fax id: 1013 CY7C185 8K x 8 Static RAM Features • High speed — 15 ns • Fast tDOE • Low active power — 715 mW • Low standby power — 220 mW • CMOS for optimum speed/power • Easy memory expansion with CE1, CE2, and OE features • TTL-compatible inputs and outputs • Automatic power-down when deselected Functional Description The CY7C185 is a high-performance CMOS static RAM organized as 8192 words by 8 bits. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE 2), and active LOW output enable (OE) and three-state drivers. This device has an automatic power-down feature (CE1 or CE2), reducing the power consumption by 70% when deselected. The CY7C185 is in a standard 300-mil-wide DIP, SOJ, or SOIC package. An active LOW write enable signal (WE) controls the writing/reading operation of the memory. When CE1 and WE inputs are both LOW and CE2 is HIGH, data on the eight data input/output pins (I/O0 through I/O7) is written into the memory location addressed by the address present on the address pins (A0 through A 12). Reading the device is accomplished by selecting the device and enabling the outputs, CE1 and OE active LOW, CE2 active HIGH, while WE remains inactive or HIGH. Under these conditions, the contents of the location addressed by the information on address pins are present on the eight data input/output pins. The input/output pins remain in a high-impedance state unless the chip is selected, outputs are enabled, and write enable (WE) is HIGH. A die coat is used to insure alpha immunity. Logic Block Diagram Pin Configurations DIP/SOJ/SOIC Top View NC A4 A5 A6 A7 A8 A9 A10 A11 A12 I/O0 I/O1 I/O2 GND I/O0 INPUT BUFFER I/O2 SENSE AMPS A1 A2 A3 A4 A5 A6 A7 A8 ROW DECODER I/O1 256 x 32 x 8 ARRAY I/O3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC WE CE2 A3 A2 A1 OE A0 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 C185–2 I/O4 I/O5 I/O6 CE1 CE2 WE COLUMN DECODER POWER DOWN I/O7 A12 A11 A10 A0 Selection A9 OE C185–1 Guide 7C185–15 15 130 40/15 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum Standby Current (mA) 7C185–20 20 110 20/15 7C185–25 25 100 20/15 7C185–35 35 100 20/15 Note: 1. For military specifications, see the CY7C185A datasheet. Cypress Semiconductor Corporation • 3901 North First Street • San Jose • CA 95134 • 408-943-2600 August 12, 1998 CY7C185 Output Current into Outputs (LOW)............................. 20 mA Maximum Ratings Static Discharge Voltage .......................................... >2001V (per MIL-STD-883, Method 3015) (Above which the useful life may be impaired. For user guidelines, not tested.) Latch-Up Current.................................................... >200 mA Storage Temperature ................................. –65°C to +150°C Operating Range Ambient Temperature with Power Applied ............................................. –55°C to +125°C Supply Voltage to Ground Potential ............... –0.5V to +7.0V Range Ambient Temperature VCC DC Voltage Applied to Outputs in High Z State ............................................ –0.5V to +7.0V Commercial 0°C to +70°C 5V ± 10% –40°C to +85°C 5V ± 10% Industrial DC Input Voltage......................................... –0.5V to +7.0V Electrical Characteristics Over the Operating Range 7C185–15 Parameter Description Test Conditions VCC = Min., IOH = –4.0 mA VCC = Min., IOL = 8.0 mA Min. Max. 2.4 7C185–20 Min. Max. 2.4 Unit VOH Output HIGH Voltage VOL Output LOW Voltage VIH Input HIGH Voltage 2.2 VCC + 0.3V VIL Input LOW Voltage –0.5 IIX Input Load Current GND ≤ VI ≤ VCC IOZ Output Leakage Current GND ≤ VI ≤ VCC, Output Disabled IOS Output Short Circuit Current VCC = Max., VOUT = GND ICC VCC Operating Supply Current VCC = Max., IOUT = 0 mA ISB1 Automatic Power-Down Current Max. VCC, CE1 ≥ VIH or CE2 ≤ VIL Min. Duty Cycle=100% 40 20 mA ISB2 Automatic Power-Down Current Max. VCC, CE1 ≥ VCC – 0.3V, or CE 2 ≤ 0.3V VIN ≥ VCC – 0.3V or VIN ≤ 0.3V 15 15 mA 0.4 0.4 V 2.2 VCC + 0.3V V 0.8 –0.5 0.8 V –5 +5 –5 +5 µA –5 +5 –5 +5 µA –300 –300 mA 130 110 mA Notes: 2. Minimum voltage is equal to –3.0V for pulse durations less than 30 ns. 3. Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds. 2 V CY7C185 Electrical Characteristics Over the Operating Range (continued) 7C185–25 Parameter Description Test Conditions Min. 7C185-35 Max. VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA VIH Input HIGH Voltage 2.2 VCC + 0.3V VIL Input LOW Voltage –0.5 IIX Input Load Current GND ≤ VI ≤ VCC IOZ Output Leakage Current GND ≤ VI ≤ VCC, Output Disabled IOS Output Short Circuit Current VCC = Max., VOUT = GND ICC VCC Operating Supply Current ISB1 ISB2 Min. 2.4 Max. Unit 2.4 0.4 V 0.4 V 2.2 VCC + 0.3V V 0.8 –0.5 0.8 V –5 +5 –5 +5 µA –5 +5 –5 +5 µA –300 –300 mA VCC = Max., IOUT = 0 mA 100 100 mA Automatic Power-Down Current Max. VCC, CE1 ≥ VIH or CE2 ≤ VIL Min. Duty Cycle=100% 20 20 mA Automatic Power-Down Current Max. VCC, CE1 ≥ VCC – 0.3V or CE2 ≤ 0.3V VIN ≥ VCC – 0.3V or VIN ≤ 0.3V 15 15 mA Capacitance Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions Max. Unit 7 pF 7 pF TA = 25°C, f = 1 MHz, VCC = 5.0V Note: 4. Tested initially and after any design or process changes that may affect these parameters. AC Test Loads and Waveforms R1 481 Ω 5V OUTPUT 30 pF INCLUDING JIG AND SCOPE Equivalent to: R1 481 Ω 5V OUTPUT R2 255Ω (a) ALL INPUT PULSES 3.0V 5 pF INCLUDING JIGAND SCOPE R2 255Ω ≤ 5 ns (b) C185–4 THÉVENIN EQUIVALENT OUTPUT 167Ω GND 10% 1.73V 3 90% 90% 10% ≤ 5 ns C185–5 CY7C185 Switching Characteristics Over the Operating Range 7C185–15 Parameter Description Min. Max. 7C185–20 Min. Max. 7C185–25 Min. Max. 7C185–35 Min. Max. Unit READ CYCLE tRC Read Cycle Time 15 20 tAA Address to Data Valid tOHA Data Hold from Address Change tACE1 CE1 LOW to Data Valid 15 20 25 35 ns tACE2 CE2 HIGH to Data Valid 15 20 25 35 ns tDOE OE LOW to Data Valid 8 9 12 15 ns tLZOE OE LOW to Low Z tHZOE OE HIGH to High Z 15 3 tLZCE1 CE1 LOW to Low Z tLZCE2 CE2 HIGH to Low Z tHZCE CE1 HIGH to High Z[6, 7] CE2 LOW to High Z tPU CE1 LOW to Power-Up CE2 to HIGH to Power-Up tPD CE1 HIGH to Power-Down CE2 LOW to Power-Down 20 5 3  25 3 0 15 5 ns 10 0 20 ns ns 3 0 20 ns 10 10 ns ns 3 3 8 0 35 10 5 3 7 ns 5 3 8 5 3 25 5 3 7 35 ns ns 20 ns WRITE CYCLE tWC Write Cycle Time 15 20 25 35 ns tSCE1 CE1 LOW to Write End 12 15 20 20 ns tSCE2 CE2 HIGH to Write End 12 15 20 20 ns tAW Address Set-Up to Write End 12 15 20 25 ns tHA Address Hold from Write End 0 0 0 0 ns tSA Address Set-Up to Write Start 0 0 0 0 ns tPWE WE Pulse Width 12 15 15 20 ns tSD Data Set-Up to Write End 8 10 10 12 ns tHD Data Hold from Write End 0 0 0 0 ns  tHZWE WE LOW to High Z tLZWE WE HIGH to Low Z 7 3 7 5 7 5 8 5 ns ns Notes: 5. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified I OL/IOH and 30-pF load capacitance. 6. t HZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady state voltage. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE1 and tLZCE2 for any given device. 8. The internal write time of the memory is defined by the overlap of CE1 LOW, CE2 HIGH, and WE LOW. All 3 signals must be active to initiate a write and either signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write. 4 CY7C185 Switching Waveforms Read Cycle No.1[9,10] tRC ADDRESS tAA tOHA DATA OUT DATA VALID PREVIOUS DATA VALID C185–6 Read Cycle No.2[11,12] tRC CE1 CE2 tACE OE OE tHZOE tDOE DATA OUT tHZCE tLZOE HIGH IMPEDANCE HIGH IMPEDANCE DATA VALID tLZCE VCC SUPPLY CURRENT tPD tPU ICC 50% 50% ISB C185–7 Write Cycle No. 1 (WE Controlled)[10,12] tWC ADDRESS tSCEI CE1 tAW WE tHA tSCE2 CE CE2 tSA tPWE OE tSD DATA I/O tHD DATA IN VALID NOTE 13 C185–8 tHZOE 9. 10. 11. 