ETC AS7C3256-15TC

September 2001
AS7C256
AS7C3256
®
5V/3.3V 32K X 8 CMOS SRAM (Common I/O)
Features
• Very low power consumption: STANDBY
• AS7C256 (5V version)
• AS7C3256 (3.3V version)
• Industrial and commercial temperature
• Organization: 32,768 words × 8 bits
• High speed
- 22 mW (AS7C256) / max CMOS I/O
- 7.2 mW (AS7C3256) / max CMOS I/O
• Easy memory expansion with CE and OE inputs
• TTL-compatible, three-state I/O
• 28-pin JEDEC standard packages
- 12/15/20 ns address access time
- 6, 7, 8 ns output enable access time
- 300 mil PDIP
- 300 mil SOJ
- 8 × 13.4 mm TSOP 1
• Very low power consumption: ACTIVE
- 660mW (AS7C256) / max @ 12 ns
- 216mW (AS7C3256) / max @ 12 ns
• ESD protection ≥ 2000 volts
• Latch-up current ≥ 200 mA
Logic block diagram
Pin arrangement
28-pin TSOP 1 (8×13.4 mm)
VCC
28-pin DIP, SOJ (300 mil)
GND
256 X 128 X 8
Array
(262,144)
Sense amp
I/O7
Row decoder
A0
A1
A2
A3
A4
A5
A6
A14
I/O0
Column decoder
WE
Control
circuit
A14
A12
A7
A6
$
A4
A3
A2
A1
A0
I/O0
Note: This part is compatible with both pin numbering ,2
,2
conventions used by various manufacturers.
GND
OE
A11
A9
A8
A13
WE
VCC
A14
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
(22)
(23)
(24)
(25)
(26)
(27)
(28) AS7C256
(1) AS7C3256
(2)
(3)
(4)
(5)
(6)
(7)
(21) 28
(20) 27
(19) 26
(18) 25
(17) 24
(16) 23
(15) 22
(14) 21
(13) 20
(12) 19
(11) 18
(10) 17
(9) 16
(8) 15
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AS7C256
AS7C3256
Input buffer
VCC
WE
A13
$
$
A11
OE
A10
CE
I/O7
,2
I/O5
I/O4
,2
OE
CE
A
7
A
8
A A A A A
9 10 11 12 13
Selection guide
-12
-15
-20
Unit
Maximum address access time
12
15
20
ns
Maximum output enable access time
6
7
8
ns
AS7C256
120
115
110
mA
AS7C3256
60
55
50
mA
AS7C256
4
4
4
mA
AS7C3256
2
2
2
mA
Maximum operating current
Maximum CMOS standby current
9/18/01; v.1.6
Alliance Semiconductor
P. 1 of 9
Copyright © Alliance Semiconductor. All rights reserved.
AS7C256
AS7C3256
®
Functional description
The AS7C(3)256 is a 5V/3.3V high-performance CMOS 262,144-bit Static Random-Access Memory (SRAM) device organized
as 32,768 words × 8 bits. It is designed for memory applications requiring fast data access at low voltage, including
PentiumTM, PowerPCTM, and portable computing. Alliance’s advanced circuit design and process techniques permit 3.3V
operation without sacrificing performance or operating margins.
The device enters standby mode when CE is high. CMOS standby mode consumes ≤3.6 mW. Normal operation offers 75% power
reduction after initial access, resulting in significant power savings during CPU idle, suspend, and stretch mode.
Equal address access and cycle times (tAA, tRC, tWC) of 12/15/20 ns with output enable access times (tOE) of 6, 7, 8 ns are
ideal for high-performance applications. The chip enable (CE) input permits easy memory expansion with multiple-bank
memory organizations.
A write cycle is accomplished by asserting chip enable (CE) and write enable (WE) LOW. Data on the input pins I/O0-I/O7 is
written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive
I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting chip enable (CE) and output enable (OE) LOW, with write enable (WE) high. The
chip drives I/O pins with the data word referenced by the input address. When chip enable or output enable is high, or write
enable is low, output drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible and 5V tolerant. Operation is from a single 3.3±0.3V supply. The
AS7C(3)256A is packaged in high volume industry standard packages.
