ETC 2SK2329(L)|2SK2329(S)

2SK2329(L), 2SK2329(S)
Silicon N-Channel MOS FET
ADE-208-1356 (Z)
1st. Edition
Mar. 2001
Application
High speed power switching
Features
•
•
•
•
•
Low on-resistance
High speed switching
Low drive current
2.5 V gate drive device can be driven from 3 V source
Suitable for Switching regulator, DC-DC converter
Outline
DPAK-2
4
4
1
1
2
3
2 3
D
1. Gate
2. Drain
3. Source
4. Drain
G
S
2SK2329(L), 2SK2329(S)
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDSS
30
V
Gate to source voltage
VGSS
±10
V
Drain current
ID
10
A
40
A
10
A
Drain peak current
I D(pulse)*
Body to drain diode reverse drain current
I DR
2
1
Channel dissipation
Pch*
20
W
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes 1. PW ≤ 10 µs, duty cycle ≤ 1 %
2. Value at Tc = 25 °C
2
2SK2329(L), 2SK2329(S)
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Drain to source breakdown
voltage
V(BR)DSS
30
—
—
V
I D = 10 mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GSS
±10
—
—
V
I G = ±200 µA, VDS = 0
Gate to source leak current
I GSS
—
—
±10
µA
VGS = ±6.5 V, VDS = 0
Zero gate voltage drain current I DSS
—
—
100
µA
VDS = 25 V, VGS = 0
Gate to source cutoff voltage
VGS(off)
0.4
—
1.4
V
I D = 1 mA, VDS = 10 V
Static drain to source on state
resistance
RDS(on)
—
0.03
0.04
Ω
ID = 5 A
VGS = 4 V*1
—
0.04
0.06
Ω
ID = 5 A
VGS = 2.5 V*1
Forward transfer admittance
|yfs|
10
18
—
S
ID = 5 A
VDS = 10 V*1
Input capacitance
Ciss
—
1250
—
pF
VDS = 10 V
Output capacitance
Coss
—
540
—
pF
VGS = 0
Reverse transfer capacitance
Crss
—
120
—
pF
f = 1 MHz
Turn-on delay time
t d(on)
—
20
—
ns
ID = 5 A
Rise time
tr
—
145
—
ns
VGS = 4 V
Turn-off delay time
t d(off)
—
225
—
ns
RL = 2 Ω
Fall time
tf
—
125
—
ns
Body to drain diode forward
voltage
VDF
—
0.9
—
V
I F = 10 A, VGS = 0
Body to drain diode reverse
recovery time
t rr
—
100
—
ns
I F = 10 A, VGS = 0,
diF / dt = 20 A / µs
Note
1. Pulse Test
3
2SK2329(L), 2SK2329(S)
Power vs. Temperature Derating
Maximum Safe Operation Area
100
I D (A)
30
20
10
50
100
150
Case Temperature
20
200
2
1
s
Ta = 25 °C
1
2
5
10 20
50
Drain to Source Voltage V DS (V)
Typical Transfer Characteristics
(A)
2V
8
0
s
1m
20
12
4
=1
0.5
Tc (°C)
ID
16
10 V
5V
4V
2.5 V
PW
µs
0µ
0m
Op
era
s(
tio
1s
Operation in
n(
h
T
this area is
c = ot)
limited by R DS(on)
25
°C
)
5
0.1
0.5
VGS = 1.5 V
2
4
6
Drain to Source Voltage
8
10
V DS (V)
Drain Current
I D (A)
DC
10
Typical Output Characteristics
20
Drain Current
10
0.2
0
4
10
50
Drain Current
Channel Dissipation
Pch (W)
40
V DS = 10 V
Pulse Test
16
12
8
Tc = 75°C
25°C
4
0
–25°C
1
2
3
Gate to Source Voltage
5
4
V GS (V)
2SK2329(L), 2SK2329(S)
0.6
Drain to Source On State Resistance
R DS(on) ( Ω )
V DS(on) (V)
1.0
Drain to Source Voltage
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
Pulse Test
0.8
0.4
Pulse Test
0.5
0.2
0.1
VGS = 2.5 V
0.05
I D = 10 A
0.2
Static Drain to Source on State Resistance
vs. Drain Current
1
5A
2A
4V
0.02
0.01
2
4
6
Gate to Source Voltage
8
V GS (V)
Static Drain to Source on State Resistance
R DS(on) ( Ω)
Static Drain to Source on State Resistance
vs. Temperature
0.10
Pulse Test
0.08
I D = 2 A, 5 A, 10 A
0.06
2.5 V
0.04
2 A, 5 A, 10 A
0.02
0
–40
0.1 0.2
10
V GS = 4 V
0
40
80
120
160
Case Temperature Tc (°C)
0.5
1
2
5
10 20
Drain Current
Forward Transfer Admittance |yfs| (S)
0
50
20
50 100
I D (A)
Forward Transfer Admittance vs.
