Information EV Socket Package Drawings EV-9200 Series EV-9500 Series Third Party Document No. U14777EJ1V1IF00 (1st edition) Date Published September 2001 N CP(K) 2001 © 1991 Printed in Japan [MEMO] 2 Information U14777EJ1V1IF V800 Series is a trademark of NEC Corporation. • The information in this document is current as of June, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. 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"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 Information U14777EJ1V1IF 3 Regional Information Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify: • Device availability • Ordering information • Product release schedule • Availability of related technical literature • Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) • Network requirements In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. NEC Electronics Inc. (U.S.) NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd. Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580 Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 NEC Electronics Hong Kong Ltd. Velizy-Villacoublay, France Tel: 01-3067-5800 Fax: 01-3067-5899 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411 NEC Electronics (France) S.A. NEC Electronics Singapore Pte. Ltd. Madrid Office Madrid, Spain Tel: 091-504-2787 Fax: 091-504-2860 Novena Square, Singapore Tel: 253-8311 Fax: 250-3583 NEC Electronics (France) S.A. NEC Electronics (Germany) GmbH Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490 NEC Electronics (UK) Ltd. Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 NEC Electronics Taiwan Ltd. NEC Electronics Italiana s.r.l. NEC Electronics (Germany) GmbH Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99 Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388 Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951 NEC do Brasil S.A. Electron Devices Division Guarulhos-SP, Brasil Tel: 11-6462-6810 Fax: 11-6462-6829 J01.2 4 Information U14777EJ1V1IF INTRODUCTION EV sockets (EV-9200 Series, EV-9500 Series, and third-party sockets) are sockets or adapters that facilitate the connection of emulation probes to target systems. This document describes the dimensions and wiring of EV sockets, as well as the recommended mount pad dimensions on the target system side. For the EV socket usage method, refer to the user's manual of the relevant in-circuit emulator or device. When purchasing an EV socket, be careful to select a socket suitable for the intended purpose by checking the user's manual of the device or in-circuit emulator, or Single-chip Microcontroller Development Tool Selection Guide (U11069E) and V800 Series TM Development Environment (U10782E). The following section shows an example of the connection of an in-circuit emulator and a socket mounted on a target board (connection of IE-78001-R-A and EV-9200G-64). 64-Pin GF Emulation Probe Connection Diagram Earth clip 64-pin GF IE-78001-R-A 64 52 Conversion socket External sense clip 51 19 33 20 32 Target system Information U14777EJ1V1IF 5 CONTENTS CHAPTER 1 EV-9200 SERIES ...................................................................................................................8 1.1 EV-9200G-44 ....................................................................................................................................................8 1.2 EV-9200G-64 ..................................................................................................................................................10 1.3 EV-9200GC-64 ...............................................................................................................................................12 1.4 EV-9200G-74 ..................................................................................................................................................14 1.5 EV-9200G-80 ..................................................................................................................................................16 1.6 EV-9200GC-80 ...............................................................................................................................................18 1.7 EV-9200G-94 ..................................................................................................................................................20 1.8 EV-9200GF-100..............................................................................................................................................22 1.9 EV-9900 (Pull-Out Jig)...................................................................................................................................24 CHAPTER 2 EV-9500 SERIES .................................................................................................................25 2.1 EV-9500GS-20 (Flexible Type)......................................................................................................................25 2.2 EV-9500GT-28 (SOP) (Flexible Type)...........................................................................................................26 2.3 EV-9500GT-30 (SSOP) (Flexible Type) ........................................................................................................27 2.4 EV-9500GS-36 (Flexible Type) .....................................................................................................................28 2.5 EV-9500GT-38 (Flexible Type)......................................................................................................................29 2.6 EV-9500GT-42 (Flexible Type)......................................................................................................................30 2.7 EV-9500GT-48 (Flexible Type)......................................................................................................................31 2.8 EV-9501GS-20 (Flexible Type)......................................................................................................................32 2.9 EV-9501GC-100 .............................................................................................................................................33 CHAPTER 3 THIRD-PARTY PRODUCTS................................................................................................34 3.1 Sockets and Adapters Made by TOKYO ELETECH CORP. .......................................................................34 3.1.1 Package drawings ............................................................................................................................34 (1) TGx Series..................................................................................................................................34 <1> TGB-056SBW (old part No.: EV-9500GB-56) .....................................................................34 <2> TGB-064SDP (old part No.: EV-9500GB-64) ......................................................................34 <3> TGK-064SBW (old part No.: EV-9500GK-64) .....................................................................34 <4> TGK-080SDW (old part No.: EV-9500GK-80) .....................................................................34 <5> TGC-100SDW (old part No.: EV-9500GC-100)...................................................................34 <6> TGB-080SDP ......................................................................................................................34 <7> TGF-080RAW .....................................................................................................................34 (2) NQPACK Series + YQPACK Series + YQSOCKET Series ........................................................35 <1> 100-pin GC socket kit (NQPACK100SD + YQPACK100SD + YQSOCKET100SDN) .........35 <2> 100-pin GF socket kit (NQPACK100RB + YQPACK100RB + YQSOCKET100RBN) .........35 <3> 144-pin GC socket kit (NQPACK144SD + YQPACK144SD + YQSOCKET144SDN) .........35 <4> 176-pin GF socket kit (NQPACK176SD + YQPACK176SD + YQSOCKET176SDN) .........35 (3) CSPACK Series + CSICE Series ...............................................................................................36 <1> 121-pin FPBGA socket kit (CSPACK121A1312N02 + CSICE121A1312N02) ....................36 <2> 157-pin FPBGA socket kit (CSPACK157A1614N01 + CSICE157A1614N01) ....................37 3.1.2 Recommended board mounting pattern ...........................................................................................38 (1) TGx Series .................................................................................................................................38 <1> TGB-056SBW (old part No.: EV-9500GB-56) .....................................................................38 <2> TGB-064SDP (old part No.: EV-9500GB-64) ......................................................................38 6 Information U14777EJ1V1IF <3> TGK-064SBW (old part No.: EV-9500GK-64) .................................................................. 38 <4> TGK-80SDW (old part No.: EV-9500GK-80) .................................................................... 38 <5> TGC-100SDW (old part No.: EV-9500GC-100)................................................................ 39 <6> TGB-080SDP ................................................................................................................... 39 <7> TGF-080RAW .................................................................................................................. 