IXYS LDS8724008T2-200

LDS8724
40 WLED Driver with Boost Converter
FEATURES
 High efficiency boost converter with the input
voltage range from 2.7 to 5.5 V
 No external Schottky Required (Internal
synchronous rectifier*)
 250 mV current sense voltage
 Drives up to 5 LEDs per string with up to 42
LED in 6 strings at 25 mA
 1 MHz Switching Frequency
 Efficiency greater than 83%
 PWM LED Dimming Control Mode
 Over-voltage, under-voltage, over-current,
and over-temperature protection
 Low Shutdown Current (<1µA)
 Available in 2 x 3 x 0.8 mm 8-pin TDFN
package
resistance. Under-voltage protection disables the part
when VIN voltage reaches 2.0 V
0
The LDS8724 has thermal shutdown set at 150 C.
Above this value , the boost converter stops
switching. The part resumes normal operations when
0
temperature drops below 130 C.
The over-current protection provides cycle-by-cycle
current limit.
The internal output over-voltage protection prevents
damage in the case of a faulty LED disconnect.
APPLICATION





The PWM control ensures brightness adjustment with
a frequency from 100 Hz up to 30 KHz.
Color Display Backlight
Portable Navigation and GPS Receivers
Smart phones
Digital Photo Frames
Portable DVD Players, Notebooks
The EN/PWM logic input functions as a chip enable
and LED current PWM contol pin.
The device is available in 8-pin TDFN 2 x 3 mm
package with a max height of 0.8 mm.
DESCRIPTION
Table 1 Matrix configuration for LDS8724
The LDS8724 is a fixed frequency current mode
boost converter with internal synchronous rectifier
and cycle-by-cycle switch current limit specifically
designed to drive matrix of LEDs in respect with the
Table 1. Operation at 1 MHz allows use of small
value low profile inductor (10 – 33 µH) and 1 µF 50 V
ceramic capacitor.
The use of integrated synchronous rectifier makes
the efficiency dependent on only inductor DC
Number of
strings
Number of
LED per string
1-6
7, 8
9
10
11
12
5
5
5
4
4
3
String
Current
max, mA,
30
25
25
25
25
30
V IN
MIN,
V
2.7
2.7
3.0
2.7
3.0
3.0
TYPICAL APPLICATION CIRCUIT
*) Patent pending
© 2010 IXYS Corp.
Characteristics subject to change without notice
1
Doc. No. 8724DS, Rev. N1.0
LDS8724
ABSOLUTE MAXIMUM RATINGS
Parameter
V IN voltage
V OUT, SW, LEDS, VHVB voltage
EN/SET voltage
Storage Temperature Range
Junction Temperature Range
8-pin TDFN package Thermal Resistance
Soldering Temperature
Rating
6
40
V IN + 0.7V
-65 to +160
-40 to +125
65
300
Unit
V
V
V
°C
°C
°C/W
°C
RECOMMENDED OPERATING CONDITIONS
Parameter
V IN
Ambient Temperature Range
Rating
2.7 to 5.5
-40 to +85
Unit
V
°C
Typical application circuit with external components is shown on page 1.
ELECTRICAL OPERATING CHARACTERISTICS
(Over recommended operating conditions unless specified otherwise) V IN = 3.6V,TAMB = 25°C, C IN = 1 µF, COUT = 1 µF, L = 22 µH
Name
Quiescent Current
Shutdown Current
LED Current Accuracy
Oscillator Frequency
Maximum Duty Cycle
NMOSFET Switch On Resistance
PMOSFET Switch On Resistance
Switch Leakage Current
Switch Current Limit
Dropout/Current sense voltage
PWM Frequency
EN/PWM Input Resistance (pull down)
Pin
High
Logic Level
Low
Thermal Shutdown
Thermal Hysteresis
Over-Voltage Protection
Soft Start Time
Delay Time to Shutdown
© 2010 IXYS Corp.
Characteristics subject to change without notice
Conditions
Min
V IN = 3.6 V, VOUT open
V IN = 3.6 V, ILED =
25 mA @ VOUT =36 V
V IN = 5.5V, EN = 0V
At factory preset value
Typ
Max
1
mA
3
1
±3
1.0
92
0.3
1.5
0.1
1.9
250
At factory preset value
0.1
30
250
1.4
0.4
150
20
16
1.5
10
EN = 0
2
Units
µA
%
MHz
%
Ω
Ω
µA
A
mV
kHz
kΩ
V
°C
V
ms
ms
Doc. No. 8724DS, Rev. N1.0
LDS8724
TYPICAL CHARACTERISTICS
Vin = 3.6V, IOUT = 75mA ( 3 strings with 4 LEDs at 25 mA per string, C IN = 1 μF, COUT = 1μF, L = 22 µH, TAMB = 25°C unless otherwise specified
Power Efficiency vs. Input Voltage
LED Current per string vs. Input Voltage
