TOSHIBA MIG50Q201H

MIG50Q201H
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
MIG50Q201H
High Power Switching Applications
Motor Control Applications
l Integrates inverter, brake power circuits & control circuits (IGBT drive units, protection units
for over−current, realtime-current-control (RTC), under−voltage & over-temperature) in one
package.
l The electrodes are isolated from case.
l High speed type IGBT
: VCE (sat) = 3.5 V (Max.)
toff = 2.6 µs (Max.)
trr = 0.21 µs (Max.)
l Outline
: 2−110A1A
l Weight
: 520 g
Equivalent Circuit
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MIG50Q201H
Maximum Ratings (Tj = 25°C )
Stage
Characteristic
Condition
Supply voltage
P-N power terminal
Collector−emitter voltage
Inverter
―
VCC
900
V
VCES
1200
V
IC
50
A
Forward current
Tc = 25°C, DC
IF
50
A
Collector power dissipation
Tc = 25°C
PC
300
W
Tj
150
°C
VCC
900
V
VCES
1200
V
IC
25
A
VR
1200
V
―
P−N power terminal
Collector−emitter voltage
―
Collector current
Tc = 25°C, DC
Reverse voltage
―
Forward current
Tc = 25°C, DC
IF
25
A
Collector power dissipation
Tc = 25°C
PC
140
W
Tj
150
°C
Junction temperature
Module
Unit
Tc = 25°C, DC
Supply voltage
Control
Ratings
Collector current
Junction temperature
Brake
Symbol
―
Control supply voltage
VD−GND terminal
VD
20
V
Input voltage
IN−GND terminal
VIN
20
V
Fault output voltage
FO−GND (L) terminal
VFO
20
V
Fault output current
FO sink current
IFO
14
mA
Operating temperature
―
TC
−20 ~ +100
°C
Storage temperature range
―
Tstg
−40 ~ +125
°C
VISO
2500
V
―
3
Nm
Isolation voltage
AC 1 minute
Screw torque
M5
Electrical Characteristics
a.
Inverter Stage
Characteristic
Collector cut−off current
Collector−emitter saturation voltage
Forward voltage
Symbol
ICEX
VCE (sat)
VF
Test Condition
VCE = 1200V
VD = 15 V,
IC = 50 A
VIN = 15 V → 0 V
Min
Typ.
Max
Tj = 25°C
―
―
1
Tj = 125°C
―
―
10
Tj = 25°C
―
2.6
3.5
Tj = 125°C
―
2.5
―
―
2.0
2.8
―
1.0
1.7
―
0.4
0.8
―
0.16
0.21
―
1.9
2.6
―
0.35
0.6
IF = 50A
ton
tc (on)
Switching time
trr
VCC = 600 V, IC = 50 A
VD = 15 V, VIN = 15 V
Inductive load
toff
0V
(Note 1)
tc (off)
2
Unit
mA
V
V
µs
2001-05-29
MIG50Q201H
b.
Brake Stage
Characteristic
Collector cut−off current
Collector−emitter saturation voltage
Symbol
ICEX
VCE (sat)
Test Condition
VCE = 1200V
VD = 15 V,
IC = 25 A
VIN = 15 V → 0 V
Reverse current
IR
VR = 1200 V
Forward voltage
VF
IF = 25A
Min
Typ.
Max
Tj = 25°C
―
―
1
Tj = 125°C
―
―
10
Tj = 25°C
―
2.6
3.5
Tj = 125°C
―
2.5
―
ton
tc (on)
Switching time
trr
VCC = 600 V, IC = 25 A
VD = 15 V, VIN = 15 V
Inductive load
0V
(Note 1)
toff
tc (off)
c.
Unit
mA
V
―
―
1
―
―
10
―
1.4
2.2
―
1.3
1.9
―
0.85
1.6
―
0.42
0.50
―
1.9
2.6
―
0.3
0.6
Min
Typ.
Max
―
8
12
―
32
48
1.4
1.6
1.8
V
2.2
2.5
2.8
V
5.4
6.0
6.6
―
―
0.1
85
100
―
40
50
―
120
150
―
60
75
―
―
5
―
110
118
125
―
98
―
11.0
12.0
12.5
12.0
12.5
13.0
1
2
3
mA
V
µs
Control Stage (Tj = 25°C)
Characteristic
Control circuit
current
Symbol
High side
ID (H)
Low side
ID (L)
Input−on signal voltage
VIN (on)
Input−off signal voltage
VIN (off)
Fault output
current
Protection
IFO (on)
Normal
IFO (off)
Over current
protection
trip level
Inverter
Short circuit
protection
trip level
Inverter
Brake
Brake
Over current cut-off time
VD = 15 V
VD = 15 V, IC = 50 mA
―
VD = 15 V
OC
VD = 15 V, Tj = 125°C
SC
VD = 15 V, Tj = 125°C
toff (OC)
Over
temperature
protection
Trip level
OT
Reset level
OTr
Control supply
under voltage
protection
Trip level
UV
Reset level
UVr
Fault output pulse width
Test Condition
tFO
VD = 15 V
Case temperature
―
VD = 15 V
3
Unit
mA
mA
A
A
µs
°C
V
ms
2001-05-29
MIG50Q201H
d.
Thermal Resistance (Tj = 25°C)
Characteristic
Junction to case thermal resistance
Case to fin thermal resistance
Symbol
Rth (j−c)
Rth (c−f)
Test Condition
Min
Typ.
Max
Inverter IGBT stage
―
―
0.417
Inverter FRD stage
―
―
1.000
Brake IGBT stage
―
―
0.892
Brake FRD stage
―
―
2.000
Compound is applied
―
0.05
―
Unit
°C / W
°C / W
Note 1: Switching time test circuit & timing chart
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MIG50Q201H
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MIG50Q201H
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MIG50Q201H
Package Dimensions: TOSHIBA 2-110A1A
Unit: mm
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MIG50Q201H
RESTRICTIONS ON PRODUCT USE
000707EAA
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
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2001-05-29
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