39 (2) NQPACK Series + YQPACK Series + YQSOCKET Series....................................................... 40 <1> 100-pin GC socket kit (NQPACK100SD + YQPACK100SD + YQSOCKET100SDN) ...... 40 <2> 100-pin GF socket kit (NQPACK100RB + YQPACK100RB + YQSOCKET100RBN) ...... 40 <3> 144-pin GC socket kit (NQPACK144SD + YQPACK144SD + YQSOCKET144SDN) ...... 40 <4> 176-pin GF socket kit (NQPACK176SD + YQPACK176SD + YQSOCKET176SDN) ...... 40 (3) CSPACK Series + CSICE Series .............................................................................................. 41 <1> 121-pin FPBGA socket kit (CSPACK121A1312N02 + CSICE121A1312N02)..................... 41 <2> 157-pin FBPGA socket kit (CSPACK157A1614N01 + CSICE157A1614N01)............................................................. 41 3.1.3 Cautions ........................................................................................................................................... 42 (1) Cautions related to TGx Series (TQPACK Series + TQSOCKET Series) .................................. 42 (2) Cautions related to NQPACK Series + YQPACK Series + YQSOCKET Series......................... 43 (3) Cautions related to CSPACK Series + CSICE Series ................................................................ 44 (4) Cautions related to NQPACK Series + YQPACK Series............................................................ 45 3.1.4 3.2 3.3 Appendix (NEXB-100-SD/RB) .......................................................................................................... 46 Sockets and Adapters Made by Naito Densei Machida Mfg. Co., Ltd. ..................................................... 47 3.2.1 28GT-IC dummy set (dummy IC + AXS628119P + AXS662821)..................................................... 47 3.2.2 NGS-30 (flexible type) ...................................................................................................................... 48 Third-Party Contact List ............................................................................................................................... 49 Information U14777EJ1V1IF 7 CHAPTER 1 EV-9200 SERIES 1.1 EV-9200G-44 (1) EV-9200G-44 package drawing A M B N O Q F P E L K J C D R EV-9200G-44 1 No.1 pin index G H I EV-9200G-44-G0E ITEM 8 MILLIMETERS INCHES A 15.0 0.591 B 10.3 0.406 C 10.3 0.406 D 15.0 0.591 E 4-C 3.0 4-C 0.118 F 0.8 0.031 G 5.0 0.197 H 12.0 0.472 I 14.7 0.579 J 5.0 0.197 K 12.0 0.472 L 14.7 0.579 M 8.0 0.315 N 7.8 0.307 O 2.0 0.079 P 1.35 0.053 Q 0.35 ± 0.1 0.014 –0.005 R φ 1.5 φ 0.059 Information U14777EJ1V1IF +0.004 CHAPTER 1 EV-9200 SERIES (2) EV-9200G-44 recommended board mounting pattern H G J D E F K I L C B A EV-9200G-44-P1E ITEM MILLIMETERS A 15.7 B 11.0 INCHES 0.618 0.433 C 0.8±0.02 × 10=8.0±0.05 0.031+0.002 –0.001 D 0.8±0.02 × 10=8.0±0.05 0.031+0.002 –0.001 × 0.394=0.315 +0.002 –0.002 × 0.394=0.315 +0.002 –0.002 E 11.0 0.433 F 15.7 0.618 G 5.00 ± 0.08 0.197 +0.003 –0.004 H 5.00 ± 0.08 0.197 +0.003 –0.004 I 0.5 ± 0.02 0.02 +0.001 –0.002 J φ 1.57 ± 0.03 φ 0.062 +0.001 –0.002 K φ 2.2 ± 0.1 φ 0.087 +0.004 –0.005 L φ 1.57 ± 0.03 φ 0.062 +0.001 –0.002 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Information U14777EJ1V1IF 9 CHAPTER 1 EV-9200 SERIES 1.2 EV-9200G-64 (1) EV-9200G-64 package drawing A N G O P L M U K C E D T S B R F EV-9200G-64 1 Q No.1 pin index H I J EV-9200G-64-G0E ITEM 10 MILLIMETERS INCHES A 25.0 0.984 B 20.30 0.799 C 4.0 0.157 D 14.45 0.569 E 19.0 0.748 F 4-C 2.8 4-C 0.11 G 0.8 0.031 H 11.0 0.433 I 22.0 0.866 J 24.7 0.972 K 5.0 0.197 L 16.2 0.638 M 18.9 0.744 N 8.0 0.315 O 7.8 0.307 P 2.5 0.098 Q 2.0 0.079 R 1.35 0.053 S 0.35 ± 0.1 0.014–0.005 T φ 2.3 φ 0.091 U φ 1.5 φ 0.059 Information U14777EJ1V1IF +0.004 CHAPTER 1 EV-9200 SERIES (2) EV-9200G-64 recommended board mounting pattern G J H I D F E L K M C B A EV-9200G-64-P1E ITEM MILLIMETERS A B INCHES 25.7 1.012 21.0 0.827 C +0.002 1.0±0.02 × 18=18.0±0.05 0.039 +0.002 –0.001 × 0.709=0.709 –0.003 D +0.003 1.0±0.02 × 12=12.0±0.05 0.039 +0.002 –0.001 × 0.472=0.472 –0.002 E 15.2 0.598 F 19.9 0.783 G 11.00 ± 0.08 0.433 +0.004 –0.003 H 5.50 ± 0.03 0.217 +0.001 –0.002 I 5.00 ± 0.08 0.197 +0.003 –0.004 J 2.50 ± 0.03 0.098 +0.002 –0.001 K 0.6 ± 0.02 0.024+0.001 –0.002 L φ 2.36 ± 0.03 φ 0.093 +0.001 –0.002 M φ 1.57 ± 0.03 φ 0.062 +0.001 –0.002 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Information U14777EJ1V1IF 11 CHAPTER 1 EV-9200 SERIES 1.3 EV-9200GC-64 (1) EV-9200GC-64 package drawing A L T K J C D S O Q N F R B E M EV-9200GC-64 1 P No.1 pin index G H I EV-9200GC-64-G0E ITEM 12 MILLIMETERS INCHES A 18.8 0.74 B 14.1 0.555 C 14.1 0.555 D 18.8 0.74 E 4-C 3.0 4-C 0.118 F 0.8 0.031 