FBI1.5A4S1.......FBI1.5M4S1 1.5 Amp. Glass Passivated Bridge Rectifier Voltage 50 to 1000 V. Plastic Case Dimensions in mm. 20 Current 1.5 A. 3.5 ® _ + • Glass Passivated Junction Chips. 0.8 + 0.05 4 4 4 L suffix 13.5 7 –4 • UL recognized under component index file number E130180. 0.5 1 • Lead and polarity identifications. • Mounting Instructions • Case: Molded Plastic. • High temperature soldering guaranteed: 260 ºC – 10 sc. • Ideal for printed circuit board (P.C.B.). • Recommended mounting torque: 8 Kg.cm. • The plastic material carries U/L recognition 94 V-O. Maximum Ratings, according to IEC publication No. 134 FBI1.5A FBI1.5B 4S1 4S1 FBI1.5D 4S1 FBI1.5G 4S1 FBI1.5J 4S1 FBI1.5K FBI1.5M 4S1 4S1 VRRM Peak recurrent reverse voltage (V) 50 100 200 400 600 800 1000 VRMS 35 70 140 280 420 560 700 IFSM Maximum RMS voltage (V) Max. Average forward current with heatsink without heatsink 8.3 ms. peak forward surge current I2t Rating for fusing ( t<8.3 ms.) VDIS Dielectric strength (terminals to case, AC 1 min.) Tj Operating temperature range – 55 to + 150 °C Tstg Storage temperature range – 55 to +150 ºC IF(AV) (Jedec Method) 4.0 A at 65 ºC 1.5 A at 25 ºC 50 A 10 A2 sec 1500 V Electrical Characteristics at Tamb = 25°C VF Max. forward voltage drop per element at IF = 1 A 1.0 V IR Max. reverse current per element at VRRM 5 A MAXIMUM THERMAL RESISTANCE R th (j-c) Junction-Case. With Heatsink. Rth (j-a) Junction-Ambient. Without Heatsink. 12 ºC/W 45 ºC/W Jan - 00 FBI1.5 - 4S1 Characteristic Curves TYPICAL FORWARD CHARACTERISTIC FORWARD CURRENT DERATING CURVE Tamb = 25° C 10 heatsink Tc 4 Tc _ 3 + sine wave R-load on heatsink 1.0 on glass-epoxi substrate _ 2 + P.C.B. soldering land 5 mm ø sine wave R-load free in air 0.1 1 0 0 0.6 1.0 1.4 0 VF , instantaneous forward voltage (V) 25 50 75 100 125 150 175 Tamb, ambient temperature (°C) MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 60 50 40 30 20 10 0 1 10 100 Number of cycles at 60 Hz. Jan - 00