STMICROELECTRONICS L6225PD

L6225
DUAL DMOS FULL BRIDGE MOTOR DRIVER
PRELIMINARY DATA
■
OPERATING SUPPLY VOLTAGE FROM 8 TO
52V
■
2.8A PEAK CURRENT (1.4A DC)
■
RDS (ON) 0.73Ω TYP. VALUE @ Tj = 25 °C
■
CROSS CONDUCTION PROTECTION
■
THERMAL SHUTDOWN
■
OPERATING FREQUENCY UP TO 100KHz
■
HIGH SIDE OVER CURRENT PROTECTION
■
CMOS/TTL INPUT
■
INTRINSIC FAST FREE WHEELING DIODES
■
UNDER VOLTAGE LOCKOUT
PowerDIP20
PowerSO20
SO20
(16+2+2)
(16+2+2)
ORDERING NUMBERS:
L6225N
TYPICAL APPLICATIONS
■
STEPPER MOTOR
■
DUAL OR QUAD DC MOTOR
DESCRIPTION
The L6225 is a dual full bridge driver for motor control
applications manufactured with Multipower BCD
technology which combines isolated DMOS power
L6225PD
L6225D
transistors with CMOS and bipolar circuits on the
same chip.
The Logic Inputs are CMOS/TTL and µP compatible.
The High Side switches are protected against unsafe
over current conditions.
Each full bridge is controlled by a separate Enable
and has a sense pin for the current sense resistor insertion. Another feature is the thermal shutdown.
The L6225 is assembled in PowerDIP20(16+2+2),
PowerSO20 and SO20(16+2+2) packages.
BLOCK DIAGRAM
OUT1A
GND
SENSE A
OUT2 A
VS A
VS A
VS A
VS A
GND
GND
GND
VBO OT
ENA
Logic
&
Drivers
ENB
IN1A
IN2A
Charg e
Pump
VCP
IN1 B
IN2B
VS B
VS B
VS B
OUT1 B
SENSEB
OUT2 B
VS B
March 2001
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change with out notice.
1/10
L6225
FUNCTIONAL BLOCK DIAGRAM
Vboot
Thermal
Protection
Voltage
Regulator
10V
Vboot
VCP
V SA
Charge
Pump
Vboot
Vboot
5V
OUT1 A
Over
Current
Detection
10V
OUT2 A
10V
EN A
SENSE A
Logic
IN1 A
IN2 A
BIPOLAR
STEPPER
MOTOR
BRIDGE A
EN B
VSB
OUT1B
OUT2 B
IN1 B
SENSE B
IN2 B
BRIDGE B
ABSOLUTE MAXIMUM RATINGS
Symbol
VS
Parameter
Test conditio ns
Supply Voltage
Value
Unit
60
V
-0.3 to +7
V
VIN,V EN
Input and Enable Voltage Range
V SENSE
DC Sensing Voltage Range
-1 to +4
V
VBOOT
Bootstrap Peak Voltage
V S + 10
V
IS(peak)
Pulsed Supply Current (for each
VS pin), internally limited by the
overcurrent protection
3.55
A
IS
DC Supply Current (for each VS
pin)
1.4
A
VOD
Differential Voltage Between
VS A, OUT1A, OUT2A, SENSEA and
VS B, OUT1B, OUT2 B, SENSEB
60
V
-40 to 150
°C
Tstg, TOP
2/10
Storage and Operating
Temperature Range
tPULSE < 1ms
L6225
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VS
Supply Voltage
VOD
Differential Voltage Between
VS A, OUT1A, OUT2A, SENSEA and
VS B, OUT1B, OUT2B, SENSEB
V SENSE
MIN
MAX
Unit
12
52
V
52
V
-6
-1
6
1
V
V
-0.1
5
V
1.4
A
+125
°C
100
kHz
Sensing voltage
(pulsed tw<trr)
(DC)
Vref
Vref Operating Voltage
IOUT
DC Output Current
Tj
Operating Junction Temperature
fsw
Switching Frequency
-25
PIN CONNECTION (Top View)
IN1A
1
20
ENA
IN2A
2
19
VCP
SENSEA
3
18
OUT2A
OUT1A
4
17
VSA
GND
5
16
GND
6
OUT1B
GND
1
20
GND
VSA
2
19
VSB
OUT2A
3
18
OUT2B
VCP
4
17
VBOOT
GND
ENA
5
16
ENB
15
GND
IN1A
6
15
IN2B
7
14
VSB
IN2A
7
14
IN1B
SENSEB
8
13
OUT2B
SENSEA
8
13
SENSEB
IN1B
9
12
VBOOT
OUT1A
9
12
OUT1B
IN2B
10
11
ENB
10
11
GND
D99IN1093A
PowerDIP20/SO20
GND
D99IN1092A
PowerSO20
3/10
L6225
PIN DESCRIPTION
Name
PowerSO20
PowerDIP20/
SO20
V SA
2
17
Supply Voltage of the Bridge A.
