE
±0.2 mm
(±0.008")
SEE NOTE 2
F
+
B0
W
+
D1
FOR COMPONENTS
2.0 mm × 1.2 mm
AND LARGER
P
EMBOSSMENT
FOR MACHINE REFERENCE
ONLY
INCLUDING DRAFT AND RADII
CONCENTRIC AROUND B0
CENTER LINES
OF CAVITY
USER DIRECTION OF FEED
*TOP COVER
TAPE THICKNESS (t1)
0.10 mm
(0.004") MAX.
R MIN.
BENDING RADIUS
10°
TAPE AND COMPONENTS
SHALL PASS AROUND RADIUS R"
WITHOUT DAMAGE
EMBOSSED
CARRIER
100 mm
(3.937")
MAXIMUM COMPONENT ROTATION
EMBOSSMENT
1 mm MAX
TYPICAL
COMPONENT CAVITY
CENTER LINE
TAPE
1 mm
(0.039") MAX
TYPICAL
COMPONENT
CENTER LINE
250 mm
(9.843")
CAMBER (TOP VIEW)
ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm
Figure 8. Carrier Tape Specifications
EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2)
Tape
Size
B1
Max
24mm
20.1mm
(0.791")
D
D1
E
F
K
P
P0
P2
R
T
W
1.5 + 0.1mm
-0.0
(0.059
+0.004" -0.0)
1.5mm
Min
(0.060")
1.75
±0.1 mm
(0.069
±0.004")
11.5
±0.10 mm
(0.453
±0.004")
11.9 mm
Max
(0.468")
16.0
±0.1 mm
(0.63
±0.004")
4.0
±0.1 mm
(0.157
±0.004")
2.0
±0.1 mm
(0.079
±0.004")
30 mm
(1.18")
0.6 mm
(0.024")
24.3 mm
(0.957")
1. Metric Dimensions Govern–English are in parentheses for reference only.
2. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity.
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9
74VCXH16245
t MAX
13.0 mm ±0.2 mm
(0.512" ±0.008")
1.5 mm MIN
(0.06")
A
20.2 mm MIN
(0.795")
50 mm MIN
(1.969")
FULL RADIUS
G
Figure 9. Reel Dimensions
REEL DIMENSIONS
Tape Size
A Max
G
t Max
24 mm
360 mm
(14.173")
24.4 mm + 2.0 mm, -0.0
(0.961" + 0.078", -0.00)
30.4 mm
(1.197")
DIRECTION OF FEED
BARCODE LABEL
POCKET
Figure 10. Reel Winding Direction
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10
HOLE
74VCXH16245
CAVITY
TAPE
TOP TAPE
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
TAPE LEADER
NO COMPONENTS
400 mm MIN
COMPONENTS
DIRECTION OF FEED
Figure 11. Tape Ends for Finished Goods
User Direction of Feed
Figure 12. Reel Configuration
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉ
ÉÉ
É
ÉÉ
É
ÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
É
ÉÉ
ÉÉÉÉ
ÉÉÉÉÉÉÉ
K
L
G
48 Leads
Figure 13. Package Footprint
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11
F
74VCXH16245
PACKAGE DIMENSIONS
TSSOP
DT SUFFIX
CASE 1201–01
ISSUE A
48X
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
K
K1
K REF
0.12 (0.005)
M
T U
S
V
S
T U
S
J J1
48
25
0.254 (0.010)
M
SECTION N–N
B
–U–
L
N
1
24
A
–V–
PIN 1
IDENT.
N
F
DETAIL E
D
0.076 (0.003)
–T– SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
C
M
0.25 (0.010)
–W–
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
12.40
12.60
6.00
6.20
--1.10
0.05
0.15
0.50
0.75
0.50 BSC
0.37
--0.09
0.20
0.09
0.16
0.17
0.27
0.17
0.23
7.95
8.25
0
8
INCHES
MIN
MAX
0.488
0.496
0.236
0.244
--0.043
0.002
0.006
0.020
0.030
0.0197 BSC
0.015
--0.004
0.008
0.004
0.006
0.007
0.011
0.007
0.009
0.313
0.325
0
8
H
G
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