Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight August, 2008 % of Total Pkg. Wt. Weight (g) Die 1.11% 0.018 Mold 84.38% 1.350 D/A Epoxy 0.08% 100 PQFP 1.60 Grams with matte Sn Plating MSL: 3 Peak Reflow Temp: 245°C % of Total Weight (g) Pkg. Wt. Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 3.38 x 3.54 x 0.64 mm 74.00% 5.91% 4.22% 0.25% 1.184 0.095 0.068 0.004 Silica Fused Epoxy Resin Phenol Resin Carbon black 60676-86-0 1309-64-4 Mold Compound Density varies between 1.7 and 2.3 grams/cc 75 to 95% Silica Fused (LSC uses 87.7% in our calculation) 5 to 10% Epoxy Resin (LSC uses 7% in our calculation). 2 to 8% Phenol Resin (LSC uses 5% in our calculation). 0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation) 0.061% 0.015% 0.001 0.0002 Silver-filled Epoxy Silver (Ag) other 7440-22-4 - (silver content: 70-90%; LSC uses 80% in our calculation) Die attach epoxy Density: 4 grams/cc 0.0012 Wire 0.18% 0.003 Gold (Au) 7440-57-5 1.0 mil wire diameter; 1 wire for each package lead; wire length 3 mm Lead Plating 1.38% 0.022 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 12.88% 0.206 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) 96.2% Cu 3.0% Ni 0.65% Si 0.15% Mg 12.39% 0.39% 0.08% 0.02% 0.198 0.0062 0.0013 0.0003 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. C1