NSC LM567_03

LM567/LM567C
Tone Decoder
General Description
The LM567 and LM567C are general purpose tone decoders
designed to provide a saturated transistor switch to ground
when an input signal is present within the passband. The
circuit consists of an I and Q detector driven by a voltage
controlled oscillator which determines the center frequency
of the decoder. External components are used to independently set center frequency, bandwidth and output delay.
Features
n 20 to 1 frequency range with an external resistor
n Logic compatible output with 100 mA current sinking
capability
n Bandwidth adjustable from 0 to 14%
n
n
n
n
High rejection of out of band signals and noise
Immunity to false signals
Highly stable center frequency
Center frequency adjustable from 0.01 Hz to 500 kHz
Applications
n
n
n
n
n
n
n
Touch tone decoding
Precision oscillator
Frequency monitoring and control
Wide band FSK demodulation
Ultrasonic controls
Carrier current remote controls
Communications paging decoders
Connection Diagrams
Metal Can Package
Dual-In-Line and Small Outline Packages
00697501
Top View
Order Number LM567H or LM567CH
See NS Package Number H08C
© 2004 National Semiconductor Corporation
DS006975
00697502
Top View
Order Number LM567CM
See NS Package Number M08A
Order Number LM567CN
See NS Package Number N08E
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LM567/LM567C Tone Decoder
February 2003
LM567/LM567C
Absolute Maximum Ratings (Note 1)
LM567H
LM567CH, LM567CM, LM567CN
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage Pin
15V
V3
−10V
V3
V4 + 0.5V
Storage Temperature Range
Dual-In-Line Package
Soldering (10 sec.)
1100 mW
V8
0˚C to +70˚C
Soldering Information
9V
Power Dissipation (Note 2)
−55˚C to +125˚C
260˚C
Small Outline Package
Vapor Phase (60 sec.)
215˚C
Infrared (15 sec.)
220˚C
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
−65˚C to +150˚C
Operating Temperature Range
Electrical Characteristics
AC Test Circuit, TA = 25˚C, V+ = 5V
Parameters
LM567
Conditions
Power Supply Voltage Range
LM567C/LM567CM
Units
Min
Typ
Max
Min
Typ
Max
4.75
5.0
9.0
4.75
5.0
9.0
V
Power Supply Current Quiescent
RL = 20k
6
8
7
10
mA
Power Supply Current Activated
RL = 20k
11
13
12
15
mA
25
mVrms
Input Resistance
18
Smallest Detectable Input Voltage
IL = 100 mA, fi = fo
Largest No Output Input Voltage
IC = 100 mA, fi = fo
20
10
Largest Simultaneous Outband Signal to
Inband Signal Ratio
Minimum Input Signal to Wideband
Noise Ratio
Bn = 140 kHz
Largest Detection Bandwidth
12
Largest Detection Bandwidth Skew
Largest Detection Bandwidth Variation
with Temperature
Largest Detection Bandwidth Variation
with Supply Voltage
15
25
15
4.75–6.75V
10
100
mVrms
6
6
dB
−6
−6
dB
14
16
1
2
10
±2
500
0.5
Fastest ON-OFF Cycling Rate
14
18
% of fo
2
3
% of fo
± 0.1
±1
100
35 ± 60
35 ± 140
4.75V–6.75V
4.75V–9V
kΩ
15
±1
Center Frequency Stability (4.75–5.75V) 0 < TA < 70
−55 < TA < +125
20
20
± 0.1
Highest Center Frequency
Center Frequency Shift with Supply
Voltage
20
1.0
2.0
fo/20
%/˚C
±5
%V
500
kHz
35 ± 60
35 ± 140
ppm/˚C
ppm/˚C
0.4
2.0
2.0
%/V
%/V
fo/20
Output Leakage Current
V8 = 15V
0.01
25
0.01
25
µA
Output Saturation Voltage
ei = 25 mV, I8 = 30 mA
ei = 25 mV, I8 = 100 mA
0.2
0.6
0.4
1.0
0.2
0.6
0.4
1.0
V
Output Fall Time
30
30
ns
Output Rise Time
150
150
ns
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 2: The maximum junction temperature of the LM567 and LM567C is 150˚C. For operating at elevated temperatures, devices in the TO-5 package must be
derated based on a thermal resistance of 150˚C/W, junction to ambient or 45˚C/W, junction to case. For the DIP the device must be derated based on a thermal
resistance of 110˚C/W, junction to ambient. For the Small Outline package, the device must be derated based on a thermal resistance of 160˚C/W, junction to
ambient.
