SONY CXP852P32AQ

CXP852P32A
CMOS 8-bit Single-chip Microcomputer
Description
The CXP852P32A is highly integrated microcomputers composed of 8-bit CPU, PROM, RAM,
and I/O ports. This IC featureS many other highperformance circuits in a single-chip CMOS design,
including an A/D converter, serial interface,
timer/counter, time base timer, vector interrupt, onscreen display function, I2C bus interface, PWM
generator, remote control receiver, HSYNC counter,
power supply frequency counter, and watchdog
timer.
Also this IC provides power-on reset and sleep
functions. The designers have ensured low power
consumption for these powerful microcomputers.
The CXP852P32A is the on-chip PROM version of
the CXP85232A with on-chip mask ROM, providing
the function of being able to write directly into the
program. Furthermore, because of the OSD
character ROM can also be written directly into, it is
suitable for evaluation use during system development
and for small quantity production.
64 pin SDIP (Plastic)
64 pin QFP (Plastic)
Structure
Silicon gate CMOS IC
Features
• A wide instruction set (213 instructions) to cover various types of data
— 16-bit arithmetic/multiplication and division/boolean bit operation instructions
• Minimum instruction cycle
During operation 1µs at 4MHz
• Incorporated PROM capacity
32K bytes (For program)
3K bytes (for OSD)
• Incorporated RAM capacity
448 bytes
• Peripheral functions
— On-screen display function
12 × 16 dots, 128 types
4 Iines of 21 characters (5 or more lines possible) , double scanning
mode
supported, jitter elimination circuit
— I2C bus interface
— PWM output
14 bits, 1 channel
6 bits, 8 channels
— Remote control reception circuit 8-bit pulse measuring counter, 6-stage FIFO
— A/D converter
4 bits, 4 channels, successive approximation method
(Conversion time of 40µs at 4MHz)
— HSYNC counter
— Power supply frequency counter
— Watchdog timer
— Serial I/O
8-bit clock synchronization
— Timer
8-bit timer, 8-bit timer/counter, 19-bit time base timer
• Interruption
14 factors, 14 vectors, multi-interrupt possible
• Standby mode
Sleep
Purchase of Sony's I2C components conveys a license under the Philips I2C Patent Rights to use these components
in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E93Z16A7Z-PS
HSYNC COUNTER
AC TIMER
A/D CONVERTER
I2C INTERFACE UNIT
PD4/HSI
PD5/ACI
PE2/AN0
to
PE5/AN3
PF4/SCL0
PF5/SCL1
PF6/SDA0
PF7/SDA1
FIFO
TIMER/COUNTER
PD7/EC
PE7/TO
REMOCON
SERIAL I/O
PD3/SI
PD2/SO
PD1/SCK
PD6/RMC
ON SCREEN DISPLAY
PROM 3K BYTES
2
2
PE0/INT0
6 BIT PWM 8CH
PROM
32K BYTES
SPC700
CPU CORE
14 BIT PWM
WATCHDOG TIMER
PD0/INT2
PE6/PWM
EXLC
XLC
B
G
R
BLK
HSYNC
VSYNC
PE1/INT1
INTERRUPT CONTROLLER
PF0/PWM0
to
PF7/PWM7
VSS
MP
VDD
RST
XTAL
EXTAL
PRESCALER/
TIME BASE TIMER
RAM
448 BYTES
CLOCK GEN./
SYSTEM CONTROL
PORT A
PF0 to PF7
PE6 to PE7
PE0 to PE5
PD0 to PD7
PB0 to PB7
PA0 to PA7
PC0 to PC7
PORT B
PORT C
PORT D
PORT E
–2–
PORT F
Block Diagram
CXP852P32A
Vpp
CXP852P32A
Pin Assignment 1 (Top View) 64 pin SDIP Package
PA7
1
64
VDD
PA6
2
63
Vpp
PA5
3
62
VSS
PA4
4
61
MP
PA3
5
60
PF0/PWM0
PA2
6
59
PF1/PWM1
PA1
7
58
PF2/PWM2
PA0
8
57
PF3/PWM3
PB7
9
56
PF4/PWM4/SCL0
PB6
10
55
PF5/PWM5/SCL1
PB5
11
54
PF6/PWM6/SDA0
PB4
12
53
PF7/PWM7/SDA1
PB3
13
52
BLK
PB2
14
51
R
PB1
15
50
G
PB0
16
49
B
PC7
17
48
VSYNC
PC6
18
47
HSYNC
PC5
19
46
EXLC
PC4
20
45
XLC
PC3
21
44
PE0/INT0
PC2
22
43
PE1/INT1
PC1
23
42
PE2/AN0
PC0
24
41
PE3/AN1
PD7/EC
25
40
PE4/AN2
PD6/RMC
26
39
PE5/AN3
PD5/ACI
27
38
PE6/PWM
PD4/HSI
28
37
PE7/TO
PD3/SI
29
36
RST
PD2/SO
30
35
EXTAL
PD1/SCK
31
34
XTAL
VSS
32
33
PD0/INT2
Note)
