TOSHIBA CMS15

CMS15
TOSHIBA Schottky Barrier Diode
CMS15
Switching Mode Power Supply Applications
(Output voltage: ≤12 V)
Unit: mm
DC/DC Converter Applications
•
•
•
•
Forward voltage: VFM = 0.58 V (max)
Average forward current: IF (AV) = 3.0 A
Repetitive peak reverse voltage: VRRM = 60 V
Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Repetitive peak reverse voltage
VRRM
Average forward current
IF (AV)
Non-repetitive peak surge current
Junction temperature
Storage temperature range
Rating
Unit
60
V
3.0 (Note 1)
A
IFSM
60 (50Hz)
A
Tj
−40~150
°C
Tstg
−40~150
°C
Note 1: Tℓ = 95°C
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering size: 2 mm × 2 mm
Board thickness: 0.64 t
Rectangular waveform (α = 180°), VR = 30 V
JEDEC
―
JEITA
―
Note 2: Using continuously under heavy loads (e.g. the application of
TOSHIBA
3-4E1A
high temperature/current/voltage and the significant change in
Weight: 0.023 g (typ.)
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Peak repetitive reverse current
Junction capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Symbol
Test Condition
Min
Typ.
Max
⎯
VFM (1)
IFM = 1.0 A (pulse test)
⎯
0.43
VFM (2)
IFM = 2.0 A (pulse test)
⎯
0.49
⎯
VFM (3)
IFM = 3.0 A (pulse test)
⎯
0.55
0.58
IRRM (1)
VRRM = 5 V (pulse test)
⎯
1.0
⎯
IRRM (2)
VRRM = 60 V (pulse test)
⎯
25
300
VR = 10 V, f = 1.0 MHz
⎯
102
⎯
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
⎯
⎯
60
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
⎯
⎯
135
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
⎯
⎯
210
⎯
⎯
16
Cj
Rth (j-a)
⎯
Rth (j-ℓ)
1
Unit
V
μA
pF
°C/W
°C/W
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CMS15
Marking
Abbreviation Code
Part No.
SE
CMS15
Standard Soldering Pad
2.1
Unit: mm
1.4
3.0
1.4
Handling Precaution
1)
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
2)
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we
recommend when you design a circuit with a device.
VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum
rating of
IF (AV) and Tj be below 120°C. When using this device, take a margin into consideration by using
an allowable Tamax-IF (AV) curve.
IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal
operation, which seldom occurs during the lifespan of the device.
Tj: Derate this rating when using a device in order to ensure high reliability.
We recommend that the device be used at a Tj of below 120°C.
3)
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
4)
Please refer to the Rectifiers databook for further information.
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CMS15
PF (AV) – IF (AV)
iF – vF
50
30
10
2.4
Pulse test
Average forward power dissipation
PF (AV) (W)
Instantaneous forward current
iF (A)
100
Tj = 150°C
5
3
1
125°C
0.5
0.3 75°C
25°C
0.1
0.05
0.03
DC
2.0
180°
120°
1.6
α = 60°
1.2
Rectangular
waveform
0.8
0° α 360°
0.4
Conduction angle α
0.01
0.0
0.2
0.4
0.6
0.8
1.0
1.4
1.2
Instantaneous forward voltage vF
0.0
0.0
0.8
(V)
140
Maximum allowable temperature
Ta max (°C)
140
120
100
180°
40
DC
Rectangular
waveform
120°
0° α 360°
IF (AV)
20 Conduction
angle α
VR = 30 V
0
0 0.4 0.8 1.2 1.6
IF (AV)
4.0
(A)
120
100
80
Device mounted on a ceramic board: Rectangular
board size: 50 mm × 50 mm waveform
soldering land:
2 mm × 2 mm
board thickness:
0° α 360°
0.64 t
IF (AV)
Conduction
angle α
VR = 30 V
180°
60
120°
DC
40
20
α = 60°
2.0 2.4 2.8 3.2
Average forward current
0
0
3.6 4.0 4.4
IF (AV)
0.4 0.8 1.2
(A)
1.6 2.0
2.4 2.8 3.2
Average forward current
IF (AV)
3.6 4.0 4.4
(A)
rth (j-a) – t
1000
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
board thickness: 1.6 t
500
Transient thermal impedance
rth (j-a) (°C/W)
Maximum allowable lead temperature
Tℓ max (°C)
160
60
3.2
Ta max – IF (AV)
Tℓ max – IF (AV)
80
2.4
Average forward current
160
α = 60°
1.6
300
100
50
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
30
10
5
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 t
3
1
0.001
0.003
0.01
0.03
0.1
0.3
1
3
10
30
100
300
1000
Time t (s)
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CMS15
Surge forward current
Cj – V R
(typ.)
(non-repetitive)
1000
80
Cj (pF)
IFSM (A)
Ta = 25°C
500
f = 1 MHz
Ta = 25°C
f = 50 Hz
60
Peak surge forward current
Junction capacitance
100
50
10
5
1
1
3
10
5
30
Reverse voltage
VR
50
100
40
20
0
1
(V)
3
IR – Tj
(typ.)
PR (AV) – VR
0.6
Average reverse power dissipation
PR (AV) (W)
Reverse current
IR
(mA)
10
1
48 V
40 V
30 V
20 V
10 V
VR = 5 V
0.001
0.0001
0
20
40
60
80
100
Junction temperature Tj
50
100
120
140
0.5
0.4
VR
0.3
Conduction angle α
Tj = 125°C
(°C)
DC
α
300°
240°
180°
0.2
120°
0.1
0.0
0
160
α = 60°
6
12
18
24
Reverse voltage
4
(typ.)
Rectangular
waveform
0°
360°
Pulse test
0.01
30
10
Number of cycles
100
0.1
5
30
VR
36
42
48
(V)
2006-11-13
CMS15
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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