G 6.0 0.236 H 15.8 0.622 I 18.5 0.728 J 6.0 0.236 K 15.8 0.622 L 18.5 0.728 M 8.0 0.315 N 7.8 0.307 O 2.5 0.098 P 2.0 0.079 Q 1.35 0.053 R 0.35 ± 0.1 0.014 +0.004 –0.005 S φ 2.3 φ 0.091 T φ 1.5 φ 0.059 Information U14777EJ1V1IF CHAPTER 1 EV-9200 SERIES (2) EV-9200GC-64 recommended board mounting pattern G J H D F E K I L C B A EV-9200GC-64-P1E ITEM MILLIMETERS A B INCHES 19.5 0.768 14.8 0.583 C +0.003 0.8±0.02 × 15=12.0±0.05 0.031+0.002 –0.001 × 0.591=0.472 –0.002 D +0.003 0.8±0.02 × 15=12.0±0.05 0.031+0.002 –0.001 × 0.591=0.472 –0.002 E 14.8 0.583 F 19.5 0.768 G 6.00 ± 0.08 0.236 +0.004 –0.003 H 6.00 ± 0.08 0.236 +0.004 –0.003 I 0.5 ± 0.02 0.197 +0.001 –0.002 J φ 2.36 ± 0.03 φ 0.093 +0.001 –0.002 K φ 2.2 ± 0.1 φ 0.087 +0.004 –0.005 L φ 1.57 ± 0.03 φ 0.062 +0.001 –0.002 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Information U14777EJ1V1IF 13 CHAPTER 1 EV-9200 SERIES 1.4 EV-9200G-74 (1) EV-9200G-74 package drawing A M E1 N O L T K J C D S R F Q B EV-9200G-74 E2 1 P No.1 pin index G H I EV-9200G-74-G0E ITEM 14 MILLIMETERS INCHES A 25.0 0.984 B 20.35 0.801 C 20.35 0.801 D 25.0 0.984 E1 4-C 2.8 4-C 0.11 E2 C 1.5 C 0.059 F 1.0 0.039 G 11.0 0.433 H 22.0 0.866 I 24.7 0.972 J 5.0 0.197 K 22.0 0.866 L 24.7 0.972 M 8.0 0.315 N 7.8 0.307 O 2.5 0.098 P 2.0 0.079 Q 1.35 0.053 +0.004 –0.005 R 0.35 ± 0.1 0.014 S φ 2.3 φ 0.091 T φ 1.5 φ 0.059 Information U14777EJ1V1IF CHAPTER 1 EV-9200 SERIES (2) EV-9200G-74 recommended board mounting pattern G H D E K I F J C B A EV-9200G-74-P1E ITEM MILLIMETERS A 25.7 B 21.0 INCHES 1.012 0.827 C 1.0±0.02 × 18=18.0±0.05 D +0.002 1.0±0.02 × 18=18.0±0.05 0.039 +0.002 –0.001 × 0.709=0.709 –0.003 0.039 +0.002 –0.001 × 0.709=0.709 +0.002 –0.003 E 21.0 0.827 F 25.7 1.012 G 11.00 ± 0.08 0.433 +0.004 –0.003 H 5.00 ± 0.08 0.197 +0.003 –0.004 I 0.6 ± 0.02 0.024 +0.001 –0.002 J φ 2.36 ± 0.03 φ 0.093 +0.001 –0.002 K φ 1.57 ± 0.03 φ 0.062 +0.001 –0.002 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Information U14777EJ1V1IF 15 CHAPTER 1 EV-9200 SERIES 1.5 EV-9200G-80 (1) EV-9200G-80 package drawing N B O P S G R A L M U K E D C T F EV-9200G-80 1 Q No.1 pin index H I J EV-9200G-80-G0E ITEM 16 MILLIMETERS INCHES A 25.0 0.984 B 20.30 0.799 C 4.0 0.157 D 14.45 0.569 E 19.0 0.748 F 4-C 2.8 4-C 0.11 G 0.8 0.031 H 11.0 0.433 I 22.0 0.866 J 24.7 0.972 K 5.0 0.197 L 16.2 0.638 M 18.9 0.744 N 8.0 0.315 O 7.8 0.307 P 2.5 0.098 Q 2.0 0.079 R 1.35 0.053 S 0.35 ± 0.1 0.014–0.005 T φ 2.3 φ 0.091 U φ 1.5 φ 0.059 Information U14777EJ1V1IF +0.004 CHAPTER 1 EV-9200 SERIES (2) EV-9200G-80 recommended board mounting pattern G J H I D E F L K M C B A EV-9200G-80-P1E ITEM MILLIMETERS A 25.7 B 21.0 INCHES 1.012 0.827 C 0.8±0.02 × 23=18.4±0.05 D +0.003 0.8±0.02 × 15=12.0±0.05 0.031+0.002 –0.001 × 0.591=0.472 –0.002 0.031+0.002 –0.001 × 0.906=0.724 +0.003 –0.002 E 15.2 0.598 F 19.9 0.783 G 11.00 ± 0.08 0.433 +0.004 –0.003 H 5.50 ± 0.03 0.217 +0.001 –0.002 I 5.00 ± 0.08 0.197 +0.003 –0.004 J 2.50 ± 0.03 0.098 +0.002 –0.001 K 0.5 ± 0.02 0.02 +0.001 –0.002 L φ 2.36 ± 0.03 φ 0.093+0.001 –0.002 M φ 1.57 ± 0.03 φ 0.062+0.001 –0.002 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Information U14777EJ1V1IF 17 CHAPTER 1 EV-9200 SERIES 1.6 EV-9200GC-80 (1) EV-9200GC-80 package drawing A E M B N O L K S J C D R F EV-9200GC-80 Q 1 No.1 pin index P G H I EV-9200GC-80-G1E ITEM 18 MILLIMETERS INCHES A 18.0 0.709 B 14.4 0.567 C 14.4 0.567 D 18.0 0.709 E 4-C 2.0 4-C 0.079 F 0.8 0.031 G 6.0 0.236 H 16.0 0.63 I 18.7 0.736 J 6.0 0.236 K 16.0 0.63 L 18.7 0.736 M 8.2 0.323 N 8.0 0.315 O 2.5 0.098 P 2.0 0.079 Q 0.35 0.014 R φ 2.3 φ 0.091 S φ 1.5 φ 0.059 Information U14777EJ1V1IF CHAPTER 1 EV-9200 SERIES (2) EV-9200GC-80 recommended board mounting pattern G J H D F E K I L C B A EV-9200GC-80-P1E ITEM MILLIMETERS A 19.7 B 15.0 INCHES 0.776 0.591 C 0.65±0.02 × 19=12.35±0.05 D +0.003 0.65±0.02 × 19=12.35±0.05 0.026 +0.001 –0.002 × 0.748=0.486 –0.002 0.026+0.001 –0.002 × 0.748=0.486 +0.003 –0.002 E 15.0 0.591 F 19.7 0.776 G 6.0 ± 0.05 0.236 +0.003 –0.002 H 6.0 ± 0.05 0.236 +0.003 –0.002 I 0.35 ± 0.02 0.014 +0.001 –0.001 J φ 2.36 ± 0.03 φ 0.093+0.001 –0.002 K φ 2.3 φ 0.091 L φ 1.57 ± 0.03 φ 0.062+0.001 –0.002 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Information U14777EJ1V1IF 19 CHAPTER 1 EV-9200 SERIES 1.7 EV-9200G-94 (1) EV-9200G-94 package drawing A M N O L K T J C D S R F Q B E1 EV-9200G-94 E2 1 No.1 pin index P G H I EV-9200G-94-G0E ITEM 20 MILLIMETERS INCHES A 25.0 0.984 B 20.35 0.801 C 20.35 0.801 D 25.0 0.984 E1 4-C 2.8 4-C 0.11 E2 C 1.5 C 0.059 F 0.8 0.031 G 11.0 0.433 H 22.0 0.866 I 24.7 0.972 J 5.0 0.197 K 22.0 0.866 L 24.7 0.972 M 8.0 0.315 N 7.8 0.307 O 2.5 0.098 P 2.0 0.079 Q 1.35 0.053 R 0.35 ± 0.1 0.014 –0.005 S φ 2.3 φ 0.091 T φ 