55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-RA-B GHB-RA-G Package Dimensions CATHODE LINE LED DIE 1.0 (0.039) 2.6 (0.102 ) Description These small chip-type LEDs utilize high efficient and high brightness InGaN material to deliver competitively priced high performance blue and green. These 520 nm green and 470 nm blue are unique hues which provide color differentiation to a product. 3.2 (0.126 ) POLARITY CLEAR EPOXY 1.5 (0.059) PC BOARD 1.6 (0.063 ) 0.5 (0.020) 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Device Selection Guide Package Dimension (mm) InGaN Green 3.2(L) x 1.0(W) x 1.5(H) Notes:1. Dimensions in mm. InGaN Blue HSMQ-C110 HSMR-C110 Package Description Untinted, Non-diffused 2. Tolera±nc0e.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25ûC Parameter DC Forward Current Power Dissipation Reverse Voltage (IR = 100mA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature GHB-RA-B GHB-RA-G 20 78 5 95 Ð30 to +85 Ð40 to +85 See reflow soldering profile (Figures 11 & 12) Units mA mW V ûC ûC ûC Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25ûC Part Number GHB-RA-B GHB-RA-G VF Tolerance± : 0.1 V Forward Voltage VF (Volts) @ IF = 20 mA Max. Typ. 3.4 3.9 3.4 3.9 Reverse Breakdown VR (Volts) @ I R=100mA Min. 5 5 Capacitance (pF), V = 0, f = 1 MHz Typ. 140 140 Thermal Resistance Rq J-PIN (C/W) Typ. 450 450 10 SEC. MAX. 230¡C MAX. 3¡C/SEC. MAX. 4¡C/SEC. MAX. OVER 2 MIN. TIME . Recommended reflow soldering profile. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.0 (0.039) 0.2 (0.008) BO C EN AT REDRING 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Recommended soldering pattern.