Agilent 2.5 mm x 7.6 mm Rectangular LED Lamps Data Sheet HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Description The HLMP-R100, -0301, -0401, -0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. They utilize a tinted, diffused epoxy to provide high on-off contrast and a flat high intensity emitting surface. Borderless package design allows creation of uninterrupted light emitting areas. The HLMP-R100 uses a double heterojunction (DH) absorbing substrate (AS) aluminum gallium arsenide (AlGaAs) red LED chip in a light red epoxy package. This combination produces outstanding light output over a wide range of drive currents. The HLMP-0301 has a high efficiency red GaAsP on GaP LED chip in a light red epoxy package. The HLMP-0401 provides a yellow GaAsP on GaP LED chip in a yellow epoxy package. The HLMP-0504 provides a green GaP LED chip in a green epoxy package. Features • Rectangular light emitting surface • Flat high sterance emitting surface • Stackable on 2.54 mm (0.100 inch) centers • Ideal as flush mounted panel indicators • Ideal for backlighting legends • Long life: solid state reliability • Choice of 4 bright colors – DH AS AlGaAs Red – High Efficiency Red – Yellow – High Performance Green • IC compatible/low current requirements Package Dimensions 7.62 (0.300) 7.11 (0.280) 7.62 (0.300) 6.99 (0.275) 0.46 (0.018) SQ. NOMINAL CATHODE LEAD 2.54 (0.100) NOMINAL 29.21 (1.15) MIN. BOTTOM VIEW 8.00 (0.315) 7.37 (0.290) 2.54 (0.100) 2.16 (0.085) 1.27 (0.50) NOMINAL 2.54 (0.100) 2.29 (0.090) SIDE VIEW NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 3. THERE IS A MXIMUM 1° TAPER FROM BASE TO THE TOP OF LAMP. Selection Guide Color DH AlGaAs Red Red Yellow Green Part Number HLMP-R100 HLMP-R100-FG0xx HLMP-0301 HLMP-0301-C00xx HLMP-0301-DECxx HLMP-0301-CD0xx HLMP-0401 HLMP-0401-B00xx HLMP-0401-D00xx HLMP-0401-CD0xx HLMP-0401-DEBxx HLMP-0504 HLMP-0504-B00xx HLMP-0504-DECxx HLMP-0504-CD0xx HLMP-0504-C00xx Luminous Intensity Iv (mcd) at 20 mA Min. Typ. 2.1 – 5.4 17.2 2.1 – 1.3 – 2.1 6.8 1.3 4.2 3.6 – 1.4 – 3.6 – 2.2 7.2 3.6 11.4 2.6 – 1.6 – 4.2 13.4 2.6 8.4 2.6 – Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads DD: Ammo Pack, Straight Leads Color Bin Options 0: Full Color Bin Distribution B: Color Bins 2 & 3 only C: Color Bins 3 & 4 only Maximum Iv Bin Options 0: Open (No Maximum Limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Color Options 1. As AlGaAs Red 3. High Efficiency Red 4. Yellow 5. Green Package Options R,0: Rectangular 2.5 mm x 7.6 mm 2 Absolute Maximum Ratings at TA = 25°C Parameter Peak Forward Current Average Forward Current[1] DC Current[2] Power Dissipation Reverse Voltage (IR = 100 µA) Transient Forward Current[3] (10 µs Pulse) Operating Temperature Range Storage Temperature Range HLMP-R100 300 20 30 87 5 500 -20 to +100 -55 to +100 HLMP-0301 90 25 30 135 5 500 HLMP-0401 60 20 20 85 5 500 -55 to +100 -55 to +100 HLMP-0504 90 25 30 135 5 500 -20 to +100 -55 to +100 Units mA mA mA mW V mA °C Notes: 1. See Figure 5 to establish pulsed operating conditions. 2. For AlGaAs Red, Red, and Green Series derate linearly from 50°C at 0.5 mA/°C. For Yellow Series derate linearly from 50°C at 0.2 mA/°C. 3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak current beyond the peak forward current listed in the Absolute Maximum Ratings. 