1. Vpp (Pin 63) is always connected to VDD.
2. Vss (Pins 32 and 62) are both connected to GND.
3. MP (Pin 61) is always connected to GND.
–3–
CXP852P32A
PF2/PWM2
PF1/PWM1
PF0/PWM0
MP
Vpp
VSS
VDD
PA7
PA6
PA5
PA4
PA2
PA3
Pin Assignment 2 (Top View) 64 pin QFP Package
64 63 62 61 60 59 58 57 56 55 54 53 52
PA1
1
51
PF3/PWM3
PA0
2
50
PF4/PWM4/SCL0
PB7
3
49
PF5/PWM5/SCL1
PB6
4
48
PF6/PWM6/SDA0
PB5
5
47
PF7/PWM7/SDA1
PB4
6
46
BLK
PB3
7
45
R
PB2
8
44
G
PB1
9
43
B
PB0
10
42
VSYNC
PC7
11
41
HSYNC
PC6
12
40
EXLC
PC5
13
39
XLC
PC4
14
38
PE0/INT0
PC3
15
37
PE1/INT1
PC2
16
36
PE2/AN0
PC1
17
35
PE3/AN1
PC0
18
34
PE4/AN2
PD7/EC
19
33
PE5/AN3
Note)
PE7/TO
PE6/PWM
RST
XTAL
EXTAL
VSS
PD0/INT2
PD2/SO
PD1/SCK
PD3/SI
PD4/HSI
PD5/ACI
PD6/RMC
20 21 22 23 24 25 26 27 28 29 30 31 32
1. Vpp (Pin 56) is always connected to VDD.
2. Vss (Pins 26 and 58) are both connected GND.
3. MP (Pin 55) is always connected to GND.
–4–
CXP852P32A
Pin Description
Symbol
I/O
Description
PA0 to PA7
I/O
(Port A)
8-bit I/O port. I/O can be set in a unit of single bits.
(8 pins)
PB0 to PB7
I/O
(Port B)
8-bit I/O port. I/O can be set in a unit of single bits.
(8 pins)
PC0 to PC7
I/O
(Port C)
8-bit I/O port. I/O can be set in a unit of single bits.
(8 pins)
PD0/INT2
I/O/Input
PD1/SCK
I/O/I/O
PD2/SO
I/O/Output
PD3/SI
I/O/Input
PD4/HSI
I/O/Input
PD5/ACI
I/O/Input
PD6/RMC
I/O/Input
Input for remote control reception circuit.
PD7/EC
I/O/Input
External event input for timer/counter.
Input/Input
External interruption request inputs.
Active at falling edge.
(2 pins)
PE0/INT0
PE1/INT1
External interruption request input.
Active at falling edge.
(Port D)
8-bit I/O port. I/O
can be set in a unit
of single bits.
Capable of driving
12mA sink current.
(8 pins)
(Port E)
8-bit port. Lower
6 bits are for inputs;
upper 2 bits are for
outputs.
(8 pins)
Serial clock I/O.
Serial data output.
Serial data input.
HSYNC counter input.
Input for power supply frequency counter.
PE2/AN0
to
PE5/AN3
Input/Input
PE6/PWM
Output/Output
PE7/TO
Output/Output
PF0/PWM0
to
PF3/PWM3
Output/Output
PF4/PWM4/
SCL0
PF5/PWM5/
SCL1
Output/Output/
I/O
PF6/PWM6/
SDA0
PF7/PWM7/
SDA1
Output/Output/
I/O
R, G, B, BLK
Output
4-bit outputs for CRT display.
HSYNC
Input
Horizontal synchronizing signal input for CRT display.
