Thermal Data ® DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue ( silver glue ) 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data DIP 20 Rth(j-a) (ºC/W) copper frame thickness = 0.25 mm die pad = 125 x 160 sq.mils 120 1) die size = 10.000 sq.mils 100 floating in air 80 mounted on board 60 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 dissipated power ( Watt ) 1.8 2 2.2 2.4 Transient Thermal Resistance (ºC/W) 100 50 copper frame thickness = 0.25 mm die pad = 110 x 120 sq.mils 30 20 2) 10 on die dissipating area = 2000 sq.mils mounted on board pd = 2 Watt 5 3 2 1 0.001 2/2 0.01 0.1 1 Time or pulse width ( s ) 10 100 1,000