1.5 φ 0.059 Information U14777EJ1V1IF +0.004 CHAPTER 1 EV-9200 SERIES (2) EV-9200G-94 recommended board mounting pattern G H E F D J I K C B A EV-9200G-94-P1E ITEM MILLIMETERS A 25.7 B 21.0 INCHES 1.012 0.827 C 0.8±0.02 × 23=18.4±0.05 D +0.003 0.8±0.02 × 23=18.4±0.05 0.031+0.002 –0.001 × 0.906=0.724 –0.002 0.031+0.002 –0.001 × 0.906=0.724 +0.003 –0.002 E 21.0 0.827 F 25.7 1.012 G 11.00 ± 0.08 0.433 +0.004 –0.003 H 5.00 ± 0.08 0.197 +0.003 –0.004 I 0.5 ± 0.02 0.02 +0.001 –0.002 J φ 2.36 ± 0.03 φ 0.093+0.001 –0.002 K φ 1.57 ± 0.03 φ 0.062+0.001 –0.002 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Information U14777EJ1V1IF 21 CHAPTER 1 EV-9200 SERIES 1.8 EV-9200GF-100 (1) EV-9200GF-100 package drawing A B E M N O L K S J D C R F EV-9200GF-100 Q 1 No.1 pin index P G H I EV-9200GF-100-G0E ITEM 22 MILLIMETERS INCHES A 24.6 0.969 B 21 0.827 C 15 0.591 D 18.6 0.732 E 4-C 2 4-C 0.079 F 0.8 0.031 G 12.0 0.472 H 22.6 0.89 I 25.3 0.996 J 6.0 0.236 K 16.6 0.654 L 19.3 0.76 M 8.2 0.323 N 8.0 0.315 O 2.5 0.098 P 2.0 0.079 Q 0.35 0.014 R φ 2.3 φ 0.091 S φ 1.5 φ 0.059 Information U14777EJ1V1IF CHAPTER 1 EV-9200 SERIES (2) EV-9200GF-100 recommended board mounting pattern G J H D F E K I L C B A EV-9200GF-100-P1E ITEM MILLIMETERS A 26.3 B 21.6 INCHES 1.035 0.85 C 0.65±0.02 × 29=18.85±0.05 D +0.003 0.65±0.02 × 19=12.35±0.05 0.026 +0.001 –0.002 × 0.748=0.486 –0.002 0.026 +0.001 –0.002 × 1.142=0.742+0.002 –0.002 E 15.6 0.614 F 20.3 0.799 G 12 ± 0.05 0.472 +0.003 –0.002 H 6 ± 0.05 0.236 +0.003 –0.002 I 0.35 ± 0.02 0.014 +0.001 –0.001 J φ 2.36 ± 0.03 φ 0.093+0.001 –0.002 K φ 2.3 φ 0.091 L φ 1.57 ± 0.03 φ 0.062+0.001 –0.002 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Information U14777EJ1V1IF 23 CHAPTER 1 EV-9200 SERIES 1.9 EV-9900 (Pull-Out Jig) • Overview The EV-9900 is a jig used to remove a device mounted in an LCC socket. • Usage method Insert the cam of the jig in one of the grooves at the socket's four corners and slant the holder toward the outside NEC Holder EV - 9900 to lift the device, and then remove the device. Device Pull-out jig cam (Examples) EV-9200G-64 EV-9200G-80 Socket 24 Information U14777EJ1V1IF CHAPTER 2 EV-9500 SERIES 2.1 EV-9500GS-20 (Flexible Type) 22.0 15 12.5 10.5 2.5 2 2 6.075 16 26 W0.3 0.65 × 9 = 5.85 22.5 23− 3 φ 15 100 10.5 Remark Unit = mm Information U14777EJ1V1IF 25 CHAPTER 2 EV-9500 SERIES 2.2 EV-9500GT-28 (SOP) (Flexible Type) 100 32 22 2 14 20.0 16.29 14.29 5.71 15.5 1 15 3.71 28 0.5 P1.27 × 13 28.5 Remark Unit = mm 26 Information U14777EJ1V1IF CHAPTER 2 EV-9500 SERIES 2.3 EV-9500GT-30 (SSOP) (Flexible Type) 15.5 12.75 10.95 4.55 2.75 2 23 20.5 13 0.2 2.74 0.65 φ 2− 3 15.5 100 22.5 15.5 Remark Unit = mm Information U14777EJ1V1IF 27 CHAPTER 2 EV-9500 SERIES 2.4 EV-9500GS-36 (Flexible Type) 18 14 12 6 4 2 2 5.20 22 W0.35 0.8 × 17 = 13.6 32 28.5 φ 2− 3 18.0 100 25.0 18.5 Remark Unit = mm 28 Information U14777EJ1V1IF CHAPTER 2 EV-9500 SERIES 2.5 EV-9500GT-38 (Flexible Type) 19.50 14.75 12.45 6.55 4.75 20.25 0.20 25.00 0.65 21.50 15.00 2.00 2.65 2− 3 φ 19.5 100 26.5 18 29.81 21.29 60.0 Remark Unit = mm Information U14777EJ1V1IF 29 CHAPTER 2 EV-9500 SERIES 2.6 EV-9500GT-42 (Flexible Type) 19.9 16.24 14.24 5.66 3.66 2.4 2 2 1.8 4.5 0.35 0.8 32 16 28.5 26.9 φ 2− 3 19.9 100 25.5 Remark Unit = mm 30 Information U14777EJ1V1IF CHAPTER 2 EV-9500 SERIES 2.7 EV-9500GT-48 (Flexible Type) 20 16.29 14.29 5.71 3.71 2.4 2 2 4.525 0.3 1.8 0.65 32 28.5 27.0 φ 2− 3 20.0 100 25.5 Remark Unit = mm Information U14777EJ1V1IF 31 CHAPTER 2 EV-9500 SERIES 2.8 EV-9501GS-20 (Flexible Type) 15 12.3 10.3 2.7 2 2-2.4 2 1.27 3.785 17 26 W0.4 22.5 22.0 φ 2− 3 15 100 10.5 Remark Unit = mm 32 Information U14777EJ1V1IF CHAPTER 2 EV-9500 SERIES EV-9501GC-100 60.0 60.0 60.0 21.55 60.0 EV-9200G-120 3.2 10.5 8.0 EV-9200GD-120 21.7 2.9 21.55 EV-9501GC-100-G0 Information U14777EJ1V1IF 33 CHAPTER 3 THIRD-PARTY PRODUCTS 3.1 Sockets and Adapters Made by TOKYO ELETECH CORP. 3.1.1 Package drawings (1) TGx Series Figure 3-1. Product Dimensions K W L M X Y M: 13.8 mm (Common to all products) W: Hollow set screw (M2 × 5 mm) Part No. Configuration X+Y Dimensions (mm) K L TGB-056SBW TQPACK056SB + TQSOCKET056SBW 17.1 17.1 TGB-064SDP TQPACK064SD + TQSOCKET064SDP 16.0 16.0 TGK-064SBW TQPACK064SB + TQSOCKET064SBW 18.4 18.4 TGK-080SDW TQPACK080SD + TQSOCKET080SDW 18.0 18.0 TGC-100SDW TQPACK100SD + TQSOCKET100SDW 21.55 21.55 TGB-080SDP TQPACK080SD + TQSOCKET080SDP 18.0 18.0 TGF-080RAW TQPACK080RA + TQSOCKET080RAW 20.65 27.05 34 Information U14777EJ1V1IF CHAPTER 3 THIRD-PARTY PRODUCTS (2) NQPACK Series + YQPACK Series + YQSOCKET Series Figure 3-2. Package Dimensions F K N J N P I M L H G User board I: YQGUIDE M: 13.3 mm (common to all products) N: 3.2 mm (common