LED Current vs. PWM Duty Cycle
LED Current Error vs. PWM Frequency
Soft Start Waveforms
Operating Waveforms
Ch 1 (yellow) – EN pin, Ch 2 (green) – SW node voltage
Ch 3 (red) – Inductor current, Ch 4 (blue) - VOUT
Ch 1 (yellow) - SW node voltage,
Ch 3 (red) – Inductor current
© 2010 IXYS Corp.
Characteristics subject to change without notice
3
Doc. No. 8724DS, Rev. N1.0
LDS8724
TYPICAL CHARACTERISTICS
Vin = 3.6V, IOUT = 30mA (4 LEDs per string), CIN = 1 μ
F, COUT = 1μF, L = 22 µH, TAMB = 25°C unless otherwise specified
Waveforms at PWM LED Current Regulation
Waveforms at PWM LED Current Regulation
Ch 1 (yellow) – PWM signal at 1 kHz 5% duty cycle
C2 (green) – SW node voltage, Ch 3(red) – LED Current.
Ch4 (blue) - VOUT
Ch 1 (yellow) – PWM signal at 1 kHz 98% duty cycle
C2 (green) – SW node voltage, Ch 3(red) – LED Current.
Ch4 (blue) - VOUT
Waveforms at PWM LED Current Regulation
Waveforms at PWM LED Current Regulation
Ch 1 (yellow) – PWM signal at 30 kHz 25% duty cycle
C2 (green) – SW node voltage, Ch 3(red) – LED Current.
Ch4 (blue) - VOUT
Ch 1 (yellow) – PWM signal at 30 kHz 98% duty cycle
C2 (green) – SW node voltage, Ch 3(red) – LED Current.
Ch4 (blue) - VOUT
© 2010 IXYS Corp.
Characteristics subject to change without notice
4
Doc. No. 8724DS, Rev. N1.0
LDS8724
PIN DESCRIPTION
Pin #
1
2
3
4
5
6
7
8
PAD
Name
VIN
GND
PGND
SW
Function
Input Voltage, connect to battery or power supply
Analog Ground
Power Ground
Switch input; Connect inductor terminal to this pin
Output voltage; Connect the LED string anode
V OUT
terminal to this pin.
High Voltage Bypass; Connect a 470 pF capacitor
HVB
between this point and VOUT
Current Sense input. Connect LED string cathode
LEDS
terminal to this pin
EN/PWM Device Enable (active high) and Dimming Control
PAD
Connect to GND on the PCB
Top view: TDFN 8-lead 2 X 3 mm
PIN FUNCTION
V IN is the supply pin for the driver. A small 1 μF
ceramic bypass capacitor is required between the VIN
pin and ground near the device. The operating input
voltage range is from 2.7 V to 5.5 V. If the input
supply voltage falls below the under-voltage
threshold, switch is disabled, and the device enters
shutdown mode.
GND is the ground reference for the analog circuits.
The pin must be connected to the ground plane on
the PCB. Avoid high currents flowing trough traces
connecting this pin with EN/PWM signal source.
PGND is the current return for high current circuits.
The pin must be connected to the ground plane on
the PCB. Connect GND and PGND as close to the
driver as possible.
HVB is the internal high voltage reference point.
Connect a 4700 pF capacitor between this point and
V OUT.
LEDS is the Current Sense pin that provides internal
regulated current sink for LED string. Connect LED
string cathode to this pin. This pin enter highimpedance zero current state whenever the device is
in shutdown mode.
EN/PWM is the enable and PWM control logic input.
Guaranteed levels of logic high and logic low are set
at 1.4 V and 0.4 V respectively. When EN/PWM is
initially taken high, the device becomes enabled and
LED current sets to maximum programmed value..
To place the device into shutdown mode, the
EN/PWM pin must be held low for more than 10 ms.
PAD is the exposed pad underneath the package.
For best thermal performance, the pad should be
soldered to the PCB and connected to the ground
plane
V OUT is the driver output. Connect it to the LED
anode. A ceramic bypass capacitor of 1 µF requires
between the VOUT pin and ground near the device.
© 2010 IXYS Corp.
Characteristics subject to change without notice
5
Doc. No. 8724DS, Rev. N1.0
LDS8724
BLOCK DIAGRAM
Figure 2. LDS8724 Functional Block Diagram
BASIC OPERATION
At power-up, EN/PWM pin should be logic LOW. The
LDS8724 starts operating when EN/PWM pin is
asserted logic high. If the input voltage is sufficient to
regulate all LED currents, the device remains in
