BSD235N OptiMOS™2 Small-Signal-Transistor Product Summary Features V DS • Dual N-channel R DS(on),max • Enhancement mode • Super Logic level (2.5V rated) 20 V V GS=4.5 V 350 mΩ V GS=2.5 V 600 ID 0.95 A • Avalanche rated • Qualified according to AEC Q101 PG-SOT-363 • 100% lead-free; RoHS compliant 6 1 2 5 4 3 Type Package Tape and Reel Information Marking Lead Free Packing BSD235N PG-SOT-363 L6327: 3000 pcs/ reel X6s Yes Non dry Maximum ratings, at T j=25 °C, unless otherwise specified Parameter 1) Symbol Conditions Continuous drain current ID Value T A=25 °C 0.95 T A=70 °C 0.76 Pulsed drain current I D,pulse T A=25 °C 3.8 Avalanche energy, single pulse E AS I D=0.95 A, R GS=16 Ω 1.6 Reverse diode dv /dt dv /dt I D=0.95 A, V DS=16 V, di /dt =200 A/µs, T j,max=150 °C 6 Gate source voltage V GS Power dissipation P tot Operating and storage temperature T j, T stg ESD Class T A=25 °C JESD22-A114 -HBM Soldering Temperature Rev 2.2 A mJ kV/µs ±12 V 0.5 W -55 ... 150 °C 0 (<250V) 260 °C IEC climatic category; DIN IEC 68-1 (1) Unit 55/150/56 Remark: only one of both transistors in operation. page 1 2010-03-26 BSD235N Parameter Values Symbol Conditions Unit min. typ. max. - - 250 Thermal characteristics Thermal resistance, junction - ambient R thJA minimal footprint(2) K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=250 µA 20 - - Gate threshold voltage V GS(th) V DS=VGS, I D=1.6 µA 0.7 0.95 1.2 Drain-source leakage current I DSS V DS=20 V, V GS=0 V, T j=25 °C - - 1 V DS=20 V, V GS=0 V, T j=150 °C - - 100 V µA Gate-source leakage current I GSS V GS=12 V, V DS=0 V - - 100 nA Drain-source on-state resistance R DS(on) V GS=2.5 V, I D=0.29 A - 415 600 mΩ V GS=4.5 V, I D=0.95 A - 266 350 2 - Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=0.76 A S 2) Performed on 40 mm2 FR4 PCB. The traces are 1mm wide, 70µm thick and 20mm long; they are present on both sides of the PCB Rev 2.2 page 2 2010-03-26 BSD235N Parameter Values Symbol Conditions Unit min. typ. max. - 49 63 - 23 32 Dynamic characteristics Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 3.2 - Turn-on delay time t d(on) - 3.8 - Rise time tr - 3.6 - Turn-off delay time t d(off) - 4.5 - Fall time tf - 1.2 - Gate to source charge Q gs - 0.11 - Gate to drain charge Q gd - 0.07 - Gate charge total Qg - 0.32 - Gate plateau voltage V plateau - 2.4 - V - - 0.5 A - - 3.8 - 0.9 1.2 V - 5.2 - ns - 0.97 - nC V GS=0 V, V DS=10 V, f =1 MHz V DD=10 V, V GS=4.5 V, I D=0.95 A, R G=6 Ω pF ns Gate Charge Characteristics V DD=10 V, I D=0.95 A, V GS=0 to 4.5 V nC Reverse Diode Diode continous forward current IS Diode pulse current I S,pulse Diode forward voltage V SD Reverse recovery time t rr Reverse recovery charge Q rr Rev 2.2 T A=25 °C V GS=0 V, I F=0.95 A, T j=25 °C V R=10 V, I F=0.95 A, di F/dt =100 A/µs page 3 2010-03-26 BSD235N 1 Power dissipation 2 Drain current P tot=f(T A) I D=f(T A); V GS≥4.5 V 1 0.5 0.75 I D [A] P tot [W] 0.375 0.25 0.5 0.25 0.125 0 0 0 40 80 120 0 40 T A [°C] 80 120 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T A=25 °C; D =0 Z thJA=f(t p) parameter: t p parameter: D =t p/T 101 103 100 100 µs 0.5 1 ms 10 2 0.2 Z thJA [K/W] 10 ms I D [A] 160 T A [°C] DC 10-1 0.1 0.05 0.01 101 10 µs single pulse 10-2 10-3 10 100 -2 10 -1 10 0 10 1 10 2 V DS [V] Rev 2.2 10-5 10-4 10-3 10-2 10-1 100 101 102 t p [s] page 4 2010-03-26 BSD235N 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 4 600 3.5 V 4.5 V 500 3 2.2 V 2.5 V 3V R DS(on) [mΩ] I D [A] 3V 2 400 3.5 V 300 4.5 V 6V 200 2.5 V 1 2.3 V 100 2V 0 0 0 1 2 0 3 1 2 V DS [V] 3 4 I D [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C 4 g fs [S] I D [A] 0.5 25 °C 2 0.25 150 °C 0 0 0 1 2 3 V GS [V] Rev 2.2 0 2 4 6 I D [A] page 5 2010-03-26 BSD235N 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=0.95 A; V GS=4.5 V V GS(th)=f(T j); V DS=VGS; I D=1.6 µA parameter: I D 1.6 600 1.2 400 98 % 98 % typ V GS(th) [V] R DS(on) [mΩ] 500 300 typ 0.8 2% 200 0.4 100 0 0 -60 -20 20 60 100 140 -60 -20 20 60 100 140 T j [°C] T j [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz; Tj=25°C I F=f(V SD) parameter: T j 102 101 Ciss 100 I F [A] C [pF] Coss 101 10-1 150 °C, 98% Crss 10-2 25 °C 150 °C 100 10-3 0 5 10 15 20 V DS [V] Rev 2.2 25 °C, 98% 0 0.4 0.8 1.2 1.6 V SD [V] page 6 2010-03-26 BSD235N 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=16 Ω V GS=f(Q gate); I D=0.95 A pulsed parameter: T j(start) parameter: V DD 101 7 6 5 10 V 4V 100 16 V V GS [V] I AV [A] 25 °C 100 °C 125 °C 4 3 10-1 2 1 10-2 100 101 102 103 0 104 0 0.1 t AV [µs] 0.2 0.3 0.4 0.5 Q gate [nC] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=250 µA 25 V GS 24 Qg 23 V BR(DSS) [V] 22 21 20 V g s(th) 19 18 Q g(th) 17 Q sw Q gs 16 -60 -20 20 60 100 Q g ate Q gd 140 T j [°C] Rev 2.2 page 7 2010-03-26 BSD235N SOT-363 Package Outline: Footprint: Packing: Reflow soldering: Dimensions in mm Rev 2.2 page 8 2010-03-26 BSD235N Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev 2.2 page 9 2010-03-26