Absolute maximum ratings
Parameter
Device
Symbol
Min
Max
Unit
AS7C256
Vt1
–0.5
+7.0
V
AS7C3256
Vt1
–0.5
+5.0
V
Voltage on any pin relative to GND
Vt2
–0.5
VCC + 0.5
V
Power dissipation
PD
–
1.0
W
Voltage on VCC relative to GND
Storage temperature (plastic)
Tstg
–65
+150
oC
Ambient temperature with VCC applied
Tbias
–55
+125
o
DC current into outputs (low)
IOUT
–
20
C
mA
Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Truth table
CE
WE
OE
Data
Mode
H
X
X
High Z
Standby (ISB, ISB1)
L
H
H
High Z
Output disable (ICC)
L
H
L
DOUT
Read (ICC)
L
L
X
DIN
Write (ICC)
Key: X = Don’t care, L = Low, H = High
9/18/01; v.1.6
Alliance Semiconductor
P. 2 of 9
AS7C256
AS7C3256
®
Recommended operating conditions
Parameter
Device
Supply voltage
Input voltage
Ambient operating temperature
Symbol
Min
Typical
Max
Unit
AS7C256
VCC
4.5
5.0
5.5
V
AS7C3256
VCC
3.0
3.3
3.6
V
AS7C256
VIH
2.2
–
VCC+0.5
V
AS7C3256
VIH
2.0
–
VCC+0.5
V
—
VIL*
-0.5*
–
0.8
V
commercial
TA
0
–
70
oC
industrial
TA
–40
–
85
o
C
* V min = –2.0V for pulse width less than t /2.
IL
RC
DC operating characteristics (over the operating range)
-12
Parameter
Sym Test conditions
Input leakage
current
|ILI|
VCC = Max,
Vin = GND to VCC
Output leakage
V = Max,
|ILO| CC
current
VOUT = GND to VCC
Operating
power supply
current
Standby power
supply current
Output voltage
-15
-20
Device
Min
Max
Min
Max
Min
Max
Unit
Both
–
1
–
1
–
1
µA
Both
–
1
–
1
–
1
µA
VCC = Max, CE ≤ VIL
f = fMax, IOUT = 0mA
AS7C256
–
120
–
115
–
110
ICC
AS7C3256
–
60
–
55
–
50
ISB
VCC = Max, CE ≤ VIL
f = fMax, IOUT = 0mA
AS7C256
–
40
–
35
–
30
AS7C3256
–
20
–
20
–
20
VCC = Max, CE > VCC–0.2V
ISB1 VIN < GND + 0.2V or
VIN > VCC–0.2V, f = 0
AS7C256
–
4.0
–
4.0
–
4.0
AS7C3256
–
2.0
–
2.0
–
2.0
VOL IOL = 8 mA, VCC = Min
Both
–
0.4
–
0.4
–
0.4
V
VOH IOH = –4 mA, VCC = Min
Both
2.4
–
2.4
–
2.4
–
V
mA
mA
mA
Capacitance (f = 1MHz, Ta = room temperature, VCC = NOMINAL)
Parameter
Symbol
Signals
Test conditions
Max
Unit
Input capacitance
CIN
A, CE, WE, OE
Vin = 0V
5
pF
I/O capacitance
CI/O
I/O
Vin = Vout = 0V
7
pF
9/18/01; v.1.6
Alliance Semiconductor
P. 3 of 9
AS7C256
AS7C3256
®
Read cycle (over the operating range)
-12
-15
-20
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Unit
Notes
Read cycle time
tRC
12
–
15
–
20
–
ns
Address access time
tAA
–
12
–
15
–
20
ns
3
Chip enable (CE) access time
tACE
–
12
–
15
–
20
ns
3
Output enable (OE) access time
tOE
–
6
–
7
–
8
ns
Output hold from address change
tOH
3
–
3
–
3
–
ns
5
CE LOW to output in low Z
tCLZ
3
–
3
–
3
–
ns
4, 5
CE HIGH to output in high Z
tCHZ
–
3
–
4
–
5
ns
4, 5
OE LOW to output in low Z
tOLZ
0
–
0
–
0
–
ns
4, 5
OE HIGH to output in high Z
tOHZ
–
3
–
