EClamp2454P ESD/EMI Protection for Color LCD Interfaces PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClampTM2454P is a (L-C) low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD and camera lines in cellular phones and other portable electronics. Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) Filter performance: 40dB minimum attenuation at The device consists of four identical circuits comprised of TVS diodes for ESD protection, and a 5-pole inductor - capacitor network for EMI/RFI filtering. A typical inductor value of 28nH and a capacitor value of 12pF are used to achieve 40dB minimum attenuation at 800MHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. 800MHz to 2.7GHz TVS working voltage: 5V Inductor: 28nH (Typical) Capacitors: 12pF (Typical at VR = 2.5V) Protection and filtering for four lines Solid-state technology Mechanical Characteristics The EClamp2454P is in a 8-pin, RoHS/WEEE compliant, SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs. SLP2116P8 8-pin package RoHS/WEEE Compliant Nominal Dimensions: 2.1 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPd Marking: Marking Code Packaging: Tape and Reel per EIA 481 Applications Color LCD Protection Cell Phone CCD Camera Lines Clamshell Cell Phones Package Configuration Circuit Diagram (Each Line) 2.10 1 2 L1 L2 IN 1.60 OUT C1 C2 C3 0.50 BSC 0.58 GND 8 Pin SLP package (Bottom Side View) Nominal Dimensions in mm Device Schematic (4X) Revision 03/29/2006 1 www.semtech.com EClamp2454P PRELIMINARY PROTECTION PRODUCTS Maximum Ratings R ating Symbol Value Units VESD +/- 20 +/- 15 kV Junction Temp erature TJ 125 o Op erating Temp erature Top -40 to +85 o Storage Temp erature TSTG -55 to +150 o ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) C C C Electrical Characteristics (T=25oC) P ar am et er S y m b ol Con d i t i on s T VS Reverse Stand-Off Voltage VRWM T VS Reverse Breakdown Voltage V BR It = 1mA IR VRWM = 3.3V T VS Reverse Leakage Current DC Resistance RDC Filter Cut-Off Frequency fc Inductance L Mi n i mu m 6 ZSource = ZLoad = 50 Ohms Ty p i c a l 8 M ax i m u m Units 5 V 10 V 0.1 µA 33 Ohms 155 MHz 28 nH 56 nH L1 + L2 Each Line Capacitance C1 , C2 , C3 VR = 2.5V, f = 1MHz 10 12 15 pF Total Capacitance C1 + C2 + C3 Input to Gnd, Each Line VR = 2.5V, f = 1MHz 30 36 45 pF Total Series Inductance 2006 Semtech Corp. 2 www.semtech.com EClamp2454P PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 S21 LOG Analog Crosstalk (Each Line) 6 dB / REF 0 dB CH1 S21 LOG 20 dB /REF 0 dB 1: -5.3134 dB 156 MHz 0 dB -6 dB 2: -41.559 dB 800 MHz 1 3: -41.327 dB 1.8 GHz -12 dB -18 dB 4: -40.105 dB 2.7 GHz -24 dB -30 dB -36 dB 4 -42 dB 2 3 -48 dB -54 dB 1 MHz 100 MHz 10 MHz 1 3 GHz GHz START . 030 MHz STOP 3000. 000000 MHz STOP 3000. 000000 MHz START. 030 MHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Note: Data is taken with a 10x attenuator Note: Data is taken with a 10x attenuator Capacitance vs. Reverse Voltage (Normalized to 2.5 volts) 2 CJ(VR) / CJ(VR=0) 1.5 1 0.5 f = 1 MHz 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Reverse Voltage - VR (V) 2006 Semtech Corp. 3 www.semtech.com EClamp2454P PRELIMINARY PROTECTION PRODUCTS Device Connection Figure 1 - Pin Identification and Configuration (Top Side View) The EClamp2454P