operating mode. The low dropout Current regulator
performs well at VOUT voltage up to 250 mV above
summary LED forward voltage significantly increasing
driver’s efficiency.
Power dissipated at R FB is equal W = 0.0625/R FB,
watt.
In case of three strings with 25 mA current per string
R FB = 0.25/(0.025 x 3 – 0.03) = 5.6 , and dissipated
power W = 0.0625/5.6 = 0.011 W.
The average LED string current that determines LED
brightness may be controlled applying PWM signal to
the EN/PWM pin. The maximum PWM frequency is
30 kHz, while frequiencies below 100 Hz are not
recommended to avoid visible LED flikering. Duty
cycle that determines average LED string current
may vary in the range from 5% to 100% at 1 kHz or
from 20% to 100% at 30 kHz with high linearity
current regulation.
If the input voltage is insufficient or falls to a level
where the regulated currents cannot be maintained,
the Under-Voltage protection turns device off setting
it in shutdown mode.
The LDS8724 has soft start function that prevent high
input current spike at device’ wake-up.
The EN/PWM pin should be held low for more than
10 ms to completely turn device in low current
shutdown mode.
Protection Mode
The output voltage VOUT is limited at about 36 V. This
is to prevent the output pin from exceeding its
absolute maximum rating if LED string is
disconnected or any LED.in string burns out creating
open circuitry.
LED Current Setting
The maximum current sink value in the LEDS pin is
factory preset at 30 mA. An external resisror RFB
should be used to bypass current if more than one
string is connected. RFB = 0.25 V / (I x M – 0.03),
ohms, where 0.25 V is a feedback voltage, I – is
current value per string in ampers, and M is number
of strings connected in parallel.
© 2010 IXYS Corp.
Characteristics subject to change without notice
If the die temperature exceeds +150°C, the driver will
enter a thermal protection shutdown mode. When the
device temperature drops by about 20°C, the device
will resume normal operation.
6
Doc. No. 8724DS, Rev. N1.0
LDS8724
If the input supply voltage falls below the undervoltage threshold, switch is disabled, and the device
enters shutdown mode.
L - is an inductance, H, and
f - is a switching frequency, 700 kHz.
Inductor should have minimum DC resistance to
avoid driver’s efficiency degradation.
LED Selection
The number of the LEDs in string is limited by
maximum output voltage that cannot exceed overvoltage protection level. We recommend using not
more than 10 LEDs with VF ≤3.6 V in string if VIN
voltage is above 3.0 V and not more that 8 LEDs if
V IN may fall up to 2.7 V.
The equation for the output capacitor selection is:
External Components Selection
For example:
The LDS8724 requires four external components
only. The recommended input capacitor value is
between 1.0 and 10uF, while the output capacitor
selection is function of desired output ripple, loop
stability, and inrush current. We recommend COUT =
1 µF.
If V IN = 2.7 V, N = 4, VF = 3.3 V, Vd = 0.25 V, f =
1 MHz, IOUT = 90 mA, (3 strings in parallel x 30 mA)
and ripple voltage VR = 0.1 V, C OUT = 0.56 µF so
1 µF is a good choice.
( NVF V d V IN ) I OUT
C OUT 
, where
( NV F Vd )V R f
VR – is a ripple voltage at the output.
We recommend COUT = 1 µF to achieve better
efficiency and driver’s stability.
The inductor should allow around 20% higher peak
current than LDS8724 Switch Current Limit ILIM (see
table Electrical Operating Characteristics on page 2).
Recommended Layout
In active mode, the driver switches internally at a high
frequency. We recommend minimize trace length to
all external capacitors and inductor. The input and
output ceramic capacitors (X5R or X7R type) should
located as close to the device’ pins as possible to
prevent from EMI distribution
However, the maximum ripple current through
inductor IR should not exceed

