16Mx16, 7.5 - 15ns, P12, M-Densus 30A232-00 A M-Densus 256 Megabit Synchronous DRAM DPSD16MX16TY5 High Density Memory Device ADVANCED INFORMATION DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 256 Megabit SDRAM is a member of this family which utilizes the new and innovative space saving TSOP stacking technology. The modules are constructed with 8 Meg x 16 SDRAMs. PIN-OUT DIAGRAM This 128 Megabit based M-Densus module, the DPSD16MX16TY5 has been designed to fit in the same footprint as the 8 Meg x 16 SDRAM TSOP monolithic and 128 Megabit SDRAM based family of M-Densus modules. This allows the memory board designer to upgrade the memory in their products without redesigning the memory board, thus saving time and money. FEATURES: • Configuration Available: 16 Meg x 16 bit (with two Chip Selects) • Clock Frequency: 66[1], 83[1], 100, 125[2], 133[2] MHz (max.) • PC100 and PC133 Compatible • 3.3V Supply • LVTTL Compatible I/O • Four Bank Operation • Programmable Burst Type, Burst Length, and CAS Latency • 4096 Cycles / 64 ms • Auto and Self Refresh • Package: TSOP Leadless Stack NOTES: [1] Available in Industrial Temperature Ranges Only. [2] Available in Commercial Temperature Range Only. FUNCTIONAL BLOCK DIAGRAM 30A232-00 REV. A PIN NAMES A0 - A11 Row Address: A0 - A11 Column Address: A0 - A8 BA0, BA1 Bank Select Address DQ0 - DQ15 Data In / Data Out CAS Column Address Strobes RAS Row Address Enables WE Data Write Enable UDQM, LDQM Upper & Lower Data Input/Output Mask CKE Clock Enable CLK System Clock CS0-CS1 Chip Selects VCC/VSS Power Supply/Ground VCCQ/VSSQ Data Output Power/Ground N.C./RFU No Connect Reserved for Future Use This document contains information on a product under consideration for development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right to change or discontinue information on this product without prior notice. 1 DPSD16MX16TY5 M-Densus Dense-Pac Microsystems, Inc. ADVANCED INFORMATION PART NUMBER DESCRIPTION NOTES: [1] [2] [3] [4] Available in Industrial Temperature Ranges Only. See Note 4. Available in Commercial Temperature Range Only. Contact your sales representative for supplier and manufacturer codes. Delivery of all industrial temperature ranges are subject to availability of screened components. MECHANICAL DRAWING Standard TSOP Pad Layout is acceptable. When possible, use the Dense-Pac recommended footprint as shown. See Application Note 53A001-00 for further Dense-Pac Microsystems, Inc. (714) 898-0007 2 7321 Lincoln Way, Garden Grove, California 92841-1431 (800) 642-4477 FAX: (714) 897-1772 http://www.dense-pac.com 30A232-00 REV. A