EClamp2410P ESD Protection Device for T-Flash/MicroSD Interfaces PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClampTM2410P is a combination EMI filter and line termination device with integrated TVS diodes for use on Multimedia Card interfaces. This state-of-the-art device utilizes solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of T-Flash/MicroSD interfaces in cellular phones and other portable electronics. The device consists of six circuits that include series impedance matching resistors and pull up resistors as required by the SD specification. TVS diodes are included on each line for ESD protection. An additional TVS diode connection is included for protection of the voltage (Vdd) bus. Termination resistor value of 45 Ohms is included on the DAT0, DAT1, DAT2, DAT3, CMD, and CLK lines. Pull up resistors of 15k Ohms are included on DAT0, DAT1, DAT2, and CMD lines while a 50k Ohm pull up is inlcuded on the DAT3 line. These may be configured for devices operating in SD or SPI mode . The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. The EClamp2410P is in a 16-pin, RoHS/WEEE compliant, SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. Bidirectional EMI/RFI filtering and line termination with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) TVS working voltage: 5V Termination Resistors: 45Ω Pull Up Resistors: 15kΩ (3 each) and 50kΩ Typical Capacitance per Line: 12pF (VR = 2.5V) Protection and termination for six lines + Vdd Solid-state technology Mechanical Characteristics SLP4016P16 16-pin package RoHS/WEEE Compliant Nominal Dimensions: 4.0 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPd Marking: Marking Code Packaging: Tape and Reel per EIA 481 Applications T-Flash / MicroSD Interfaces MMC Interfaces CDMA, GSM, 3G Cell Phones Package Configuration Pin Configuration 4.00 1 2 D AT1 In D AT0 In C L K In 1 16 D AT1 O u t 1.60 D AT0 O u t C LK Out R up1 R up3 Vd d R up2 C MD In C MD O u t D AT3 In D AT3 O u t D AT2 In D AT2 O u t 0.50 BSC 0.58 16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm Pin Designation (Top View) Revision 07/20/2006 1 www.semtech.com EClamp2410P PRELIMINARY PROTECTION PRODUCTS Pin Identification and Configuration Pin Symbol Identification 1, 16 DAT1 Data line #1 input/output with pull-up resistor 2, 15 DAT0 Data line #0 input/output with pull-up resistor 3, 14 Clock Clock line Input/Output 4 Rup1 15k Pull-up resistor from DAT1 & DAT2 5 Vdd Power Supply ESD Protection 6, 11 CMD Command Line Input/Output 7, 10 DAT3 Data line #3 input/output with pull-up resistor 8, 9 DAT2 Data line #2 input/output with pull-up resistor 12 Rup2 50k Pull-Up Resistor from DAT3 13 Rup3 15k Pull-up resistor from DAT0 & CMD Center tab GND Ground connection 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 Pin Configuration (Top View) Schematics & Component Values Pin 12 Pin 4 Rup 50K Rup 15K Pin 1, 8 45 Ohms Pin 7 Pin 9, 16 45 Ohms DAT1, DAT2 DAT3 DAT0, CMD Line Pin 3 45 Ohms Pin 14 2006 Semtech Corp. Pin 13 Pin 5 Rup 15K Pin 2, 6 CLK Pin 10 Vdd 2 45 Ohms Pin 11, 15 DAT0, CMD www.semtech.com EClamp2410P PRELIMINARY PROTECTION PRODUCTS Maximum Ratings Rating ESD per IEC61000-4-2 (Air) ESD per IEC61000-4-2 (Contact) Operating Temperature Storage Temperature Symbol Value Units VESD +/- 17 +/- 12kV kV TJ -40 to +85 o C TSTG -55 to +150 o C Electrical Characteristics (T = 25oC) Parameter S ymbol Conditions TVS Reverse Stand-Off Voltage VRWM TVS Reverse Breakdown Voltage VBR It = 1mA TVS Reverse Leakage Current IR VRWM = 3.0V Series Resistors R Each Line Minimum 6 Typical 8 Maximum Units 5 V 10 V 0.5 µA 38 45 52 Ohms DAT Pull Up Resistor 1 Rup1 12 15 17 k Ohms DAT Pull Up Resistor 2 Rup2 42 50 58 k Ohms Total Capacitance Cin 10 12 15 pF 2006 Semtech Corp. Input to Gnd, Each Line VR = 2.5V, f = 1MHz 3 www.semtech.com EClamp2410P PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1S21 LOG ESD Clamping (+8kV Contact) 6 dB /REF 0 dB 1: -6.145 dB 300 MHz 2: -14.437 dB 900 MHz 0 dB -6 dB 3: -23.847 dB 1.8 GHz 1 -12 dB 2 -18 dB 4: -32.024 dB 2.5 GHz -24 dB 3 -30 dB 4 -36 dB -42 dB -48 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP3000.000000MHz . 