VSYNC
Input
Vertical synchronizing signal input for CRT display.
Analog inputs for A/D converter.
(4 pins)
14-bit PWM output.
(CMOS output)
Rectangular waveform output for Timer 1.
(Duty output 50%)
(Port F)
6-bit PWM outputs.
8-bit output port,
(8 pins)
operating as N-ch
open drain output
for high current
Transfer clock I/Os for I2C bus
(12mA).
interface.
Lower 4 bits are for
medium voltage
drive outputs (12V),
upper 4bits are for
Transfer data I/Os for I2C data bus.
5V drive outputs.
(8 pins)
–5–
CXP852P32A
Symbol
I/O
Description
EXLC
Input
XLC
Output
EXTAL
Input
XTAL
Output
RST
I/O
Low-level active, system reset. RST is an I/O, from which Low level is
output when the built-in power-on reset function is activated at the rise
of power on.
MP
Input
Microprocessor mode input. For this device, this pin must be grounded.
Clock oscillation I/Os for CRT display.
Oscillation frequency is set using the external L and C.
Crystai connectors for system clock oscillation. When the clock is
supplied externally, input to EXTAL and leave XTAL open.
VDD
Positive power supply.
Vpp
Positive power supply pin for on-chip PROM writing.
Connect to VDD for normal operation.
Vss
GND. Both Vss mvst be grounded.
–6–
CXP852P32A
Input/Output Circuit Formats for Pins
Pin
Circuit format
Port A
Port B
Port C
PA0 to PA7
PB0 to PB7
PC0 to PC7
AAAA
AAAA
AAAA
AAAA
Data for Ports
A, B, and C
Direction for
Ports A, B, and C
Data bus
RD (Ports A, B, and C)
24 pins
Port D
PD0/INT2
PD3/SI
PD4/HSI
PD5/ACI
PD6/RMC
PD7/EC
When reset
AA
AA
AA
Input protection
circuit
IP
AAAA
AAAA
AAAA
Port D data
Port D direction
Hi-Z
AA
AA
AA
AA
High current
12mA
Hi-Z
IP
Data bus
RD (Port D)
INT2, SI, HSI, ACI, RMC, EC
Schmitt input
6 pins
Port D
SCK or SO
Output eneble
AAAA
AAAA
PD1/SCK
PD2/SO
AA
AA
AA
AA
High current
12mA
Port D data
IP
Port D direction
Schmitt input
Data bus
RD (Port D)
SCK only
2 pins
–7–
Hi-Z
CXP852P32A
Pin
Port E
PE0/INT0
PE1/INT1
AAAA
Circuit format
When reset
Schmitt input
(To interruption circuit)
IP
Hi-Z
Data bus
2 pins
RD (Port E)
Port E
PE2/AN0
to
PE5/AN3
AA
A
AAA
Input multiplexer
To A/D converter
IP
Hi-Z
Data bus
4 pins
RD (Port E)
Port E
AAAA
AAAA
AAAA
AA
AA
TO, PWM
PE6/PWM
PE7/TO
Port E data
Port selection
2 pins
High level
Port F
PWM
PF0/PWM0
to
PF3/PWM3
AAAAA
AAAAA
AAAAA
AA
AA
AA
AA
Middle tension proof 12V
Port F data
High current
12mA
Port selection
4 pins
Port F
SCL, SDA
PF4/PWM4/
SCL0
PF5/PWM5/
SCL1
PF6/PWM6/
SDA0
PF7/PWM7/
SDA1
I2C output enable
AAAA
AAAA
AAAA
4 pins
AA
AA
PWM
Port F data
Port selection
Hi-Z
Hi-Z
IP
Schmitt input
SCL, SDA
(To I2C circuit)
BUS SW
To other I2C pins
–8–
CXP852P32A
Pin
BLK
R
G
B
4 pins
Circuit format
AAAA
AAAA
When reset
AA
BLK, R, G, B
Output polarity
Hi-Z
Hi-Z → output active
by writing into the output polarity register.
AAA
AAAAAA
AAAA
AA
AA
AA
AA
AA
A
AA A
Schmitt input
HSYNC
VSYNC
2 pins
EXLC
XLC
EXTAL
XTAL
2 pins
RST
1 pin
MP
EXLC
IP
Oscillation control
Oscillation
terminated
CRT display clock
IP
AA
AA
AA
AA
A
A
EXTAL
• Diagram shows
circuit composition
during oscillation.