to all products) P: 19.7 mm (common to all products) F: Printed board for ICE connection Configuration G+H+J Dimensions (mm) K L NQPACK100SD + YQPACK100SD + YQSOCKET100SDN 21.55 21.55 NQPACK100RB + YQPACK100RB + YQSOCKET100RBN 23.75 30.25 NQPACK144SD + YQPACK144SD + YQSOCKET144SDN 29.0 29.0 NQPACK176SD + YQPACK176SD + YQSOCKET176SDN 33.0 33.0 Remark Customers intending to use the NQPACK100RB + YQPACK100RB + YQSOCKET100RNB should refer to 3.1.4 Appendix (NEXB-100-SD/RB). Information U14777EJ1V1IF 35 CHAPTER 3 THIRD-PARTY PRODUCTS (3) CSPACK Series + CSICE Series <1> 121-pin FPBGA socket kit (CSPACK121A1312N02 + CSICE121A1312N02) 3.2 2.8 11.1 17.4 21.55 21.55 4.0 13.0 Remarks 1. The only device to use the 121-pin FPBGA socket kit is the V850/SA1. 2. Unit: mm 36 Information U14777EJ1V1IF CHAPTER 3 THIRD-PARTY PRODUCTS <2> 157-pin FPBGA socket kit (CSPACK157A1614N01 + CSICE157A1614N01) 3.2 2.8 11.1 17.4 29.0 29.0 6.4 15.4 Remarks 1. The only device to use the 157-pin FPBGA socket kit is the V850E/MS1. 2. Unit: mm Information U14777EJ1V1IF 37 CHAPTER 3 THIRD-PARTY PRODUCTS 3.1.2 Recommended board mounting pattern (1) TGx Series <1> TGB-056SBW (old part No.: EV-9500GB-56) <2> TGB-064SDP (old part No.: EV-9500GB-64) 0.65 × 13 = 8.45 0.65 0.5 × 15 = 7.5 0.35 0.25 2.3 0.5 IC Pin No.1 13 8.4 13.5 2 9.5 IC Pin No.1 2.0 9.5 2.3 13.5 13 <3> TGK-064SBW (old part No.: EV-9500GK-64) <4> TGK-80SDW (old part No.: EV-9500GK-80) 0.5 × 19 = 9.5 0.65 × 15 = 9.75 0.35 0.25 2.3 0.5 2 0.65 8.4 11 2.3 15 Caution 15 15 11 2 10.4 IC Pin No.1 IC Pin No.1 10.4 15 Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Remark Unit = mm 38 Information U14777EJ1V1IF CHAPTER 3 THIRD-PARTY PRODUCTS <5> TGC-100SDW (old part No.: EV-9500GC-100) <6> TGB-080SDP 0.5 × 24 = 12.0 0.5 × 19 = 9.5 0.25 0.5 0.25 2.3 2.15 0.5 IC Pin No.1 2.3 2.15 13.2 15 10.4 17.5 13.2 IC Pin No.1 10.4 15 17.5 <7> TGF-080RAW 0.8 0.5 1.7 0.8 × 15 = 12.0 1.7 23 19.6 0.8 × 23 = 18.4 IC Pin No.1 13.6 17 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Remark Unit = mm Information U14777EJ1V1IF 39 CHAPTER 3 THIRD-PARTY PRODUCTS (2) NQPACK Series + YQPACK Series + YQSOCKET Series <1> 100-pin GC socket kit <2> 100-pin GF socket kit (NQPACK100SD + YQPACK100SD + (NQPACK100RB + YQPACK100RB + YQSOCKET100SDN) YQSOCKET100RBN) 0.65 × 19 = 12.35 0.5 × 24 = 12.0 6 0.35 0.25 5.8 2.4 0.5 0.65 2 Pin No. 1 φ 3.2 (Hole for SL) φ 2.2 (Hole for SL) 13 3 − φ 1.0 (NQPACK soldering position indication hole) 17 3 − φ 1.0 (NQ soldering position indication hole) 2 24.6 19.8 0.65 × 29 = 18.85 7 17 13 5.8 Pin No. 1 13.8 2.4 18.6 <4> 176-pin GF socket kit <3> 144-pin GC socket kit (NQPACK144SD + YQPACK144SD + (NQPACK176SD + YQPACK176SD + YQSOCKET144SDN) YQSOCKET176SDN) 0.5 × 35 = 17.5 7 0.5 10 0.25 2 0.5 0.5 × 43 = 21.5 Pattern width 0.25 2 Pin No. 1 27.1 φ 3.2 (Hole for SL) φ 3.2 (Hole for SL) 3 − φ 1.0 (NQ soldering position indication hole) 3 − φ 1.0 (NQ soldering position indication hole) 19 23.1 10 23 7 19 Pin No. 1 23.1 2 2 27.1 23 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Remark Unit = mm 40 Information U14777EJ1V1IF CHAPTER 3 THIRD-PARTY PRODUCTS (3) CSPACK Series + CSICE Series <1> 121-pin FPBGA socket kit <2> 157-pin FBPGA socket kit (CSPACK121A1312N02 + CSICE121A1312N02) (CSPACK157A1614N01 + CSICE157A1614N01) 29.0 21.55 2 4 6 8 10 12 1 3 5 7 9 11 13 4.0 A BC D E F G H J K L M N 15.4 6.8 3 − φ 0.8 Guide hole 6.8 29.0 4.275 3 − φ 0.8 Guide hole 13.0 21.55 No. 1 pin side 6.8 4.275 No. 1 pin side 6.4 13.0 15.4 4.275 0.8 4.0 0.8 6.4 0.8 × 15 = 12.0 Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Remarks 1. Unit = mm 2. : Components with a height of approx. 2.8 mm can be mounted in this area. Information U14777EJ1V1IF 41 CHAPTER 3 THIRD-PARTY PRODUCTS 3.1.3 Cautions (1) Cautions related to TGx Series (TQPACK Series + TQSOCKET Series) <1> Cautions related to TQPACK 1. Material • Contacts: Alloy 42 (nickel-iron alloy) Nickel substrate of 2.5 µm or more, gold plating of 0.25 µm or more • Mold: Crystal polymer (Vectra A130 made by Polyplastics Ltd, with 30% glass fiber content), UL94V-0 fire resistance, surface resistivity = 5 × 1016 Ω, volume resistivity = 3 × 1016 Ω • cm (measurement method: ASTMD257), dielectric constant = 3.8, dielectric dissipation factor = 0.017 (106 Hz: ASTM-D150) 2. Contact resistance: 70 mΩ/pin or less when TQSOCKET is mounted 3. Withstanding voltage: No anomaly observed following application of AC100 V for 1 minute 4. Insulation resistance: 500 MΩ or higher, measured using DC100 V 5. Rated current: Current per pin of 0.5 A or less 6. Chemical resistance: Ability to resist washing with freon (dipping time of 2 minutes or less) 7. Soldering heat resistance: Ability to resist