ETC CY7C188-35VC

CY7C188
32K x 9 Static RAM
Features
provided by an active-LOW chip enable (CE1), an active-HIGH
chip enable (CE 2), an active-LOW output enable (OE), and
three-state drivers. The device has an automatic power-down
feature that reduces power consumption by more than 75%
when deselected.
• High speed
— 15 ns
• Automatic power-down when deselected
• Low active power
— 660 mW
• Low standby power
— 140 mW
• CMOS for optimum speed/power
• TTL-compatible inputs and outputs
• Easy memory expansion with CE1, CE2, and OE
features
Writing to the device is accomplished by taking CE1 and write
enable (WE) inputs LOW and CE2 input HIGH. Data on the
nine I/O pins (I/Oo – I/O 8) is then written into the location specified on the address pins (A0 – A 14).
Reading from the device is accomplished by taking CE1 and
OE LOW while forcing WE and CE 2 HIGH. Under these conditions, the contents of the memory location specified by the
address pins will appear on the I/O pins.
Functional Description
The CY7C188 is a high-performance CMOS static RAM organized as 32,768 words by 9 bits. Easy memory expansion is
The nine input/output pins (I/O 0 – I/O8) are placed in a high-impedance state when the device is deselected (CE1 HIGH or
CE 2 LOW), the outputs are disabled (OE HIGH), or during a
write operation (CE1 LOW, CE2 HIGH, and WE LOW).
The CY7C188 is available in standard 300-mil-wide SOJs.
Logic Block Diagram
Pin Configuration
DIP/SOJ
Top View
NC
NC
A8
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
INPUT BUFFER
SENSE AMPS
I/O2
ROW DECODER
A0
A1
A2
A3
A4
A5
A6
I/O1
32K x 9
ARRAY
I/O0
I/O1
I/O2
I/O3
GND
I/O3
I/O4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
A14
CE2
WE
A13
A9
A10
A11
OE
A12
CE1
I/O8
I/O7
I/O6
I/O5
I/O4
I/O5
C188–2
I/O6
CE1
CE2
WE
OE
POWER
DOWN
I/O7
I/O8
A7
A8
A9
A 10
A 11
A 12
A 13
A 14
COLUMN
DECODER
C188–1
Selection Guide
7C188–15
7C188–20
7C188–25
7C188–35
Maximum Access Time (ns)
15
20
25
35
Maximum Operating Current (mA) Commercial
120
170
165
160
Maximum Standby Current (mA)
35
35
35
30
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134 •
408-943-2600
December 1992 - Revised May 1996
CY7C188
DC Input Voltage[1] ................................. –0.5V to VCC +0.5V
Maximum Ratings
Output Current into Outputs (LOW)............................. 20 mA
(Above which the useful life may be impaired. For user guidelines, not tested.)
Static Discharge Voltage .......................................... >2001V
(per MIL-STD-883, Method 3015)
Storage Temperature ................................. –65°C to +150°C
Latch-Up Current.................................................... >200 mA
Ambient Temperature with
Power Applied ............................................. –55°C to +125°C
Operating Range
Supply Voltage on VCC Relative to GND
(Pin 32 to Pin 16) .......................................... –0.5V to + 7.0V
DC Voltage Applied to Outputs
in High Z State[1] ....................................–0.5V to VCC + 0.5V
Range
Ambient
Temperature
VCC
Commercial
0°C to +70°C
5V ± 10%
Electrical Characteristics Over the Operating Range[2]
7C188–15
Parameter
Description
Test Conditions
Min
Max
7C188–20
Min.
2.4
Max.
2.4
7C188–25
Min.
Max.
