KOA KL32TTE033

TN-100 R3
AHA 10/13/06
Chip Inductors
Type KL32 Series
CERTIFIED
CERTIFIED
1. Scope
This specification applies to Chip Inductors (KL32)
produced by KOA Corporation.
2. Type Designation
The type designation shall be the following form:
KL
32
T
TE
101
J
Type
Size
Termination
Material
Packaging
Nominal
Inductance
Tolerance
1210
T: Sn
(Other termination
styles available,
contact factory
for options)
TE: 7" embossed plastic
(2,000 pieces/reel)
TED: 10" embossed plastic
(4,000 pieces/reel)
Reference
inductance
marking chart
J: ±5%
K: ±10%
M: ±20%
3. Dimensions and Construction
Type
KL32
L
W1
Dimensions inches (mm)
W2
t
h
d
.126±.008 .098±.008 .067±.004 .087±.008 .075±.004 .02 nominal
(3.2±0.2) (2.5±0.2) (1.7±0.1) (2.2±0.2) (1.9±0.1) (.5 nominal)
Inductance Marking
L
W1
Value
0.005µH - 0.082µH
0.10µH - 8.2µH
t
h
10µH - 330µH
d
Ferrite
Core
Magnet
Wire
Molded
Resin
W2
Code
005 - 082
R10 - 8R2
R indicates decimal point.
100 - 331
1st two figures are significant,
the last figure indicates the
number of zeros to follow.
Electrode
PAGE 1 OF 8
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
TN-100 R3
4. Standard Applications
Part
Designation
Inductance
(µH)
Inductance
Tolerance
KL32TTE005*
KL32TTE010*
KL32TTE012*
KL32TTE015*
KL32TTE018*
KL32TTE022*
KL32TTE027*
KL32TTE033*
KL32TTE039*
KL32TTE047*
KL32TTE056*
KL32TTE068*
KL32TTE082*
KL32TTER10*
KL32TTER12*
KL32TTER15*
KL32TTER18*
KL32TTER22*
KL32TTER27*
KL32TTER33*
KL32TTER39*
KL32TTER47*
KL32TTER56*
KL32TTER68*
KL32TTER82*
KL32TTE1R0*
KL32TTE1R2*
KL32TTE1R5*
KL32TTE1R8*
KL32TTE2R2*
KL32TTE2R7*
KL32TTE3R3*
KL32TTE3R9*
KL32TTE4R7*
KL32TTE5R6*
KL32TTE6R8*
KL32TTE8R2*
KL32TTE100*
KL32TTE120*
KL32TTE150*
KL32TTE180*
KL32TTE220*
KL32TTE270*
KL32TTE330*
KL32TTE390*
KL32TTE470*
KL32TTE560*
KL32TTE680*
KL32TTE820*
KL32TTE101*
KL32TTE121*
KL32TTE151*
KL32TTE181*
KL32TTE221*
KL32TTE271*
KL32TTE331*
0.005
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
M: ±20%
Quality
Factor
Minimum
K: ±10%
M: ±20%
11
15
17
19
21
23
25
26
27
28
J: ±5%
K: ±10%
M: ±20%
30
J: ±5%
K: ±10%
M: ±20%
Self Resonant
Frequency
Minimum
(MHz)
2700
2500
2300
2100
1900
1700
1500
1400
1300
1200
1100
1000
900
700
500
450
400
350
320
300
250
220
180
160
140
120
100
85
80
75
70
60
55
50
47
43
40
36
33
30
27
25
20
17
16
15
13
12
11
DC
Resistance
Maximum
(Ω)
0.12
0.13
0.14
0.16
0.18
0.20
0.22
0.24
0.27
0.30
0.33
0.36
0.40
0.44
0.22
0.25
0.28
0.32
0.36
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.85
0.90
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.1
2.5
2.8
3.3
3.7
5.0
5.6
6.4
7.0
8.0
9.0
10
10
11
15
17
21
28
34
8
20
7
6
5
Allowable
DC Current
Maximum
(mA)
Measured
Frequency
(MHz)
100
450
25.2
400
390
370
350
320
290
260
250
220
200
180
170
150
140
130
120
110
80
70
65
60
55
50
45
40
70
65
60
7.96
2.52
0.796
50
* Add tolerance character (J, K, M)
PAGE 2 OF 8
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
TN-100 R3
5. Measurement Method of L and Q
Nominal Inductance
Range (µH)
Measurement
Method
Measuring
Frequency (MHz)
0.005 ~ 0.10
100
0.12 ~ 0.82
Please see Method-1
1.0 ~ 8.2
10 ~ 82
25.2
7.96
2.52
Please see Method-2
100 ~ 330
0.796
Method-1
Test Equipment:
Fixture:
Electrical Length:
Setting:
Hewlett Packard RF Impedance analyzer 4191A
Hewlett Packard Spring clip fixture 16092A
2.10 cm
Please see the following figure
KL32
Slide Clip Terminal
Center Post
0.087
(2.2)
Spacer (Unmagnetic Insulator)
Method-2
Test Equipment:
Fixture:
OSC Level:
Hewlett Packard LF Impedance analyzer 4192
Hewlett Packard Test fixture 16034E
0.3 V
6. Test Condition
Unless otherwise specified, the test shall be performed in accordance
with JIS-C-5202 specifying marking measurements as follows:
Ambient temperature: 20 ± 15°C
Relative humidity:
65 ± 20%
If there may be any doubt on results, measurements shall be made
within the following limits:
Ambient temperature: 20 ± 2°C
Relative humidity:
65 ± 5%
PAGE 3 OF 8
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
TN-100 R3
7. Reliability Data
7-1 Electrical Characteristics
Item
Requirement
Test Method
DC Bias
Characteristic
Δ L/L: Within - 10%
Measure inductance with application
of rated current using LCR meter to
compare it with the initial value.