030MHz START Normalized Capacitance vs. Reverse Voltage Series Resistance vs. Temperature 1.2 50 f = 1 MHz 49 Series Resistance (Ohm) CJ(VR) / CJ(VR=2.5) 1 0.8 0.6 0.4 0.2 48 47 46 45 44 43 42 41 0 40 0 1 2 3 Reverse Voltage - VR (V) 4 5 -40 -10 5 20 35 0 Temperature ( C) 50 65 80 Pull Up Resistance (Rup2) vs. Temperature Pull Up Resistance (Rup1) vs. Temperature 58000 16200 57000 Pull Up Resistance (Ohm) 16100 Pull Up Resistance (Ohm) -25 16000 15900 15800 15700 15600 15500 15400 56000 55000 54000 53000 52000 51000 50000 49000 15300 48000 15200 -40 -30 -20 -10 0 10 20 30 o 40 50 60 70 -40 80 2006 Semtech Corp. -30 -20 -10 0 10 20 30 o 40 50 60 70 80 Temperature ( C) Temperature ( C) 4 www.semtech.com EClamp2410P PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection Figure 1 - Pin Identification and Configuration (Top Side View) The EClamp2410P is a microSD/T-Flash interface device designed for use in cell phones and other portable electronic devices. The EClamp2410P is comprised of series and pull up resistors required on the microSD interface. Each line also includes TVS diodes for ESD protection. The device may be configured for SD or SPI mode operation. In SD mode for example, the 15k Ohm pull up resistors (Rup 1 and Rup 3) are connected to VDD. In SPI mode pin 4 is not connected (Rup 1) since these are reserved lines. The 50k Ohm pull up resistor is used for card detection or SPI mode selection during power up and is disconnected by the user during regular data transfer. The EClamp2410P is in a 16-pin SLP package. Electrical connection is made to the 16 pins located at the bottom of the device. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. A center tab serves as the ground connection. Recommendations for the ground connection are given below. D AT1 In D AT0 In C L K In 1 16 D AT1 O u t D AT0 O u t C LK Out R up1 R up3 Vd d R up2 C MD In C MD O u t D AT3 In D AT3 O u t D AT2 In D AT2 O u t Figure 2 - Recommended Layout using Ground Vias Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering and ESD performance of the device. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Figure 2 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance. Layout Guidelines for Optimum ESD Protection Good circuit board layout is critical not only for signal integrity, but also for effective suppression of ESD induced transients. For optimum ESD protection, the following guidelines are recommended: Place the device as close to the connector as possible. This practice restricts ESD coupling into adjacent traces and reduces parasitic inductance. The ESD transient return path to ground should be kept as short as possible. Whenever possible, use multiple micro vias connected directly from the device ground pad to the ground plane. Avoid running critical signals near board edges. 2006 Semtech Corp. 5 www.semtech.com EClamp2410P PRELIMINARY MicroSD Connector PROTECTION PRODUCTS Applications Information DAT 1 IN DAT 1 OUT DAT 0 IN DAT 0 OUT CLK IN CLK OUT Rup 15KΩ Rup 15KΩ VDD Rup 50KΩ CMD IN CMD OUT DAT 3 IN DAT 3 OUT DAT 2 IN DAT 2 OUT Host IC EClamp2410P Figure 3 - MicroSD Protection 2006 Semtech Corp. 6 www.semtech.com EClamp2410P PRELIMINARY PROTECTION PRODUCTS Applications Information - Spice Model Pin 4, 13 Pin 12 Rup 15K Pin 1, 8, 2, 6 Rup 50K Pin 7 Pin 9, 16, 11, 15 R1 45 Ohms Pin 10 R1 45 Ohms DAT1, DAT2, DAT0, CMD DAT3 Pin 5 Pin 3 R1 Pin 14 45 Ohms CLK VDD Spice Model EClamp2410P Spice Parameters 2006 Semtech Corp. Parameter Unit D1 (TVS) IS Amp 2E-15 BV Volt 7.46 VJ Volt 0.777 RS Ohm 1.00 IBV Amp 1E-3 CJO Farad 10E-12 TT sec 2.541E-9 M -- 0.246 N -- 1.1 EG eV 1.11 7 www.semtech.com EClamp2410P PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SLP4016P16 A B D DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C C A1 A2 D1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 0.50 0.58 0.65 .000 .001 .002 0.00 .003 0.05 (0. 13) (. 005) .007 .010 .012 0.20 0.25 0.30 .153 .157 .161 3.90 4.00 4.10 .122 .126 .130 3.10 3.20 3.30 .059 .063 .067 1.50 1.60 1.70 .010 .016 .020 0.25 0.40 0.50 .020 BSC 0.50 BSC .011 .013 .015 0.28 0.33 0.38 16 16 .003 0.08 .004 0.10 1 2 LxN E/2 E1 N bxN e bbb C A B D/2 NOT ES: 1. CO NTRO LLING DI MENSIO NS ARE I N MILLI METERS (ANG LES IN DEG REES). 2. CO PLANARIT Y APPLIES T O T HE EXPO SED PAD AS W ELL AS T HE TERM INALS. Land Pattern - SLP4016P16 P X Z F G Y (C) DIM B C F G P X Y Z DIMENSIONS INCHES MILLIMETERS .130 3.30 .060 1.52 .018 0.45 .035 0.89 .020 0.50 .012 0.30 .025 0.63 .085 2.15 B NOTES: 1. T HI S LAND PAT TERN IS F O R REF ERENCE PURPO SES O NLY. CO NSULT YO UR M ANUFACTURING G RO UP T O ENSURE YO UR CO MPANY'S M ANUFACTURING G UIDELINES ARE MET. 2006 Semtech Corp. 8 www.semtech.com EClamp2410P PRELIMINARY PROTECTION PRODUCTS Marking Ordering Information 2410P YW PIN 1 IND IC ATOR (LASER MAR K) Part Number Qty per Reel Reel Size EClamp2410P.TCT 3,000 7 inch EMIClamp and EClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.78 +/-0.10 mm B0 K0 4.30 +/-0.10 mm 0.74 +/-0.10 mm Tape Width B, (Max) D D1 12 mm 8.2 mm (.476) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 1.0 mm ±0.05 (.039) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 5.5±0.05 mm (.217±.002) 4.5 mm (.177) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 12.0 mm + 0.3 mm - 0.1 mm (.472±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2006 Semtech Corp. 9 www.semtech.com