IP
• Feedback resistor
is removed during
stop.
Oscillation
XTAL
AA
AA
A
AAA
Mask option OP
Pull-up resistance
Schmitt input
Low level
From power-on reset circuit
CPU mode
IP
1 pin
Hi-Z
Input polarity
XLC
2 pins
HSYNC
VSYNC
IP
–9–
Hi-Z
CXP852P32A
Absolute Maximum Ratings
Item
Supply voltage
(Vss = 0V reference)
Symbol
Rating
Unit
VDD
–0.3 to +7.0
V
Vpp
V
Remarks
Incorporated PROM
Input voltage
VIN
–0.3 to +13.0
–0.3 to +7.0∗1
Output voltage
VOUT
–0.3 to +7.0∗1
V
Medium voltage drive output voltage
VOUTP
–0.3 to +15.0
V
High level output current
IOH
–5
mA
High level total output current
∑IOH
–50
mA
Total for all output pins
IOL
15
mA
IOLC
20
mA
Excludes high current outputs
High current outputs∗2
Low level total output current
∑IOL
130
mA
Total for all output pins
Operating temperature
Topr
–10 to +75
°C
Storage temperature
Tstg
–55 to +150
°C
Allowable power dissipation
PD
1000
mW
SDIP
600
mW
QFP
Low level output current
V
Pins PF0 to PF3
∗1 VIN and VOUT must not exceed VDD + 0.3V.
∗2 The high current operation transistor are the N-ch transistors of the PD and PF0 to PF3 ports.
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
be conducted under the recommended operating conditions.
Exceeding these conditions may adversely affect the reliability of the LSI.
– 10 –
CXP852P32A
Recommended Operating Conditions
Item
Supply voltage
(Vss = 0V reference)
Symbol
VDD
Vpp
High level input voltage
Operating temperature
Max.
Unit
4.5
5.5
V
Guaranteed operation range
3.5
5.5
V
Low-speed mode guaranteed
operation range∗1
2.5
5.5
V
Vpp = VDD
V
Remarks
Guaranteed data hold range
during stop
∗5
VIH
0.7VDD
VDD
V
VIHS
0.8VDD
VDD
V
Includes I2C Schmitt input∗2
CMOS Schmitt input∗3
V
EXTAL∗4
VIHEX
Low level input voltage
Min.
VDD – 0.4 VDD + 0.3
VIL
0
0.3VDD
V
VILS
0
0.2VDD
V
Includes I2C Schmitt input∗2
CMOS Schmitt input∗3
VILEX
–0.3
0.4
V
EXTAL∗4
Topr
–10
+75
°C
∗1 Specifies only for 1/16 frequency demultiplication mode and sleep mode.
∗2 Value for each pin of normal input ports (PA, PB, PC, PE2 to PE5), PF4 to PF7, and MP.
∗3 Value of the following pins: PD0/lNT2, PD1/SCK, PD2, PD3/Sl, PD4/HSl, PD5/ACI, PD6/RMC, PD7/EC,
PE0/INT0, PE1/lNT1, HSYNC, VSYNC, RST.
∗4 Specifies only during external clock input.
∗5 Vpp and VDD should be set to the same voltage.
– 11 –
CXP852P32A
Electrical Characteristics
DC Characteristics
Item
High level output
current
Low level output
current
(Ta = –10 to +75°C, Vss = 0V reference)
Symbol
VOH
VOL
IIHE
Input current
Pins
Conditions
Min.
PA to PD, PE6, PE7,
R, G, B, BLK
VDD = 4.5V, IOH = –0.5mA
4.0
V
VDD = 4.5V, IOH = –1.2mA
3.5
V
PA to PD, PE6, PE7,
R, G, B, BLK,
PF0 to PF3, RST
VDD = 4.5V, IOL = 1.8mA
0.4
V
VDD = 4.5V, IOL = 3.6mA
0.6
V
PD, PF0 to PF3
VDD = 4.5V, IOL = 12.0mA
1.5
V
PF4 to PF7
(SCL0, SCL1,
SDA0, SDA1)
VDD = 4.5V, IOL = 3.0mA
0.4
V
VDD = 4.5V, IOL = 4.0mA
0.6
V
EXTAL
IIHL
Typ.
Max.