VOH
Output HIGH
Voltage
VCC = Min.,
IOH = –4.0 mA
VOL
Output LOW
Voltage
VCC = Min.,
IOL = 8.0 mA
VIH
Input HIGH
Voltage
2.2
VCC
+ 0.3
2.2
VCC
+ 0.3
2.2
VCC
+ 0.3
VIL
Input LOW
Voltage[1]
–0.5
0.8
–0.5
0.8
–0.5
IIX
Input Load Current
–5
+5
–5
+5
IOZ
Output Leakage
Current
GND ≤ V I ≤ VCC
GND ≤ V I ≤ VCC,
Output Disabled
–5
+5
–5
+5
IOS
Output Short
Circuit Current[3]
VCC = Max.,
VOUT = GND
–300
–300
ICC
VCC Operating
Supply Current
VCC = Max.,
IOUT = 0 mA,
f = fMAX = 1/tRC
120
ISB1
Automatic CE
Power-Down
Current—
TTL Inputs
Max. V CC, CE1 ≥ VIH
or CE2 ≤ VIL,
VIN ≥ VIH or VIN ≤ VIL,
f = fMAX
ISB2
Automatic CE
Power-Down
Current
— CMOS Inputs
Max. V CC,
CE1 ≥ VCC –0.3V or
CE2 ≤ 0.3V,
VIN ≥ VCC – 0.3V
or VIN ≤ 0.3V, f = 0
0.4
2.4
0.4
7C188–35
Min.
Max.
2.4
0.4
V
0.4
V
2.2
VCC
+ 0.3
V
0.8
–0.5
0.8
V
–5
+5
–5
+5
µA
–5
+5
–5
+5
µA
–300
–300
mA
170
165
160
mA
35
35
35
30
mA
10
15
15
15
mA
Capacitance[4]
Parameter
Description
CIN: Addresses
Input Capacitance
CIN: Controls
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Notes:
1. Minimum voltage is equal to –2.0V for pulse durations less than 20 ns.
2. .See the last page of this specification for Group A subgroup testing information.
3. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
4. Tested initially and after any design or process changes that may affect these parameters.
2
Unit
Max.
Unit
6
pF
8
pF
8
pF
CY7C188
AC Test Loads and Waveforms[5, 6]
R1 481Ω
R1 481Ω
5V
5V
OUTPUT
ALLINPUTPULSES
OUTPUT
R2
255Ω
30 pF
INCLUDING
JIGAND
SCOPE
Equivalent to:
3.0V
R2
255Ω
5 pF
INCLUDING
JIGAND
SCOPE
(a)
(b)
90%
10%
90%
10%
GND
≤ 3 ns
≤ 3 ns
C188–3
C188–4
THÉ VENIN EQUIVALENT
167Ω
OUTPUT
1.73V
Switching Characteristics Over the Operating Range[2, 5]
7C188–15
Parameter
Description
Min.
Max.
7C188–20
Min.
Max.
7C188–25
Min.
Max.
7C188–35
Min.
Max.
Unit
READ CYCLE
tRC
Read Cycle Time
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE1 LOW or CE2 HIGH to Data Valid
15
20
25
35
ns
tDOE
OE LOW to Data Valid
7
9
10
16
ns
tLZOE
15
20
15
3
[7]
OE LOW to Low Z
0
OE HIGH to High Z
tLZCE
CE1 LOW or CE2 HIGH to Low Z[7]
20
3
7
3
tHZCE
CE1 HIGH or CE2 LOW to High Z
tPU
CE1 LOW or CE2 HIGH to Power-Up
tPD
CE1 HIGH or CE2 LOW to Power-Down
9
7
0
25
0
15
35
11
0
20
ns
15
3
11
ns
ns
15
0
20
ns
ns
3
3
9
ns
3
3
3
[6, 7]
35
3
0
[6,7]
tHZOE
25
ns
ns
20
ns
WRITE CYCLE[8, 9]
tWC
Write Cycle Time
15
20
25
35
ns
tSCE
CE1 LOW or CE2 HIGH to Write End
10
15
18
22
ns
tAW
Address Set-Up to Write End
10
15
20
30
ns
tHA
Address Hold from Write End
0
0
0
0
ns
tSA
Address Set-Up to Write Start
0
0
0
0
ns
tPWE
WE Pulse Width
10
15
18
22
ns
tSD
Data Set-Up to Write End
8
10
10
15
ns
tHD
Data Hold from Write End
0
0
0
0
ns
tHZWE
tLZWE
WE LOW to High Z
[6]
0
WE HIGH to Low Z
[6, 7]
3
7
0
3
3
7
0
3
11
0
3
15
ns
ns
CY7C188
Switching Characteristics Over the Operating Range[2, 5]
7C188–15
Parameter
Description
Min.
Max.
7C188–20
Min.
Max.
7C188–25
Min.