Note 3: Refer to RETS567X drawing for specifications of military LM567H version.
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2
LM567/LM567C
Schematic Diagram
00697503
3
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LM567/LM567C
Typical Performance Characteristics
Typical Frequency Drift
Typical Bandwidth Variation
00697511
00697510
Typical Frequency Drift
Typical Frequency Drift
00697513
00697512
Bandwidth vs Input Signal
Amplitude
Largest Detection Bandwidth
00697514
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00697515
4
LM567/LM567C
Typical Performance Characteristics
(Continued)
Detection Bandwidth as a
Function of C2 and C3
Typical Supply Current vs
Supply Voltage
00697517
00697516
Greatest Number of Cycles
Before Output
Typical Output Voltage vs
Temperature
00697518
00697519
5
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LM567/LM567C
Typical Applications
Touch-Tone Decoder
00697505
Component values (typ)
R1
6.8 to 15k
R2
4.7k
R3
20k
C1
0.10 mfd
C2
1.0 mfd 6V
C3
2.2 mfd 6V
C4
250 mfd 6V
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6
(Continued)
Oscillator with Double Frequency Output
Oscillator with Quadrature Output
00697507
00697506
Connect Pin 3 to 2.8V to Invert Output
Precision Oscillator Drive 100 mA Loads
00697508
7
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LM567/LM567C
Typical Applications
LM567/LM567C
AC Test Circuit
Applications Information
The center frequency of the tone decoder is equal to the free
running frequency of the VCO. This is given by
The bandwidth of the filter may be found from the approximation
Where:
Vi = Input voltage (volts rms), Vi ≤ 200mV
C2 = Capacitance at Pin 2(µF)
00697509
fi = 100 kHz + 5V
*Note: Adjust for fo = 100 kHz.
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8
LM567/LM567C
LM567C MDC MWC
TONE DECODER
00697523
Die Layout (C - Step)
DIE/WAFER CHARACTERISTICS
Fabrication Attributes
General Die Information
Physical Die Identification
LM567C
Bond Pad Opening Size (min)
91µm x 91µm
Die Step
C
Bond Pad Metalization
0.5% COPPER_BAL.
ALUMINUM
Passivation
VOM NITRIDE
Back Side Metal
BARE BACK
Physical Attributes
Wafer Diameter
150mm
Dise Size (Drawn)
1600µm x 1626µm Back Side Connection
63.0mils x 64.0mils
Thickness
406µm Nominal
Min Pitch
198µm Nominal
Floating
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (C - Step)
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
SIGNAL NAME
PAD# NUMBER
X/Y COORDINATES
PAD SIZE
X
Y
X
Y
OUTPUT
FILTER
1
-673
686
91
x
91
LOOP FILTER
2
-673
-419
91
x
91
INPUT
3
-673
-686
91
x
91
V+
4
-356
-686
91
x
91
TIMING RES
5
673
-122
91
x
91
TIMING CAP
6
673
76
91
x
91
GND
7
178
686
117
x
91
OUTPUT
8
-318
679
117
x
104
9
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LM567/LM567C
LM567C MDC MWC
TONE DECODER (Continued)
IN U.S.A
Tel #:
1 877 Dial Die 1 877 342 5343
Fax:
1 207 541 6140
IN EUROPE
Tel:
49 (0) 8141 351492 / 1495
Fax:
49 (0) 8141 351470
IN ASIA PACIFIC
Tel:
(852) 27371701
IN JAPAN
Tel:
www.national.com
81 043 299 2308
10
LM567/LM567C
Physical Dimensions
inches (millimeters)
unless otherwise noted
Metal Can Package (H)
Order Number LM567H or LM567CH
NS Package Number H08C
Small Outline Package (M)
Order Number LM567CM
NS Package Number M08A
11
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LM567/LM567C Tone Decoder
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Molded Dual-In-Line Package (N)
Order Number LM567CN
NS Package Number N08E
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
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which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
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National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship
Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned
Substances’’ as defined in CSP-9-111S2.
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