3 Electrical/Optical Characteristics at TA = 25°C HLMP-R100 Sym. Description 2q1/2 Included Angle Between Half Luminous Intensity Points HLMP-0301 Min. Typ. Max. Min. Typ. HLMP-0401 HLMP-0504 Max. Min. Typ. Max. Min. Typ. Test Max. Units Conditions 100 100 100 100 Deg. Note 1. Fig. 6 lP Peak Wavelength 645 635 583 565 nm Measurement at Peak ld Dominant Wavelength 637 626 585 569 nm Note 2. Dl1/2 Spectral Line Halfwidth 20 40 36 28 nm ts Speed of Response 30 90 90 500 ns C Capacitance 30 16 18 18 pF RqJ-PIN Thermal Resistance 260 260 260 260 °C/W Junction to Cathode Lead VF Forward Voltage 1.8 VR Reverse Breakdown Voltage hv Luminous Efficacy 2.2 5.0 1.9 5.0 80 2.6 2.1 2.6 5.0 145 2.2 5.0 500 595 3.0 VF = 0; f = 1 MHz V IF = 20 mA Figure 2. V IR = 100 µA lm/W Note 3. Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 1.0 TA = 25° C AlGaAs RED RELATIVE INTENSITY GREEN 0.5 YELLOW 0 500 HIGH EFFICIENCY RED 550 600 650 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. 4 700 750 70 60 HER 50 YELLOW 40 30 20 GREEN 10 0 1.0 3.0 4.0 5.0 2.0 HER, YELLOW, GREEN 1.5 1.0 AlGaAs RED 0.5 5 0 0.6 15 20 25 30 0 00 H E–1 z 2 10 100 z 1 1000 Hz 1 300 IPEAK MAX. RATIO OF MAXIMUM PEAK CURRENT TO TEMPERATURE DERATED IDC MAX. MAXIMUM DC CURRENT RAT 4 3 z tP – PULSE DURATION – µs HER, ORANGE, YELLOW, and GREEN 5 1 KH 10,000 10 9 8 7 6 Hz 1000 30 40 10000 tp – PULSE DURATION – µs AlGaAs RED Figure 5. Maximum tolerable peak current vs. peak duration (IPEAK MAX determined from temperature derated IDC MAX). 20° 10° 0° 1.0 30° 40° 0.8 50° 0.6 60° 70° 80° 90° 0.4 0.2 10° 20° 30° 40° 50° 60° 70° 80° 90° 100° Figure 6. Relative luminous intensity vs. angular displacement. 5 50 60 70 80 90 Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current. hv (300 mA) for AlGaAs Red = 0.7. 3 KH 1.0 20 ESH 1.5 10 IPEAK – PEAK CURRENT PER LED – mA EFR RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT 10 10 K IPEAK MAX. IDC MAX. AlGaAs RED 0.7 f–R z z 100 H z z 300 H z 1 KH 3 KH z 10 KH Hz 30 KH 100 K 2.0 100 0.9 0.8 0.5 Figure 3. Relative luminous intensity vs. forward current. 3.0 10 GREEN 1.0 IDC – DC CURRENT PER LED – mA 4.0 1 1.1 0.4 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. VF (300 mA) for AlGaAs Red = 2.6 volts typical. HER 1.2 0 2.0 1.3 YELLOW RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 80 IF – FORWARD CURRENT – mA 2.5 AlGaAs RED ηPEAK – RELATIVE EFFICIENCY 90 Intensity Bin Limits Color Red Bin C D E F G H I J K L M N O P Q R S T U V W X Y Z Intensity Range (mcd) Min. Max. 0.5 2.4 2.4 3.8 3.8 6.1 6.1 9.7 9.7 15.5 15.5 24.8 24.8 39.6 39.6 63.4 63.4 101.5 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0 Intensity Bin Limits, continued Intensity Range (mcd) Color Bin Min. Max. B 1.6 2.5 C 2.5 4.0 D 4.0 6.5 E 6.5 10.3 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 Yellow L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 B 1.8 2.9 C 2.9 4.7 D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 Green L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Maximum tolerance for each bin limit is ±18%. 6 Color Categories Color Green Yellow Category # 6 5 4 3 2 1 3 2 4 5 Lambda (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 593.0 Tolerance for each bin limit is ±0.5 nm. Mechanical Option Matrix Mechanical Option Code 00 01 02 DD Definition Bulk Packaging, minimum increment 500 pcs/bag Tape & Reel, crimped leads, minimum increment 1300 pcs/bag Tape & Reel, straight leads, minimum increment 1300 pcs/bag Ammo Pack, straight leads with minimum increment 2K/pack Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information. 7 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE – °C Manual Solder Dipping – – 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 7. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 8 • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Recommended PC board plated through hole sizes for LED component leads: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2001-2005 Agilent Technologies, Inc. Obsoletes 5989-3267EN November 14, 2005 5989-4265EN