Dielectric
Withstanding
Voltage
No fuming, flaming,
or breakdown
5 seconds at DC 1000V between
terminal 1 (one electrode of inductor)
and terminal 2 (the thin copper wire
which is wound around the inductor
more than twice).
Insulation
Resistance
More than 1000MΩ
Measure resistance immediately after
1 minute passed since DC 500V was
applied between terminal 1 and 2.
7-2 Mechanical Characteristics
Item
Requirement
Test Method
Terminal Pull
Strength
No damage
Terminals shall withstand a pull
of 0.5kgf in a horizontal direction.
Terminal Bending
Strength
No damage
Specimen shall be soldered on PCB-A
(see figure below) and support by
applying strength so that the bending
width becomes 10 mm.
0.197 (5.0)
Thickness: 1.6 mm
Material: Paper Phenol
Adhesive Agent Spreading Area
0.039 (1.0)
(a) Board
1.575 (40.0)
ø 0.177
(ø 4.5)
0.087 (2.2)
0.079 (2.0)
0.197 (5.0)
3.937 (100.0)
(b) Install
1.77 (45.0)
1.77 (45.0)
Solder Resist
ø 0.394 x 1.969
(ø 10 x 50) (Support Stick)
Soldering
Units: inches (mm)
0.063 (1.6)
Chip Inductor
PAGE 4 OF 8
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
TN-100 R3
7-2 Mechanical Characteristics Continued
Item
Vibration
Thickness: 1.6 mm
Material: Glass Epoxy
Requirement
Test Method
No significant abnormality in
appearance
Δ L/L: Within ± 3%
2 hours in each X, Y and Z directions
on PCB-B (see figure below) at a
frequency range of 10 to 55 to 10 Hz
(1 min.) with 1.5 mm amplitude.
Adhesive Agent Spreading Area
0.118 (3.0)
0.110 (2.8)
Solder Resist
0.059 (1.5)
0.039 (1.0)
0.157 (4.0)
0.118
(3.0)
0.276
(7.0)
0.087
(2.2)
0.984 (25.0)
0.118
(3.0)
0.079
(2.0)
0.079 ~ 0.138 (2.0 ~ 3.5)
Terminal Connection
0.098 (2.5)
0.082 (2.08)
2.180 (55.38)
2.436 or more (2.441 to 2.559)
(61.88 or more) (62 to 65)
Units: inches (mm)
Resistance to
Solder Heat
No significant abnormality in
appearance
Δ L/L: Within ± 3%
Immerse in the solder (H63A)
of 260 ± 5°C for 10 ± 1 sec.
Solderability
Over 95% of electrode surface
shall be covered with solder
Immerse in the solder (H63A)
of 230 ± 5°C for 3 ± 0.5 sec.
Drop Test
No significant abnormality in
appearance
Δ L/L: Within ± 3%
Drop from a height of 1 m to the ground
of concrete or tile 1 time.
PAGE 5 OF 8
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
TN-100 R3
7-3 Environmental Characteristics *
Item
Requirement
Test Method
Low Temperature
Life Test
Δ L/L: Within ± 5%
Δ Q/Q: Within ± 20%
Store at -55 ± 2°C for 1000 hours.
High Temperature
Life Test
Δ L/L: Within ± 5%
Δ Q/Q: Within ± 30%
Store at 100 ± 2°C for 1000 hours.
Thermal Shock
Δ L/L: Within ± 5%
100 cycles between -55 ± 2°C /
1 hour and +100 ± 2°C / 1 hour.
Temperature
Characteristic
Δ L/L: Within ± 10%
Measure Δ L/L at the temperature of
between -55°C and +100°C as based
on the temperature of 20°C.