V SB
19
14
Supply Voltage of the Bridge B. This pin must be connected to VSA.
OUT1A
OUT2A
9
3
4
18
Bridge A outputs.
OUT1B
OUT2B
12
18
7
13
Bridge B outputs.
SENSE A
8
3
Sense resistor for the bridge A
SENSE B
13
8
Sense resistor for the bridge B
GND
1,10,11,20
5, 6,15,16
Common ground terminals. In Powerdip and SO packages, these pins are
also used for heat dissipation toward the PCB.
EN A
5
20
Enable of the Bridge A. A LOW logic level applied to this pin switches off
all the power DMOSs of the related bridge.
The Bridge A over current protection open drain is internally connected to
this pin.
EN B
16
11
Enable of the Bridge B. A LOW logic level applied to this pin switches off
all the power DMOSs of the related bridge.
The Bridge B over current protection open drain is internally connected to
this pin.
IN1 A
IN2 A
6
7
1
2
Logic inputs of the Bridge B. Provided the ENA signal is HIGH, a HIGH
logic level applied to any of these pins switches on the related high side
power DMOS, while a logic LOW switches on the related low side power
DMOS .
IN1 B
IN2 B
14
15
9
10
Logic inputs of the Bridge B. Provided the ENB signal is HIGH, a HIGH
logic level applied to any of these pins switches on the related high side
power DMOS, while a logic LOW switches on the related low side power
DMOS .
VCP
4
19
Bootstrap Oscillator. Oscillator output for the external charge pump.
VBOOT
17
12
Supply voltage to overdrive the upper DMOSs.
Function
THERMAL DATA
Symbol
Description
PowerDIP20
SO20
PowerSO20
Unit
13
15
-
°C/W
-
-
2
°C/W
Rth-j-pins
MaximumThermal Resistance Junction-Pins
R th-j-case
Maximum Thermal Resistance Junction-Case
R th-j-amb1
MaximumThermal Resistance Junction-Ambient (1)
41
51
-
°C/W
R th-j-amb1
Maximum Thermal Resistance Junction-Ambient (2)
-
-
36
°C/W
R th-j-amb1
MaximumThermal Resistance Junction-Ambient (3)
-
-
16
°C/W
R th-j-amb2
Maximum Thermal Resistance Junction-Ambient (4)
57
78
63
°C/W
(1) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm 2 (with a thickness of 35 µm).
(2) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm 2 (with a thickness of 35 µm).
(3) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm 2 (with a thickness of 35 µm), 16 via holes
and a ground layer.
(4) Mounted on a multiplayer PCB without any heatsinking surface on the board.
4/10
L6225
ELECTRICAL CHARACTERISTICS(Tamb = 25 °C, Vs = 48V, unless otherwise specified)
Symbol
Parameter
VS
Supply Voltage
IS
Quiescent Supply Current
Tj
Thermal Shutdown Temperature
Test Conditions
Min
Typ
8
All Bridges OFF; -25°C<Tj < 125 °C
5.5
Max
Unit
52
V
10
mA
°C
150
Output DMOS Transistors
IDSS
Leakage Current
R DS(ON) High-side + Low-side Switch ON
Resistance
VS = 52V
1
mA
Tj = 25 °C
1.47
1.69
Ω
Tj =125 °C
2.35
2.7
Ω
1.2
V
Source Drain Diodes
VSD
Forward ON Voltage
ISD = 1.4A, EN = LOW
trr
Reverse Recovery Time
If = 1.4A
tfr
Forward Recovery Time
300
ns
200
ns
tD(on)EN Enable to out turn ON delay time (5) ILOAD = 1.4 A
250
ns
tD(on)IN
600
ns
Switching Rates
tON
Input to out turn ON delay time (5)
20
Output rise time(5)
105
300
ns
tD(off)EN Enable to out turn OFF delay time (5)
450
ns
Input to out turn OFF delay time (5)
500
ns
tD(off)IN
toff
Output fall time (5)
tdt
Dead time protection
fCP
Charge pump frequency
20
78
300
ns
µs
1
0.75
1
MHz
6.6
7
7.4
V
5.6
6
6.4
V
UVLO comp
V th(ON)
Turn ON threshold
Vth(OFF) Turn OFF threshold
Logic Inpu t
V INL
Low level logic input voltage
-0.3
0.8
V
VINH
High level logic input voltage
2
7
V
IINH
High level logic input current
VIN, EN = 5 V
70
µA
IINL
Low level logic input current
VIN, EN = GND
-10
µA
3.55
A
0.4
V
Over Current Protection
IS OVER Input supply over current
protection threshold
VDIAG
Open drain low level output
voltage
2
I = 4 mA
2.8
(5) Resistive load used. See Fig. 1.