vapor phase soldering (VPS) of 220°C, 60 seconds 8. Usage temperature range: −25°C to +85°C 9. Insertion/extraction force: The force required for extraction from TQSOCKET shall be 60 g or less per pin The forced required for insertion to TQSOCKET shall be 10 g or less per pin 10. Number of insertions/extractions: Number of insertions/extractions to/from TQSOCKET: 100 times MAX. <2> Cautions related to TQSOCKET 1. Material • Contact: 4-sheet configuration, beryllium copper, nickel substrate of 2.5 µm or more, gold plating of 0.25 µm or more • Sleeve: Brass, nickel substrate of 2.5 µm or more, solder plating of 5 µm or more • Insulator: Note Glass epoxy laminate t = 2.4 mm UL94V-0 fire resistance, surface resistivity = 3 × 1014 Ω, volume resistivity = 3 × 1015 Ω • cm, dielectric constant = 4.7, dielectric dissipation factor = 0.017 (106 Hz), measurement method: JIS-C-6481 2. Soldering heat resistance: 260°C × 20 seconds Note Switch to gold plating for sleeves (0.10 µm or more) started from January 1994. 42 Information U14777EJ1V1IF CHAPTER 3 THIRD-PARTY PRODUCTS (2) Cautions related to NQPACK Series + YQPACK Series + YQSOCKET Series 1. When taking out the NQPACK/YQPACK from the case, first remove the sponge while holding down the NQPACK/YQPACK. 2. Leaving the case in a location with a temperature of 50°C or higher for a long time may cause warping. Always store the case in a location with a temperature of 40°C or lower and shielded from direct sunlight. 3. When fixing the YQPACK to the NQPACK with screws, first loosely fix the 4 screws with a No. 0 or No. 1 (Philips tip) precision driver or a torque driver, and then gradually tighten the screws. (Use a maximum torque of 0.054N • m.) Strongly tightening only one screw may cause improper connection. 4. Wrenching or joggling while inserting/extracting YQPACK and YQSOCKET may cause bending of the pins of YQPACK. Therefore insert/extract the YQPACK from all four sides using a minus screwdriver. 5. Component holes at the prescribed locations (4 locations: φ 2.3 mm or φ 3.3 mm) are required on the board to which the YQPACK is connected. Do not use screws with a head size of φ 3.8 mm or φ 4.3 mm because these sizes overlap the wiring prohibited area. 6. When soldering NQPACK, cover NQPACK with HQPACK to protect it from flux spattering on it. • Recommended soldering conditions: Solder reflow: 240°C × 20 seconds or less Hand soldering: 240°C × 10 seconds or less In addition to the above soldering conditions, the use of hot blast soldering equipment is also recommended. 7. Due to their configuration, there is the risk of washing solvent remaining on the connectors of the NQPACK, YQPACK, and YQSOCKET. Therefore, do not wash these products. 8. NQPACK, YQPACK, and YQSOCKET have been designed assuming use for development and evaluation in systems. NQPACK, YQPACK, and YQSOCKET are not approved by any Electric Appliances Safety Rules or EMI Regulations. Information U14777EJ1V1IF 43 CHAPTER 3 THIRD-PARTY PRODUCTS (3) Cautions related to CSPACK Series + CSICE Series 1. When removing CSPACK from its case, first remove the sponge while holding down the CKPACK. 2. Leaving the case in a location with a temperature of 50°C or higher for a long time may cause warping. Always store the case in a location with a temperature of 40°C or lower and shielded from direct sunlight. 3. The CSPACK is stored in a vacuum pack to prevent oxidation of the surface of the solder balls. It is recommended to perform soldering the same day the pack is opened. (If soldering is to be performed the following day, store the CSPACK is a dessicator. 4. To prevent pin bending, the CSPACK is fitted with a protective cover, secured by 4 screws, and placed in a vacuum pack. To protect the CSPACK from flux spatters, leave the protective cover on the CSPACK until the completion of solder reflow. 5. Recommended soldering conditions CSPACK surface temperature Preheating: 150 to 180°C, approx. 180 seconds Soldering: 210°C or higher, approx. 30 to 60 seconds 6. Due to its configuration, there is the risk of flux and washing solvent remaining on the connectors of the CSPACK. Therefore, absolutely never perform flux immersion or flux washing for the CSPACK. Also, when using the CSPACK with another DIP product, there is the risk that the flux on the DIP product side may get inside the connector of the CSPACK through the guide pin. Therefore, do not perform flux washing of the CSPACK. 7. When fixing the CSPACK screws, first loosely fix the 4 screws using the provided dedicated driver (Philips tip) or a torque driver, and then gradually tighten the screws. A tightening torque of 0.55 kg • f • cm (0.054N • m) MAX. should be used. Strongly tightening only one screw may cause improper contact. 