HD74LS47 BCD-to-Seven-Segment Decoder / Driver (with 15 V Outputs) REJ03D0410-0301 Rev.3.01 May 10, 2006 HD74LS47 features active-low outputs designed for driving incandescent indicators directly. This device has full ripple-blanking input / output controls and a lamp test. Display patterns for BCD input counts above 9 are unique symbols to authenticate input conditions. This circuit incorporates automatic leading and / or trailing-edge zeroblanking control (RBI and RBO). Lamp test (LT) of these types may be performed at any time when the BI / RBO node is at a high level. It contains an overriding blanking input (BI) which can be used to control the lamp intensity of pulsing or to inhibit the outputs. Inputs and outputs are entirely compatible for use with TTL or DTL logic outputs. Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS47P DILP-16 pin PRDP0016AE-B (DP-16FV) P — HD74LS47FPEL SOP-16 pin (JEITA) PRSP0016DH-B (FP-16DAV) FP EL (2,000 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement B 1 C 2 LT 16 VCC 15 f Inputs BI/RBO B f 3 C g 14 g 4 LT a 13 a BI/RBO b RBI c 12 b D d 11 c A e 10 d 9 e RBI 5 D 6 A 7 GND 8 Inputs (Top view) Rev.3.01, May 10, 2006, page 1 of 6 Outputs HD74LS47 Function Table Decimal or Function 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 BI RBI LT Inputs LT H H H H H H H H H H H H H H H H X H L RBI H X X X X X X X X X X X X X X X X L X D L L L L L L L L H H H H H H H H X L X C L L L L H H H H L L L L H H H H X L X B L L H H L L H H L L H H L L H H X L X A L H L H L H L H L H L H L H L H X L X BI/ RBO H H H H H H H H H H H H H H H H L L H Outputs a ON OFF ON ON OFF ON OFF ON ON ON OFF OFF OFF ON OFF OFF OFF OFF ON b ON ON ON ON ON OFF OFF ON ON ON OFF OFF ON OFF OFF OFF OFF OFF ON c ON ON OFF ON ON ON ON ON ON ON OFF ON OFF OFF OFF OFF OFF OFF ON d ON OFF ON ON OFF ON ON OFF ON OFF ON ON OFF ON ON OFF OFF OFF ON e ON OFF ON OFF OFF OFF ON OFF ON OFF ON OFF OFF OFF ON OFF OFF OFF ON f ON OFF OFF OFF ON ON ON OFF ON ON OFF OFF ON ON ON OFF OFF OFF ON g OFF OFF ON ON ON ON ON OFF ON ON ON ON ON ON ON OFF OFF OFF ON Note 1 2 3 4 H; high level, L; low level, X, irrelevant Notes: 1. The blanking input (BI) must be open or held at a high logic level when output functions 0 through 15 are desired. The ripple-blanking input (RBI) must be open or high if blanking of a decimal zero is not desired. 2. When a low logic level is applied directly to the blanking input (BI), all segment outputs are off regardless of the level of any other input. 3. When ripple-blanking input (RBI) and inputs A, B, C, and D are a low level with the lamp test input high, all segment outputs go off and the ripple-blanking output (RBO) goes to a low level (response condition). 4. When a blanking input / ripple blanking output (BI / RBO) is open or held high and a low is applied to the lamp-test input, all segment outputs are on. a f g e c d Rev.3.01, May 10, 2006, page 2 of 6 b 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 HD74LS47 Block Diagram a A b B Inputs C c Outputs D d Blanking Input or Ripple Blanking Output (BI/RBO) e f Lamp Test Input (LT) g Ripple Blanking Input (RBI) Absolute Maximum Ratings Item Supply voltage Input voltage Symbol VCC VIN Ratings 7 7 Output current IO(peak) 200 (tw ≤ 1ms,duty cycle ≤ 10%) Output current (off) IO(off) 1 Power dissipation PT 400 Operating temperature Tupr –20 to +75 Storage temperature Tstg –65 to +150 Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Rev.3.01, May 10, 2006, page 3 of 6 Unit V V mA mA mW °C °C HD74LS47 Recommended Operating Conditions Item Symbol VCC VO(off) IO(on) IOH IOL Topr Supply voltage Output voltage (off) Input current (on) Output current Operating temperature Min 4.75 — — — — –20 Typ 5.00 — — — — 25 Max 5.25 15 24 –50 3.2 75 Unit V V mA µA mA °C Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Symbol VIH VIL min. 2.0 — typ.* — — max. — 0.8 Unit V V VOH 2.4 — — V — — 0.4 — — — — — — 0.5 0.4 0.5 BI / RBO Output voltage VOL Condition VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = –50 µA IOL = 1.6 mA VCC = 4.75 V, V IOL = 3.2 mA IH = 2 V, VIL = 0.8 V V IO(on) = 12 mA IO(on) = 24 mA V VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V a to g VO(on) Output current a to g IO(off) — — 250 µA IIH — — 20 µA Input current All input except BI / RBO BI / RBO — — –0.4 mA — — –1.2 mA — — 0.1 mA VCC = 5.25 V, VI = 7 V mA VCC = 5.25 V mA V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA IIL II Short-circuit BI / RBO IOS –0.3 — –2 output current Supply current** ICC — 7 13 Input clamp voltage VIK — — –1.5 Notes: * VCC = 5 V, Ta = 25°C ** ICC is measured with all outputs open and inputs at 4.5 V. VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V, VO(off) = 15 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Turn-on time Turn-off time Symbol Input min. typ. max. Unit ton A RBI — — — — 100 100 ns toff A RBI — — — — 100 100 ns Rev.3.01, May 10, 2006, page 4 of 6 Condition CL = 15 pF, RL = 665 Ω HD74LS47 Testing Method Test Circuit VCC 4.5V Output See Function Table a Input P.G. Zout = 50Ω Note: A B C D RL b c d CL e LT RBI BI/RBO f g CL includes probe and jig capacitance. Waveform tTHL tTLH 90% 1.3 V Input 3V 90% 1.3 V 10% 10% 0V ton toff VOH In phase output 1.3 V 1.3 V VOL ton toff VOH 1.3 V Out of phase output 1.3 V VOL Note: Input pulse: tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz, duty cycle 50%. Testing Table Item ton toff RBI 4.5 V 4.5 V 4.5 V IN D GND GND GND GND Inputs C GND GND 4.5 V GND Rev.3.01, May 10, 2006, page 5 of 6 B GND 4.5 V 4.5 V GND A IN IN IN GND a OUT — OUT OUT b — — OUT OUT c — OUT — OUT Outputs d OUT — OUT OUT e OUT OUT OUT OUT f OUT — OUT OUT g — — OUT — HD74LS47 Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g D 9 E 16 1 8 b3 0.89 A1 A Z L Reference Symbol θ bp e e1 D E A A1 bp b3 c θ e Z L c e1 ( Ni/Pd/Au plating ) JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV Dimension in Millimeters Min Nom Max 7.62 19.2 20.32 6.3 7.4 5.06 0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0° 15° 2.29 2.54 2.79 1.12 2.54 MASS[Typ.] 0.24g D F 16 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 9 c HE *2 E bp Index mark Terminal cross section ( Ni/Pd/Au plating ) 1 Z 8 e *3 bp x Reference Dimension in Millimeters Symbol M A L1 A1 θ y L Detail F Rev.3.01, May 10, 2006, page 6 of 6 D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 7.50 7.80 8.00 1.27 0.12 0.15 0.80 0.50 0.70 0.90 1.15 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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