Unit
VDD = 5.5V, VIH = 5.5V
0.5
40
µA
VDD = 5.5V, VIL = 0.4V
–0.5
–40
µA
–1.5
–400
µA
IILR
RST
VDD = 5.5V, VIL = 0.4V
I/O leakage current
IIZ
PA to PE, HSYNC,
VSYNC, R, G, B,
BLK, MP
VDD = 5.5V
VI = 0, 5.5V
±10
µA
Open drain output
leakage current
(N-ch Tr in off state)
PF0 to PF3
VDD = 5.5V, VOH = 12.0V
50
µA
ILOH
PF4 to PF7
VDD = 5.5V, VOH = 5.5V
10
µA
SCL0: SCL1
SDA0: SDA1
VDD = 4.5V
VSCL0 = VSCL1 = 2.25V
VSDA0 = VSDA1 = 2.25V
120
Ω
10
25
mA
0.7
3
mA
—
—
µA
10
20
pF
Impedance connected
RBS
to I2C bus switch
(output Tr in off state)
IDD
VDD∗1
Power supply current
Operation mode∗1
(1/2 frequency
demultiplier clock)
4MHz crystal oscillation
(C1 = C2 = 22pF)
All outputs open
IDDSL
Sleep mode
Stop mode∗4
IDDST
Input capacity
CIN
Pins other than
VDD and Vss
Clock 1MHz
0V for no-measured pins
∗1 Rating applies only if OSD oscillator is halted.
∗2 This device does not enter in the stop mode.
– 12 –
—
CXP852P32A
AC Characteristics
(1) Clock timing
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
System clock frequency
fC
System clock input
pulse width
tXL,
tXH
tCR,
tCF
tEH,
tEL
tER,
tEF
System clock input rise
time, fall time
Event counter input clock
pulse width
Event counter input clock
rise time, fall time
Pins
Conditions
Min.
Max.
Unit
4.5
MHz
XTAL
EXTAL
Fig. 1, Fig. 2
3.5
EXTAL
Fig. 1, Fig. 2
External clock drive
100
EXTAL
Fig. 1, Fig. 2
External clock drive
EC
Fig. 3
EC
Fig. 3
ns
200
tsys + 50∗1
ns
ns
20
ms
∗1 tsys indicates the three values below according to the upper two bits (CPU clock selection) of the clock
control register (address: 00FEH).
tsys [ns] = 2000/fc (upper two bits = "00"), 4000/fc (upper two bits = "01"), 16000/fc (upper two bits = "11")
1/fc
VDD – 0.4V
EXTAL
0.4V
tXH
tCF
tXL
tCR
Fig. 1. Clock timing
AAAAA
AAAAA
AAAAA
AAAAA
AAAAA
AAAAA
Crystal oscillation
Ceramic oscillation
EXTAL
External clock
EXTAL
XTAL
C1
C2
XTAL
OPEN
Fig. 2. Clock applied condition
0.8VDD
EC
0.2VDD
tEH
tEF
tEL
Fig. 3. Event count clock timing
– 13 –
tER
CXP852P32A
(2) Serial transfer
Item
SCK cycle time
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
tKCY
Pins
SCK
Conditions
Min.
tKH
tKL
SCK
SI input setup time
(for SCK ↑)
tSIK
SI
SI input hold time
(for SCK ↑)
tKSI
ns
8000/fc
ns
400
ns
4000/fc – 50
ns
SCK input mode
100
ns
SCK output mode
200
ns
SCK input mode
200
ns
SCK output mode
100
ns
SCK ↓ → SO delay time
tKSO
SCK input mode
SCK output mode
SI
SO
SCK input mode
200
ns
SCK output mode
100
ns
Note) The load condition for the SCK output mode, SO output delay time is 50pF + 1TTL.
tKCY
tKL
tKH
0.8VDD
SCK
0.2VDD
tSIK
tKSI
0.8VDD
SI
Unit
1000
Input mode
Output mode
SCK High and Low level
widths
Max.
Input data
0.2VDD
tKSO
0.8VDD
SO
Output data
0.2VDD
Fig. 4. Serial transfer timing
– 14 –
CXP852P32A
(3) Interruption, reset input
Item
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
External interruption
High and Low level widths
Reset input Low level width
tIH
tIL
tRSL
Pins
Conditions
Min.
INT0 to INT2
RST
tIH
Max.