12. Device is continuously selected. OE, CE1 = VIL. CE2 = VIH. WE is HIGH for read cycle. Data I/O is High Z if OE = VIH, CE1 = VIH, WE = VIL , or CE2=VIL. The internal write time of the memory is defined by the overlap of CE1 LOW, CE2 HIGH and WE LOW. CE1 and WE must be LOW and CE2 must be HIGH to initiate write. A write can be terminated by CE1 or WE going HIGH or CE2 going LOW. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write. 13. During this period, the I/Os are in the output state and input signals should not be applied. 5 CY7C185 Switching Waveforms (continued) Write Cycle No. 2 (CE Controlled)[12,13,14] tWC ADDRESS tSCE1 CE1 tSA tSCE2 CE2 tAW tHA WE tSD tHD DATA IN VALID DATA I/O C185–9 Write Cycle No. 3 (WE Controlled, OE LOW)[12,13,14,15] tWC ADDRESS CE1 tSCE1 CE2 tSCE2 tAW tHA tSA WE tSD DATA I/O tHD DATA IN VALID NOTE 13 tLZWE tHZWE C185–10 Notes: 14. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. 15. If CE1 goes HIGH or CE2 goes LOW simultaneously with WE HIGH, the output remains in a high-impedance state. 6 CY7C185 NORMALIZED SUPPLY CURRENT vs. AMBIENT TEMPERATURE NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE 1.2 NORMALIZED I CC, I SB 1.2 I CC 0.8 0.6 0.4 0.0 4.0 4.5 5.0 I CC 0.8 0.6 0.4 V CC=5.0V V IN=5.0V 0.2 I SB 0.2 1.0 5.5 ISB 0.0 –55 6.0 NORMALIZED ACCESS TIME vs. AMBIENT TEMPERATURE NORMALIZED ACCESS TIME vs. SUPPLY VOLTAGE 1.6 1.4 1.3 NORMALIZED tAA NORMALIZED t AA 125 1.2 1.1 TA =25°C 1.0 1.4 1.2 1.0 VCC =5.0V 0.8 0.9 0.8 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) 0.6 –55 6.0 2.5 25.0 DELTA tAA (ns) 30.0 2.0 1.5 1.0 25 3.0 4.0 SUPPLY VOLTAGE (V) 80 VCC =5.0V TA =25°C 60 40 20 0 0.0 5.0 2.0 3.0 4.0 OUTPUT VOLTAGE (V) OUTPUT SINK CURRENT vs. OUTPUT VOLTAGE 140 120 100 VCC =5.0V TA =25°C 80 60 40 20 0 0.0 125 20.0 15.0 10.0 0.0 1.0 1.0 2.0 3.0 OUTPUT VOLTAGE (V) 4.0 NORMALIZED I CC vs. CYCLE TIME 1.25 VCC =4.5V TA =25°C 5.0 0.5 2.0 100 TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING 3.0 1.0 120 AMBIENT TEMPERATURE (°C) TYPICAL POWER-ON CURRENT vs. SUPPLY VOLTAGE 0.0 0.0 OUTPUT SOURCE CURRENT vs. OUTPUT VOLTAGE AMBIENT TEMPERATURE (°C) SUPPLY VOLTAGE (V) NORMALIZED I PO 25 OUTPUT SINK CURRENT (mA) 1.0 0 200 400 600 800 1000 CAPACITANCE (pF) 7 NORMALIZED I CC NORMALIZED ICC , I SB 1.4 OUTPUT SOURCE CURRENT (mA) Typical DC and AC Characteristics VCC =5.0V TA =25°C VCC =0.5V 1.00 0.75 0.50 10 20 30 CYCLE FREQUENCY (MHz) 40 CY7C185 Truth Table CE1 CE2 WE OE Input/Output Mode H X X X High Z Deselect/Power-Down X L X X High Z Deselect/Power-Down L H H L Data Out Read L H L X Data In Write L H H H High Z Deselect Address Designators Address Name Address Function Pin Number A4 X3 2 A5 X4 3 A6 X5 4 A7 X6 5 A8 X7 6 A9 Y1 7 A10 Y4 8 A11 Y3 9 A12 Y0 10 A0 Y2 21 A1 X0 23 A2 X1 24 A3 X2 25 Ordering Information Speed (ns) 15 20 25 35 Ordering Code Package Name Package Type Operating Range CY7C185–15PC P21 28-Lead (300-Mil) Molded DIP CY7C185–15SC S21 28-Lead Molded SOIC CY7C185–15VC V21 28-Lead Molded SOJ CY7C185–15VI V21 28-Lead Molded SOJ Industrial CY7C185–20PC P21 28-Lead (300-Mil) Molded DIP Commercial CY7C185–20SC S21 28-Lead Molded SOIC CY7C185–20VC V21 28-Lead Molded SOJ CY7C185–20VI V21 28-Lead Molded SOJ Industrial CY7C185–25PC P21 28-Lead (300-Mil) Molded DIP Commercial CY7C185–25SC S21 28-Lead Molded SOIC CY7C185–25VC V21 28-Lead Molded SOJ CY7C185–25VI V21 28-Lead Molded SOJ Industrial CY7C185–35PC P21 28-Lead (300-Mil) Molded DIP Commercial CY7C185–35SC S21 28-Lead Molded SOIC CY7C185–35VC V21 28-Lead Molded SOJ CY7C185–35VI V21 28-Lead Molded SOJ Document #: 38–00037–K 8 Commercial Industrial CY7C185 Package Diagrams 28-Lead (300-Mil) Molded DIP P21 51-85014-B 28-Lead (300-Mil) Molded SOIC S21 51-85026-A 9 CY7C185 Package Diagrams (continued) 28-Lead (300-Mil) Molded SOJ V21 51-85031-B © Cypress Semiconductor Corporation, 1998. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.