7C188–35
Max.
Min.
Max.
Unit
Notes:
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
I OL/IOH and 30-pF load capacitance.
6. t HZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
8. The internal write time of the memory is defined by the overlap of CE1, LOW, CE2 HIGH, and WE LOW. All three signals must be asserted to initiate a write and any
signal can terminate a write by being deasserted. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
9. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Switching Waveforms
Read Cycle No. 1[10,11]
tRC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
C188–5
Read Cycle No. 2 (Chip-Enable Controlled)[11,12,13]
tRC
CE1
tACE
OE
tHZOE
tHZCE
tDOE
DATA OUT
tLZOE
HIGH IMPEDANCE
HIGH
IMPEDANCE
DATA VALID
tLZCE
VCC
SUPPLY
CURRENT
tPD
tPU
ICC
50%
50%
ISB
C188–6
Write Cycle No. 1 (WE Controlled)[8,13,14,15]
4
CY7C188
Switching Waveforms (Continued)
tWC
ADDRESS
CE1
tAW
tHA
tSA
tPWE
WE
OE
tSD
DATA I/O
NOTE 16
tHD
DATA IN VALID
tHZOE
C188–7
Notes:
10. Device is continuously selected. OE, CE = VIL.
11. WE is HIGH for read cycle.
12. Address valid prior to or coincident with CE transition LOW.
13. Timing parameters are the same for all chip enable signals (CE1 and CE2), so only the timing for CE1 is shown.
14. Data I/O is high impedance if OE = VIH.
15. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.
16. During this period, the I/Os are in the output state and input signals should not be applied.
[8,13,14,15]
Write Cycle No.2 (CE Controlled)
tWC
ADDRESS
tSCE
CE1
tSA
tAW
tHA
WE
tSD
tHD
DATA IN VALID
DATA I/O
C188–8
Write Cycle No. 3 (WE Controlled, OE LOW)[9,13,15]
5
CY7C188
Switching Waveforms (Continued)
tWC
ADDRESS
CE
tAW
tHA
tSA
WE
tHD
tSD
NOTE 16
DATA I/O
DATA IN VALID
tLZWE
tHZWE
C188–9
Truth Table
CE
WE
OE
Input/Output
Mode
Power
H
X
X
High Z
Deselect/Power-Down
Standby (ISB)
L
H
L
Data Out
Read
L
L
X
Data In
Write
Active (ICC)
Active (ICC)
L
H
H
High Z
Deselect, Output Disabled
Active (ICC)
Ordering Information
Speed
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
15
CY7C188–15VC
V32
32-Lead (300-Mil) Molded SOJ
Commercial
20
CY7C188–20VC
V32
32-Lead (300-Mil) Molded SOJ
Commercial
25
CY7C188–25VC
V32
32-Lead (300-Mil) Molded SOJ
35
CY7C188–35VC
V32
32-Lead (300-Mil) Molded SOJ
MILITARY SPECIFICATIONS
Group A Subgroup Testing
DC Characteristics
DC Characteristics
Parameter
Subgroups
VOH
1, 2, 3
VOL
1, 2, 3
VIH
1, 2, 3
VIL Max.
1, 2, 3
6
Parameter
Subgroups
IIX
1, 2, 3
IOZ
1, 2, 3
ICC
1, 2, 3
ISB1
1, 2, 3
ISB2
1, 2, 3
CY7C188
Switching Characteristics
Parameter
Subgroups
READ CYCLE
tRC
7, 8, 9, 10, 11
tAA
7, 8, 9, 10, 11
tOHA
7, 8, 9, 10, 11
tACE
7, 8, 9, 10, 11
tDOE
7, 8, 9, 10, 11
WRITE CYCLE
tWC
7, 8, 9, 10, 11
tSCE
7, 8, 9, 10, 11
tAW
7, 8, 9, 10, 11
tHA
7, 8, 9, 10, 11
tSA
7, 8, 9, 10, 11
tPWE
7, 8, 9, 10, 11
tSD
7, 8, 9, 10, 11
tHD
7, 8, 9, 10, 11
Document #: 38–00220–E
Package Diagrams
32-Lead (300-Mil) Molded SOJ V32
© Cypress Semiconductor Corporation, 1996. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
CY7C188
8