Unit
1
µs
8/fc
µs
tIL
0.8VDD
INT0 to INT2
(Falling edge)
0.2VDD
Fig. 5. Interruption input timing
tRSL
RST
0.2VDD
Fig. 6. RST input timing
(4) Power-on reset
Power-on reset
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol Pins
tR
tOFF
Power supply rise time
Power supply cut-off time
VDD
VDD
Conditions
Power-on reset
Repetitive power-on reset
Min.
Max.
Unit
0.05
50
ms
1
ms
4.5V
0.2V
0.2V
tR
tOFF
The power supply should be raised smoothly.
Fig. 7. Power-on reset
– 15 –
CXP852P32A
(5) A/D converter characteristics
Item
Symbol
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Max.
Unit
Resolution
4
Bits
Linearity error
±1
LSB
Zero transition
voltage
VZT∗1
Full-scale transition
voltage
VFT∗2
Conversion time
Sampling time
tCONV
tSAMP
Analog input voltage
VIAN
Pin
Condition
Ta = 25°C
VDD = 5.0V
Vss = 0V
AN0 to AN3
Min.
Typ.
–10
160
320
mV
4370
4530
4690
mV
160/fc
µs
12/fc
µs
0
VDD
V
Digital conversion value
FH
EH
∗1 VZT: Value at which the digital conversion value changes
from 0H to 1H and vice versa.
∗2 VFT: Value at which the digital conversion value changes
from EH to FH and vice versa.
Linearity error
1H
0H
VZT
VFT
Analog input
Fig. 8. Definition of A/D converter terms
Note) The 4-bit conversion specifies values based on the upper 5 bits of the A/D data register (ADD: Address
00F5H), compensated into 4-bit data. A program example is shown below:
(A/D converter program example)
MOV
A, ADD
LSR
A
LSR
A
LSR
A
LSR
A
ADC
A, #00H
CMP
A, #10H
BNE
ADC_SKIP
MOV
A, #0FH
ADC_SKIP:
; ACC ← conversion data
; Shift to the right (4 times)
;
;
;
; Addition with carry (data increment if AD3 = 1)
;
;
;
– 16 –
CXP852P32A
(6) I2C bus timing
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Max.
Unit
0
100
kHz
SCL clock frequency
fSLC
SCL
Bus free time prior to transfer start
tBUF
tHD; STA
tLOW
tHIGH
tSU; STA
tHD; DAT
tSU; DAT
tR
tF
tSU; STO
SDA, SCL
4.7
µs
SDA, SCL
4.0
µs
SCL
4.7
µs
SCL
4.0
µs
SDA, SCL
µs
SDA, SCL
4.7
0∗1
SDA, SCL
250
ns
Transfer start hold time
Clock Low level width
Clock High level width
Setup time during repetitive transfer
Data hold time
Data setup time
SDA, SCL rise time
SDA, SCL fall time
Transfer end setup time
µs
SDA, SCL
1
µs
SDA, SCL
300
ns
SDA, SCL
4.7
µs
∗1 The data hold time does not take into consideration SCL rise time (300ns max.). Ensure that the data hold
time exceeds 300ns.
SDA
tBUF
tR
tF
tHD; STA
SCL
tHD; STA
tSU; STA
P
S
tLOW
tHD; DAT
tHIGH
St
tSU; DAT
tSU; STO
P
Fig. 9. I2C bus transfer timing
I2C device
RS
I2C device
RS RS
R S RP
RP
SDA0
(or SDA1)
SCL0
(or SCL1)
Fig. 10. Recommended circuit example for I2C device
• Pull-up resistors must be connected to SDA0 (or SDA1) and SCL0 (or SCL1).
• Serial resistance (Rs = 300Ω and under) of SDA0 (or SDA1) and SCL0 (or SCL1) reduces spike noise
caused by CRT flashover.
– 17 –
CXP852P32A
(7) OSD (On-Screen Display) timing
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Condition
Min.
Max.