4
–
5
ns
4, 5
Power up time
tPU
0
–
0
–
0
–
ns
4, 5
Power down time
tPD
–
12
–
15
–
20
ns
4, 5
Key to switching waveforms
5LVLQJLQSXW
)DOOLQJLQSXW
8QGHILQHGRXWSXWGRQ¶WFDUH
Read waveform 1 (address controlled)
t5&
Address
W$$
t2+
DRXW
Data valid
Read waveform 2 (CE controlled)
t5&
&(
t2(
2(
t2/=
t2+=
t&+=
t$&(
DRXW
Data valid
t&/=
Supply
current
9/18/01; v.1.6
t38
t3'
50%
Alliance Semiconductor
I&&
I6%
50%
P. 4 of 9
AS7C256
AS7C3256
®
Write cycle (over the operating range)
-12
Parameter
-15
-20
Symbol
Min
Max
Min
Max
Min
Max
Unit
Write cycle time
tWC
12
–
15
–
20
–
ns
Chip enable to write end
tCW
8
–
10
–
12
–
ns
Address setup to write end
tAW
8
–
10
–
12
–
ns
Address setup time
tAS
0
–
0
–
0
–
ns
Write pulse width
tWP
8
–
9
–
12
–
ns
Write recovery time
tWR
0
–
0
–
0
–
ns
Address hold from end of write
tAH
0
–
0
–
0
–
ns
Data valid to write end
tDW
6
–
8
–
10
–
ns
Data hold time
tDH
0
–
0
–
0
–
ns
4, 5
Write enable to output in high Z
tWZ
–
5
–
5
–
5
ns
4, 5
Output active from write end
tOW
3
–
3
–
3
–
ns
4, 5
Write waveform 1 (WE controlled)
t:&
t$:
t$+
Address
t:5
t:3
:(
t$6
t':
DLQ
t'+
Data valid
t:=
t2:
DRXW
Write waveform 2 (CE controlled)
t:&
t$:
t$+
Address
t$6
t:5
t&:
&(
t:3
:(
t:=
DLQ
t':
t'+
Data valid
DRXW
9/18/01; v.1.6
Alliance Semiconductor
P. 5 of 9
Notes
AS7C256
AS7C3256
®
AC test conditions
-
Output load: see Figure B or Figure C.
Input pulse level: GND to 3.0V. See Figure A.
Input rise and fall times: 2 ns. See Figure A.
Input and output timing reference levels: 1.5V.
Thevenin equivalent
168Ω
DRXW
+1.72V (5V and 3.3V)
+3.3V
+5V
320Ω
480Ω
+3.0V
GND
90%
10%
90%
2 ns
Figure A: Input pulse
10%
DRXW
255Ω
C(14)
GND
Figure B: Output loDG
DRXW
350Ω
C(14)
GND
Figure C: Output load
Notes
1
2
3
4
5
6
7
8
9
10
11
12
13
During VCC power-up, a pull-up resistor to VCC on CE is required to meet ISB specification.
This parameter is sampled, but not 100% tested.
For test conditions, see AC Test Conditions, Figures A, B, C.
These parameters are specified with CL = 5pF, as in Figures B or C. Transition is measured ±500mV from steady-state voltage.
This parameter is guaranteed, but not tested.
WE is High for read cycle.
CE and OE are Low for read cycle.
Address valid prior to or coincident with CE transition Low.
All read cycle timings are referenced from the last valid address to the first transitioning address.
CE or WE must be High during address transitions. Either CE or WE asserting high terminates a write cycle.
All write cycle timings are referenced from the last valid address to the first transitioning address.
CE1 and CE2 have identical timing.
C=30pF, except on High Z and Low Z parameters, where C=5pF.