8. When a CSPACK with guide pin is soldered on a board, the guide pin juts out under the board approximately 1.4 mm (when using a board with a thickness of 1.6 mm). If a load is placed on the guide pin from under the board in this condition, stress is applied on the soldered part of the CSPACK and this may cause the connector to break. Therefore, be careful not to place a load on the guide pin after soldering. 9. CSPACK and CSICE are designed assuming use for development and evaluation in systems. CSPACK and CSICE are not approved by any Electric Appliances Safety Rules or EMI Regulations. 44 Information U14777EJ1V1IF CHAPTER 3 THIRD-PARTY PRODUCTS (4) Cautions related to NQPACK Series + YQPACK Series When mounting the NQPACK Series + YQPACK Series on a target board and mounting the TQSOCKET Series to the emulation probe used for connection to the target board, the two sides cannot be connected directly. The YQSOCKETxxxxxF-2 type must be inserted in between the two. Figure 3-3. Emulation Probe Connection Diagram NP-100GC TQSOCKET100SDW Cutout 76 75 51 Insert YQSOCKET100SDF-2 100 50 NQPACK100SD + YQPACK100SD 26 1 25 Target system Table 3-2. Socket and Emulation Probe Combinations NQPACK Series + YQPACK Series Emulation Probe Required YQSOCKET×××××F-2 NQPACK064SA + YQPACK064SA NP-64GC-TQ YQSOCKET064SAF-2 NQPACK064SB + YQPACK064SB NP-64GK YQSOCKET064SBF-2 NQPACK080SD + YQPACK080SD NP-80GK YQSOCKET080SDF-2 NQPACK080RA + YQPACK080RA NP-80GF-TQ YQSOCKET080RAF-2 NQPACK100SD + YQPACK100SD NP-100GC YQSOCKET100SDF-2 Information U14777EJ1V1IF 45 CHAPTER 3 THIRD-PARTY PRODUCTS 3.1.4 Appendix (NEXB-100-SD/RB) The NEXB-100SB/RB is a GC-CF conversion board used to connect the socket and in-circuit emulator when performing emulation of 100-pin GF type V850/SB1 and V850/SB2 devices. Concretely, when using the NQPACK100RB + YQPACK100RB + YQSOCKET100RBN as the socket, connection is possible by inserting NEXB-100SB/RB between the socked and the in-circuit emulator. Top View Bottom View 1.2 99 100 1 2 81 82 79 C2.0 79 80 81 82 99 100 2 1 38.0 21.55 80 1.2 29 30 NEXB-YQ100SD-U 52 49 50 32 31 51 51 52 50 49 21.55 31.0 Side View 6.6 9.2 3.2 Remark Unit = mm 46 32 31 Information U14777EJ1V1IF 30 29 CHAPTER 3 THIRD-PARTY PRODUCTS 3.2 3.2.1 Sockets and Adapters Made by Naito Densei Machida Mfg. Co., Ltd. 28GT-IC dummy set (dummy IC + AXS628119P + AXS662821) Figure 3-4. Dimensions 7.0 4.5 12.16 22.95 Remark Unit = mm Figure 3-5. Recommended Board Mounting Pattern 16.51±0.1 1.27±0.05 1.52 0.76 +0.1 −0 11.84 +0.1 −0 8.50 or less Caution Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Remark Unit = mm Information U14777EJ1V1IF 47 CHAPTER 3 THIRD-PARTY PRODUCTS 3.2.2 NGS-30 (flexible type) 18.5±0.25 75 22.0 0.3 2.5 8.25 18.5±0.25 3.9 2.7 Remark Unit = mm 48 11.5 0.65 × 1.4 = 9.1 21.7 4.3 15.0 Information U14777EJ1V1IF CHAPTER 3 THIRD-PARTY PRODUCTS 3.3 Third-Party Contact List Contact TEL TOKYO ELETECH CORPORATION E-mail: FAX +81-3-5295-1661 +81-3-5295-1663 +81-45-475-4191 +81-45-475-4091 [email protected] Web site: http://www.tetc.co.jp/index.htm (Japanese) http://www.tetc.co.jp/e_tet.htm (English) Naito Densei Machida Mfg. Co., Ltd. E-mail: [email protected] Web site: http://www.ndk-m.co.jp/asmis/ Information U14777EJ1V1IF 49 CHAPTER 3 THIRD-PARTY PRODUCTS [MEMO] 50 Information U14777EJ1V1IF Facsimile Message From: Name Company Tel. Although NEC has taken all possible steps to ensure that the documentation supplied to our customers is complete, bug free and up-to-date, we readily accept that errors may occur. Despite all the care and precautions we’ve taken, you may encounter problems in the documentation. Please complete this form whenever you’d like to report errors or suggest improvements to us. FAX Address Thank you for your kind support. North America Hong Kong, Philippines, Oceania NEC Electronics Inc. NEC Electronics Hong Kong Ltd. Corporate Communications Dept. Fax: +852-2886-9022/9044 Fax: +1-800-729-9288 +1-408-588-6130 Korea Europe NEC Electronics Hong Kong Ltd. NEC Electronics (Europe) GmbH Seoul Branch Technical Documentation Dept. Fax: +82-2-528-4411 Fax: +49-211-6503-274 South America NEC do Brasil S.A. Fax: +55-11-6462-6829 Asian Nations except Philippines NEC Electronics Singapore Pte. Ltd. Fax: +65-250-3583 Japan NEC Semiconductor Technical Hotline Fax: +81- 44-435-9608 Taiwan NEC Electronics Taiwan Ltd. Fax: +886-2-2719-5951 I would like to report the following error/make the following suggestion: Document title: Document number: Page number: If possible, please fax the referenced page or drawing. Document Rating Excellent Good Acceptable Poor Clarity Technical Accuracy Organization CS 01.2