Unit
13
MHz
OSD clock frequency
fOSC
EXLC
XLC
Fig. 12
4
HSYNC pulse width
tHWD
HSYNC
Fig. 11
1.2
HSYNC after-edge
rise time/fall time
tHCG
HSYNC
Fig. 11
200
ns
VSYNC after-edge
rise time/fall time
tVCG
VSYNC
Fig. 11
1.0
µs
tHWD
tHCG
0.8VDD
HSYNC
when Bit 5 of OPOL register
(01FBH) is set to "0"
0.2VDD
tVCG
0.8VDD
VSYNC
when Bit 4 of OPOL register
(01FBH) is set to "0"
0.2VDD
Fig. 11. OSC timing
EXLC
XLC
L
C1
C2
Fig. 12. LC oscillation circuit example
– 18 –
µs
CXP852P32A
Supplement
AAAAA
AAAAA
AAAAA
AAAAA
AAAAA
AAAAA
(i)
EXTAL
(ii)
EXTAL
XTAL
Rd
C1
XTAL
Rd
C2
C1 C2
Fig. 13. Recommended Oscillation circuit
Model
Manufacturer
MURATA
MFG
CO., LTD.
RIVER ELETEC
CORPORATION
KINSEKI
LTD.
C1 (pF)
fc (MHz)
CSA4.00MG
4.00
CSA4.19MG
4.19
CST4.00MGW∗
4.00
CST4.19MGW∗
4.19
Rd (Ω)
30
30
0
(ii)
10
10
0
4.19
(i)
4.00
HC-49/U (-S)
Circuit
example
(i)
4.00
HC-49/U03
C2 (pF)
18
18
0
4.19
∗ Indicates types with on-chip grounding capacitance (C1 and C2).
Product List
Option item
Mask
CXP852P32AS-1-
CXP852P32AQ-1-
64-pin plastic
SDIP/QFP
64-pin plastic
SDIP
64-pin plastic
QFP
12K/16K bytes
(CXP85112B/85116B)
20K/24K/28K/32K bytes
(CXP85220A/85224A
/85228A/85232A)
PROM 32K bytes
PROM 32K bytes
Reset pin pull-up resistor
Existent/Non-existent
Existent
Existent
Power-on reset circuit
Existent/Non-existent
Existent
Existent
Package
PROM capacitance
Font data
User specified
User specified (PROM)∗1 User specified (PROM)∗1
∗1 The font data for the one-time PROM version is operated in the same way as the program writing.
– 19 –
CXP852P32A
IDD vs. VDD
IDD vs. VDD
(fC = 4MHz, Ta = 25°C, Typical)
(VDD = 5V, Ta = 25°C, Typical)
14
15
10
1/2 frequency mode
13
1/2 frequency mode
12
11
1/16 frequency mode
10
IDD – Supply current [mA]
IDD – Supply current [mA]
1/4 frequency mode
Sleep mode
1
1/4 frequency mode
9
8
1/16 frequency mode
7
6
5
4
0.1
3
2
2
3
4
5
6
Sleep mode
1
VDD – Supply voltage [V]
0
1
2
3
4
5
fc – System clock [MHz]
Parameter Curve for OSD Oscillator L vs. C
(Analytically calculated value)
L – Inductance [µH]
100
5.0MHz
6.5MHz
10
13.0MHz
fOSC =
1
0
1
C = C1//C2
2π √ LC
50
100
C1, C2 – Capacitance [pF]
Fig. 14. Characteristics curves
– 20 –
6
CXP852P32A
Unit: mm
+ 0.1
0.05
0.25 –
64PIN SDIP (PLASTIC)
+ 0.4
57.6 – 0.1
64
19.05
+ 0.3
17.1 – 0.1
33
1
0° to 15°
32
3.0 MIN
0.5 MIN
+ 0.4
4.75 – 0.1
1.778
0.5 ± 0.1
0.9 ± 0.15
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SDIP-64P-01
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
SDIP064-P-0750
LEAD MATERIAL
42 ALLOY
PACKAGE MASS
8.6g
JEDEC CODE
64PIN QFP(PLASTIC)
23.9 ± 0.4
+ 0.4
20.0 – 0.1
+ 0.1
0.15 – 0.05
0.15
32
64
20
1
16.3
52
17.9 ± 0.4
33
+ 0.2
0.1 – 0.05
19
+ 0.35
2.75 – 0.15
+ 0.15
0.4 – 0.1
1.0
0.2
M
0° to10°
0.8 ± 0.2
51
+ 0.4
14.0 – 0.1
Package Outline
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
SONY CODE
QFP-64P-L01
LEAD TREATMENT
EIAJ CODE
QFP064-P-1420
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
1.5g
JEDEC CODE
– 21 –