is comprised of four identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. In 1 In 2 In 3 In 4 Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by Equation 1. Equation 1: The Impedance of an Inductor at Frequency XLF XLF(L, f ) = 2 * π * f * L 8 Gnd 4 5 Out 1 Out 2 Out 3 Out 4 Pin Identification 1-4 Inp ut Lines 5-8 Outp ut Lines Center Tab Ground Figure 2 - Inductance of Rectangular Wire Loops Where: L= Inductance (H) f = Frequency (Hz) Ground Via 1 Ground Via 2 d Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. 2006 Semtech Corp. 1 Signal Layer x Ground Layer Layer y Equation 2: Inductance of Rectangular Wire Loop [ LRECT(d, x , y) = 10.16 *10 −9 * x * ln [ ] + y * ln[ ]] 2*y d 2*x d Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in) 4 www.semtech.com EClamp2454P PRELIMINARY PROTECTION PRODUCTS Applications Information Figure 4 - Filter Characteristics Using Recommended Layout with Internal Vias Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 in highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using Semtech’s filter evaluation board with 50 Ohm traces and the recommended via configuration. CH1 S21 LOG 6 dB / REF 0 dB 1: -5.3134 dB 156 MHz 0 dB -6 dB 2: -41.559 dB 800 MHz 1 3: -41.327 dB 1.8 GHz -12 dB -18 dB 4: -40.105 dB 2.7 GHz -24 dB -30 dB -36 dB 4 -42 dB 2 3 -48 dB -54 dB Figure 3 - Recommended Layout Using Ground Vias 1 MHz START. 030 MHz 2006 Semtech Corp. 5 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz www.semtech.com EClamp2454P PRELIMINARY PROTECTION PRODUCTS Applications Information - Spice Model EClamp2454P Spice Model & Parameters Line In 0.5nH 0.5nH L Line Out 56nH EClamp2454P Spice Model Table 1 - EClamp2454P Spice Parameters 2006 Semtech Corp. Parameter Unit D1 (T VS) D2 (T VS) IS Amp 4.09E-15 4.09E-15 BV Volt 7.44 7.44 VJ Volt 0.744 0.744 RS Ohm 0.584 0.584 IB V Amp 1E-3 1E-3 CJO Farad 31E-12 31E-12 TT sec 2.541E-9 2.541E-9 M -- 0.23 0.23 N -- 1.1 1.1 EG eV 1.11 1.11 6 www.semtech.com EClamp2454P PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SLP2116P8 A B D DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A2 A1 C D1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 - .001 .002 (.006) .007 .010 .012 .079 .083 .087 .061 .067 .071 .059 .063 .067 .010 .016 .020 .020 BSC .011 .013 .015 6 .003 .004 0.50 0.58 0.65 0.00 .003 0.05 (0.15) 0.20 0.25 0.30 2.00 2.10 2.20 1.55 1.70 1.80 1.50 1.60 1.70 0.25 0.40 0.50 0.50 BSC 0.28 0.33 0.38 6 0.08 0.10 1 2 LxN E/2 E1 N bxN bbb e C A B D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP2116P8 P X DIMENSIONS Z (C) F G Y DIM B C F G P X Y Z INCHES .071 .060 .018 .035 .020 .012 .025 .085 MILLIMETERS 1.80 1.52 0.45 0.89 0.50 0.30 0.63 2.15 B NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2006 Semtech Corp. 7 www.semtech.com EClamp2454P PRELIMINARY PROTECTION PRODUCTS Marking Ordering Information 2454P PIN 1 INDICATOR YW Part Number Qty per Reel Reel Size EClamp2454P.TCT 3000 7 Inch This is a lead-free RoHS/WEEE Compliant Device EMIClamp and EClamp are marks of Semtech Corporation YW = Date Code (Y=Year, W=Week) Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.96 +/-0.05 mm B0 K0 2.31 +/-0.05 mm 0.74 +/-0.05 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2006 Semtech Corp. 8 www.semtech.com