Drain Current
Tc = –25 °C
10
25 °C
75 °C
5
2
1
0.5
0.1
V DS = 10 V
Pulse Test
0.3
1
3
10
30
100
Drain Current I D (A)
5
2SK2329(L), 2SK2329(S)
Typical Capacitance vs.
Drain to Source Voltage
Body to Drain Diode Reverse
Recovery Time
5000
VGS = 0
f = 1 MHz
500
Capacitance C (pF)
Reverse Recovery Time trr (ns)
1000
200
100
50
10
0.2
60
12
V GS
I D = 10 A
40
8
V DS
20
4
V DD = 25 V
10 V
20
40
60
80
Gate Charge Qg (nc)
0
100
1000
20
30
40
50
Switching Characteristics
V GS = 4 V, V DD = 10 V
500 PW = 3 µs, duty < 1 %
Switching Time t (ns)
16
V DD = 10 V
25 V
10
Drain to Source Voltage V DS (V)
V GS (V)
80
Crss
0
Gate to Source Voltage
V DS (V)
Drain to Source Voltage
6
200
50
Dynamic Input Characteristics
20
Coss
500
0.5
1
2
5
10 20
Reverse Drain Current I DR (A)
100
0
Ciss
1000
100
di/dt = 20 A/µs
V GS = 0, Ta = 25°C
20
2000
t d(off)
200
tf
100
50
tr
t d(on)
20
10
0.2
0.5
1
2
Drain Current
5
10
I D (A)
20
2SK2329(L), 2SK2329(S)
Reverse Drain Current vs.
Souece to Drain Voltage
20
Reverse Drain Current I DR (A)
Pulse Test
16
12
V GS = 0, –5 V
8
5V
4
0
0.4
0.8
1.2
Source to Drain Voltage
1.6
2.0
V SD (V)
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance
γ s (t)
3
Tc = 25°C
1
0.3
0.1
0.03
D=1
0.5
0.2
0.1
0.05
θ ch – c(t) = γ s (t) • θ ch – c
θ ch – c = 6.25 °C/W, Tc = 25 °C
0.02
1
0.0
t
ho
lse
PDM
Pu
1s
D=
PW
T
PW
T
0.01
10 µ
100 µ
1m
10 m
Pulse Width
100 m
1
10
PW (S)
7
2SK2329(L), 2SK2329(S)
Switching Time Test Circuit
Waveform
Vout
Monitor
Vin Monitor
90%
D.U.T.
RL
Vin
Vin
4V
50Ω
V DD
= 10 V
Vout
10%
10%
90%
td(on)
8
tr
10%
90%
td(off)
tf
2SK2329(L), 2SK2329(S)
Package Dimensions
As of January, 2001
1.7 ± 0.5
Unit: mm
2.3 ± 0.2
0.55 ± 0.1
4.7 ± 0.5
1.2 ± 0.3
16.2 ± 0.5
1.15 ± 0.1
0.8 ± 0.1
(0.7)
3.1 ± 0.5
5.5 ± 0.5
6.5 ± 0.5
5.4 ± 0.5
0.55 ± 0.1
0.55 ± 0.1
2.29 ± 0.5
2.29 ± 0.5
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
DPAK (L)-(2)
—
—
0.42 g
9
2SK2329(L), 2SK2329(S)
As of January, 2001
2.3 ± 0.2
0.55 ± 0.1
(4.9)
(5.3)
6.5 ± 0.5
5.4 ± 0.5
1.2 Max
5.5 ± 0.5
1.7 ± 0.5
Unit: mm
0 – 0.25
2.5 ± 0.5
1.15 ± 0.1
0.8 ± 0.1
2.29 ± 0.5
0.55 ± 0.1
2.29 ± 0.5
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
10
DPAK (S)-(1),(2)
—
Conforms
0.28 g
2SK2329(L), 2SK2329(S)
As of January, 2001
(0.1)
2.3 ± 0.2
0.55 ± 0.1
(5.1)
(5.1)
(0.1)
6.5 ± 0.5
5.4 ± 0.5
1.2 Max
5.5 ± 0.5
1.5 ± 0.5
Unit: mm
0 – 0.25
2.5 ± 0.5
1.15 ± 0.1
0.8 ± 0.1
2.29 ± 0.5
0.55 ± 0.1
2.29 ± 0.5
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
DPAK (S)-(3)
—
Conforms
0.28 g
11
2SK2329(L), 2SK2329(S)
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Colophon 2.0
12