5/10
L6225
Figure 1. Switching rates definition
En or IN
50 %
t
IOUT
90 %
10 %
t
tD(OFF) tOF F
t D(ON) t(ON)
CIRCUIT DESCRIPTION
The L6225 is a dual full bridge IC designed to drive DC or stepper motors and other inductive loads. Each bridge has
4 power DMOS transistors with a typical RDS(ON) of 0.3 Ohm. Any of the 4 half bridges can be controlled independently by means of the 4 TTL/CMOS compatible inputs IN1A, IN2A, IN1B, IN2B, and 2 enable ENA, ENB .
External connections are provided so that sensing resistor can be added for constant current chopping applicatio n.
A non dissipative current sensing on the supply rails of the high side power DMOSs of each bridge, an internal
reference and an internal open drain, with a pull down capability of 4mA (typical value), will pull to GND the ENABLE pin of the bridge under fault conditions, turning OFF all the four PowerDMOSs. This ensures a protection
against short circuit to GND and between two phases of each of the two independent full bridges. By using an
external R-C on the EN pins, the off time before recovering normal operation conditions after a fault can be
easily programmed, by means of the accurate threshold of the logic inputs. Note that protection against short
to the supply rail is typically provided by the external current control circuitry. The trip point of this protection is
set at 2.8A (typ value).
6/10
L6225
DIM.
A
a1
a2
a3
b
c
D (1)
D1
E
e
e3
E1 (1)
E2
E3
G
H
h
L
N
S
T
MIN.
mm
TYP.
0.1
0
0.4
0.23
15.8
9.4
13.9
MAX.
3.6
0.3
3.3
0.1
0.53
0.32
16
9.8
14.5
MIN.
0.004
0.000
0.016
0.009
0.622
0.370
0.547
1.27
11.43
10.9
inch
TYP.
0.050
0.450
11.1 0.429
2.9
6.2
0.228
0.1
0.000
15.9 0.610
1.1
1.1
0.031
10° (max.)
8° (max.)
5.8
0
15.5
0.8
OUTLINE AND
MECHANICAL DATA
MAX.
0.142
0.012
0.130
0.004
0.021
0.013
0.630
0.386
0.570
10
0.437
0.114
0.244
0.004
0.626
0.043
0.043
JEDEC MO-166
0.394
PowerSO20
(1) ”D and F” do not include mold flash or protrusions.
- Mold flash or protrusions shall not exceed 0.15 mm (0.006”).
- Critical dimensions: ”E”, ”G” and ”a3”
N
R
N
a2
b
A
e
DETAIL A
c
a1
DETAIL B
E
e3
H
DETAIL A
lead
D
slug
a3
DETAIL B
20
11
0.35
Gage Plane
- C-
S
SEATING PLANE
L
G
E2
E1
BOTTOM VIEW
T
E3
1
h x 45
7/10
10
PSO20MEC
C
(COPLANARITY)
D1
L6225
mm
DIM.
MIN.
a1
0.51
B
0.85
b
b1
TYP.
inch
MAX.
MIN.
TYP.
MAX.
0.020
1.40
0.033
0.50
0.38
0.055
0.020
0.50
D
0.015
0.020
24.80
0.976
E
8.80
0.346
e
2.54
0.100
e3
22.86
0.900
F
7.10
0.280
I
5.10
0.201
L
Z
OUTLINE AND
MECHANICAL DATA
3.30
0.130
1.27
Powerdip 20
0.050
8/10
L6225
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
2.35
2.65
0.093
0.104
A1
0.1
0.3
0.004
0.012
B
0.33
0.51
0.013
0.020
C
0.23
0.32
0.009
0.013
D
12.6
13
0.496
0.512
E
7.4
7.6
0.291
0.299
e
1.27
OUTLINE AND
MECHANICAL DATA
0.050
H
10
10.65
0.394
0.419
h
0.25
0.75
0.010
0.030
L
0.4
1.27
0.016
0.050
SO20
K
0° (min.)8° (max.)
L
h x 45°
A
B
e
A1
K
H
D
20
11
E
1
1
0
SO20MEC
9/10
C
L6225
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. N o license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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