I 
NV F Vd 

I R 2
I LIM  LED

, where


V IN


A ground plane should cover the area under the
driver IC as well as the bypass capacitors. Short
connection to ground on capacitors CIN and COUT can
be implemented with the use of multiple via. A copper
area matching the TDFN exposed pad (PAD) must
be connected to the ground plane underneath. The
use of multiple via improves the package heat
dissipation.
V F - is a LED forward voltage, V
N – is number of LEDs per string
Vd - is a current regulator voltage drop = 0.2 V,
V IN - is an input voltage, V
We recommend continuous conduction mode for
inductor to achieve highest efficiency. That limits IR
value as
2I 
NV F Vd 
I R  LED
V IN
Inductor value L is a function of switching frequency,
input and output voltage and is determined by
following equation:
1

1
1
IR f 
NV V V V V
 F
d
PM
IN
IN
L
, where




Figure 3. Recommended layout
V PM - is a voltage drop across synchronous rectifier
(PMOSFET) = 1.5 ohms x ILED, (A),
.
© 2010 IXYS Corp.
Characteristics subject to change without notice
7
Doc. No. 8724DS, Rev. N1.0
LDS8724
PACKAGE DRAWING AND DIMENSIONS
8-PIN TDFN, 2mm x 3mm, 0.5mm PITCH
SYMBOL
A
A1
A2
b
D
D1
E
E1
e
L
MIN
0.700
0.180
2.950
1.750
1.950
1.550
0.350
NOM
0.750
0.000
0.203 Ref.
0.230
3.000
1.800
2.000
1.600
0.500 Bsc
0.400
MAX
0.800
0.050
0.280
3.050
1.850
2.050
1.650
0.450
Note:
1. All dimensions are in millimeters
2. Complies with JEDEC Standard MO-220
© 2010 IXYS Corp.
Characteristics subject to change without notice
8
Doc. No. 8724DS, Rev. N1.0
LDS8724
ORDERING INFORMATION
Part Number
Package
LDS8724 008-T2 – 200
Notes:
1.
2.
3.
1)
TDFN - 8 2 x 3mm
Package Marking
2)
720
Maximum LED current is factory preset at 20 mA. Consult factory if other current values are required.
Matte-Tin Plated Finish (RoHS-compliant)
Quantity per reel is 2000
EXAMPLE OF ORDERING INFORMATION
Prefix
LDS
Device #
Suffix
8724
008
Product Number
Optional
Company ID
Package
T2
Tape & Reel
T: Tape & Reel
2: 2000/Reel
200
LED Current
200 – 20 mA, 0.7 MHz
201 – 20 mA, 1.0 MHz
008: 2 x 3 TDFN
Notes:
1) All packages are RoHS-compliant (Lead-free, Halogen-free).
2) The standard lead finish is Matte-Tin.
3) The device used in the above example is a LDS8724 XXX–T2-200 (2x3 TDFN, Tape & Reel, 20 mA LED Current, 0.7 MHz switching
frequency).
4) For additional package and current options, please contact your nearest IXYS Corp. Sales office.
© 2010 IXYS Corp.
Characteristics subject to change without notice
9
Doc. No. 8724DS, Rev. N1.0
LDS8724
Warranty and Use
IXYS CORP. MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS PRODUCTS FOR ANY
PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE RIGHTS OF THIRD
PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING OUT OF ANY SUCH
USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.
IXYS Corp. products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended
to support or sustain life, or for any other application in which the failure of the IXYS Corp. product could create a situation where personal injury or death may occur.
IXYS Corp. reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets labeled "Advance
Information" or "Preliminary" and other products described herein may not be in production or offered for sale.
IXYS Corp. advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical semiconductor
applications and may not be complete.
IXYS Corp.
1590 Buckeye Dr.,
Milpitas, CA 95035-7418
Phone: 408.457.9000
Fax:
408.496.0222
http://www.ixys.com
© 2010 IXYS Corp.
Characteristics subject to change without notice
Document No: 8724DS
Revision:
N1.0
Issue date:
6/28/2010
10
Doc. No. 8724DS, Rev. N1.0