9/18/01; v.1.6
Alliance Semiconductor
P. 6 of 9
AS7C256
AS7C3256
®
Typical DC and AC characteristics
1.4
1.0
0.8
0.6
ISB
0.4
0.2
0.6
ISB
0.4
0.0
–55
MAX
Normalized access time
Ta = 25°C
1.3
1.2
1.1
1.0
0.9
0.8
MIN
NOMINAL
Supply voltage (V)
Output source current IOH
vs. output voltage VOH
140
Output sink current (mA)
VCC = VCC(NOMINAL)PL
100
Ta = 25°C
80
60
40
20
0
VCC
Output voltage (V)
9/18/01; v.1.6
0.2
-10
35
80
125
Ambient temperature (°C)
Normalized supply current ICC
vs. cycle frequency 1/tRC, 1/tWC
1.2
1.3
1.2
1.1
1.0
0.9
VCC = VCC(NOMINAL)
Ta = 25°C
1.0
0.8
0.6
0.4
0.2
0.0
–10
35
80
125
Ambient temperature (°C)
0
25
50
75
Cycle frequency (MHz)
100
Typical access time change ∆tAA
vs. output capacitive loading
Output sink current IOL
vs. output voltage VOL
35
120
30
VCC = VCC(NOMINAL)
100
Ta = 25°C
80
60
40
20
VCC = VCC(NOMINAL)
25
20
15
10
5
0
0
1
1.4
VCC = VCC(NOMINAL)
140
120
5
-55
1.4
0.8
–55
MAX
VCC = VCC(NOMINAL)
25
–10
35
80
125
Ambient temperature (°C)
Normalized access time tAA
vs. ambient temperature Ta
1.5
1.4
625
0.04
Normalized ICC
NOMINAL
Supply voltage (V)
Normalized access time tAA
vs. supply voltage VCC
1.5
Normalized access time
0.8
0.2
0.0
MIN
Output source current (mA)
ICC
1.0
Normalized supply current ISB1
vs. ambient temperature Ta
Normalized ISB1 (log scale)
1.2
ICC
Normalized ICC, ISB
Normalized ICC, ISB
1.2
Normalized supply current ICC, ISB
vs. ambient temperature Ta
Change in tAA (ns)
1.4
Normalized supply current ICC, ISB
vs. supply voltage VCC
0
0
VCC
Output voltage (V)
Alliance Semiconductor
0
250
500
750
Capacitance (pF)
P. 7 of 9
1000
AS7C256
AS7C3256
®
Package diagrams
28-pin PDIP
Min
Max
in mils
A
D
B
S
E1 E
α
L
e
A1
b
c
eA
Seating
Plane
Pin 1
'
H
3LQ
Seating
Plane
F
$
(
e
c
A2
L
pin 1(22)
A
A
A1
A2
B
b
c
D
E
E1
E2
e
0.064
0.016
0.022
0.008
0.014
-
1.400
0.295
0.320
0.278
0.298
0.100 BSC
0.330
0.370
0.120
0.140
0°
15°
-
0.055
pin 8(21)
pin 5(8)
28-pin
Note: This part is compatible with both pin numbering
conventions used by various manufacturers.
Alliance Semiconductor
-
0.140
0.025
-
0.095
0.105
0.028 TYP
0.018 TYP
0.010 TYP
-
0.730
0.245
0.285
0.295
0.305
0.327
0.347
0.050 BSC
A1
Hd
pin 1(7)
9/18/01; v.1.6
-
0.058
28-pin
8×13.4 mm
Min
Max
α
E
0.175
28-pin SOJ
Min
Max
in mils
$
$
E
D
0.010
%
( (
b
A
A1
B
b
c
D
E
E1
e
eA
L
a
S
A
A1
A2
b
c
D
e
E
Hd
L
α
–
1.20
0.10
0.20
0.95
1.05
0.15
0.25
0.10
0.20
11.60
11.80
0.55 nominal
8.0 nominal
13.30
13.50
0.50
0.70
0°
5°
P. 8 of 9
AS7C256
AS7C3256
®
Ordering information
Package / Access time
Plastic DIP, 300 mil
Plastic SOJ, 300 mil
TSOP 8x13.4mm
Volt/Temp
12 ns
15 ns
20 ns
5V commercial
AS7C256-12PC
AS7C256-15PC
AS7C256-20PC
3.3V commercial
AS7C3256-12PC
AS7C3256-15PC
AS7C3256-20PC
5V commercial
AS7C256-12JC
AS7C256-15JC
AS7C256-20JC
3.3V commercial
AS7C3256-12JC
AS7C3256-15JC
AS7C3256-20JC
5V industrial
AS7C256-12JI
AS7C256-15JI
AS7C256-20JI
3.3V industrial
AS7C3256-12JI
AS7C3256-15JI
AS7C3256-20JI
5V commercial
AS7C256-12TC
AS7C256-15TC
AS7C256-20TC
3.3V commercial
AS7C3256-12TC
AS7C3256-15TC
AS7C3256-20TC
5V industrial
AS7C256-12TI
AS7C256-15TI
AS7C256-20TI
3.3V industrial
AS7C3256-12TI
AS7C3256-15TI
AS7C3256-20TI
Part numbering system
AS7C
3
SRAM prefix
Voltage:
3 = 3.3V supply
5 = 5V supply
9/18/01; v.1.6
256
Device number
–XX
X
C or I
Access time
Packages:
P = PDIP 300 mil
J = SOJ 300 mil
T = TSOP 8x13.4mm
Temperature range:
C = 0 oC to 70 0C
I = -40C to 85C
Alliance Semiconductor
P. 9 of 9
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