Humidity
Δ L/L: Within ± 5%
Δ Q/Q: Within ± 30%
Store at 40 ± 2°C, 90 to 95% RH
for 1000 hours.
Humidity Loading
Test
Δ L/L: Within ± 5%
Δ Q/Q: Within ± 30%
Apply rated current continuously at
40 ± 2°C, 90 to 95% RH for 1000 hours.
High Temperature
Loading Test
Δ L/L: Within ± 5%
Δ Q/Q: Within ± 30%
Apply rated current continuously at
100 ± 2°C for 1000 hours.
Solvent
Resistance
No outstanding damage and
markings can be easily judged
According to MIL-STD-202
Method 215 (1990).
Storage
Temperature Range
-55°C to +100°C
–––
Operating
Temperature Range
-55°C to +100°C
–––
* Unless otherwise specified, at least one hour of recovery under the normal temperature and normal humidity after
the test, followed by the measurement within two hours.
PAGE 6 OF 8
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
TN-100 R3
8. Packaging
8-1 Taping
The tapes for taping shall be embossed carrier tapes of .315" (8 mm) width and .157" (4 mm)
pitch. The standard quantity per reel shall be 2,000 pieces.
(1) Dimensions of carrier tape
Dimensions in inches (mm)
A
.140 (3.55 ± 0.10)
T2
.011 (0.28 ± 0.05)
B
.106 (2.70 ± 0.10)
P0
.157 (4.00 ± 0.10)
W
.315 (8.00 ± 0.10)
P1
.157 (4.00 ± 0.10)
E
.069 (1.75 ± 0.10)
P2
.079 (2.00 ± 0.05)
F
.138 (3.50 ± 0.05)
øD*
0.1
0
.059 (1.50 ± 0.1
0 )
T1
.106 (2.70 ± 0.15)
øD1
0.2
0)
.039 (1.00 ± 0.2
0
T2
E
øD
* 20 pitches accumulation of sprocket
holes shall be 80.00 ± 0.15 mm.
P0
P2
øD1
F
5N6
W
Direction of mark
T1
The top tape requires a peel-off force
of 15 to 60 gf.
B
Blank portions
300 mm or more
A
P1
Tape running direction
Blank portions
230 mm or more
Chip cavity
Leader
270 mm or more
End
Beginning
Top tape
Empty
Empty
Tape running direction
(2) Reel dimensions
Dimensions in inches (mm)
7.087
(180 ± 03 )
Marking
place
0.079
(2.0 ± 0.5)
0.512
(13 ± 0.2)
0.354 (9.0 ± 0.3)
0.449 (11.4 ± 1.0)
0.413
(R10.5 ± 0.4)
Bolivar Drive
■
P.O. Box 547
2.362
(60 ± 10 )
■
Bradford, PA 16701
■
USA
■
(Marking item)
(1) Type designation
(2) Nominal inductance and tolerance
(3) Quantity
(4) Production lot number
(5) Manufacturer's name
PAGE 7 OF 8
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
TN-100 R3
9. Recommended Soldering Condition
0.197 (5.0)
9-1 Dimensions of Standard Land
0.087 (2.2)
The following figure is recommended
land dimensions.
When two or more chip inductors are closely
mounted, they must be separated by means
of solder resists to prevent excessive solder.
0.079
(2.0)
Dimensions in inches (mm)
KL32
0.055 (1.4)
9-2 Soldering Condition
Wave soldering should be done at 260°C
for less than 10 seconds. Reflow soldering
should be done at 240°C for less than 20
seconds. (Please see the following figures.)
When using a soldering iron, temperature shall
not exceed 350°C and within three seconds.
Soldering iron time shall be allowed only one
time. After soldering, chip inductors shall not
be stressed excessively.
Recommended Temperature Profile
for Wave Soldering
Preheat 120
Seconds Max.
Soldering
10 Seconds Max.
Recommended Temperature Profile
for Reflow Soldering
Natural
Cooling
Preheat 120
Seconds Max.
260°C
240°C
150°C
150°C
100°C
100°C
Soldering
20 Seconds Max.
Natural
Cooling
10. Mounting
Placement force should not be excessive.
11. Recommended Washing Condition
Since this chip inductor is a coil of ultra-thin wire, it is susceptible to vibration.
If an ultrasonic cleaning unit is used for cleaning, check for any possibility of problem generation before
practical use since such cleaning units considerably differ in vibration level and mode. Although the conditions
differ depending on the printed board size, ultrasonic cleaning is generally used in the conditions described
below as examples:
Ultrasonic power:
Within 20W/1
Cleaning times:
Within 5 minutes
12. Storage
Chip inductors should not be stored under high temperature and high humidity conditions.
In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise,
the packing material may be deformed, causing problems during mounting.
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
PAGE 8 OF 8
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.