TI LMH0303_13

LMH0303
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SNLS285G – APRIL 2008 – REVISED APRIL 2013
3 Gbps HD/SD SDI Cable Driver with Cable Detect
Check for Samples: LMH0303
FEATURES
DESCRIPTION
•
The LMH0303 3 Gbps HD/SD SDI Cable Driver with
Cable Detect is designed for use in SMPTE 424M,
SMPTE 292M, SMPTE 344M, and SMPTE 259M
serial digital video applications. The LMH0303 drives
75Ω transmission lines (Belden 1694A, Belden 8281,
or equivalent) at data rates up to 2.97 Gbps.
1
2
•
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•
•
•
•
•
•
•
•
•
•
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SMPTE 424M, SMPTE 292M, SMPTE 344M, and
SMPTE 259M Compliant
Data Rates to 2.97 Gbps
Supports DVB-ASI at 270 Mbps
Cable Detect on Output
Loss of Signal Detect at Input
Output Driver Power Down Control
Typical Power Consumption: 130 mW in SD
Mode and 155 mW in HD Mode
Power Save Mode Typical Power
Consumption: 4 mW
Single 3.3V Supply Operation
Differential Input
75Ω Differential Output
Selectable Slew Rate
Industrial Temperature Range: −40°C to +85°C
16-pin WQFN Package
Footprint Compatible With the LMH0302
APPLICATIONS
•
•
•
The LMH0303 includes intelligent sensing capabilities
to improve system diagnostics. The cable detect
feature senses near-end termination to determine if a
cable is correctly attached to the output BNC. Input
loss of signal (LOS) detects the presence of a valid
signal at the input of the cable driver. These sensing
features may be used to alert the user of a system
fault and activate a deep power save mode, reducing
the cable driver's power consumption to 4 mW. These
features are accessible via an SMBus interface.
The LMH0303 provides two selectable slew rates for
SMPTE 259M and SMPTE 424M / 292M compliance.
The output amplitude is adjustable ±10% in 5 mV
steps via the SMBus.
The LMH0303 is powered from a single 3.3V supply.
Power consumption is typically 130 mW in SD mode
and 155 mW in HD mode. The LMH0303 is available
in a 16-pin WQFN package.
SMPTE 424M, SMPTE 292M, SMPTE 344M, and
SMPTE 259M Serial Digital Interfaces
Digital Video Routers and Switches
Distribution Amplifiers
Typical Application
SDI In
SD/HD
LMH0356
3G/HD/SD
SDI Reclocker
ENABLE
SDI
Clock or
Second
Data Output
SDI Out
LMH0303
3G/HD/SD
SDI Cable Driver
FAULT
SDA SCL
SMBus
Data
SMBus
Clock
Microcontroller
or
FPGA
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2013, Texas Instruments Incorporated
LMH0303
SNLS285G – APRIL 2008 – REVISED APRIL 2013
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VEE
3
RREF
4
NC
NC
FAULT
13
LMH0303
(top view)
5
6
7
8
SCL
2
14
SDA
SDI
15
ENABLE
1
16
RSTI
SDI
RSTO
Connection Diagram
12
SDO
11
SDO
10
SD/HD
9
VCC
The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
Figure 1. 16-Pin WQFN
Package Number RUM
PIN DESCRIPTIONS
Pin
Description
1
SDI
Serial data true input.
2
SDI
Serial data complement input.
3
VEE
Negative power supply (ground).
4
RREF
Bias resistor. Connect a 750Ω resistor to VCC.
5
RSTI
Reset input. RSTI has an internal pullup.
H = Normal operation.
L = Device reset. The device operates with default register settings. Forcing RSTI low also forces
RSTO low.
6
ENABLE
Output driver enable. ENABLE has an internal pullup.
H = Normal operation.
L = Output driver powered off.
7
SDA
SMBus bidirectional data pin. When functioning as an output, it is open drain. This pin requires an
external pullup.
8
SCL
SMBus clock input. SCL is input only. This pin requires an external pullup.
9
VCC
Positive power supply (+3.3V).
10
SD/HD
Output slew rate control. SD/HD has an internal pulldown.
H = Output rise/fall time complies with SMPTE 259M.
L = Output rise/fall time complies with SMPTE 424M / 292M.
11
SDO
Serial data complement output.
12
SDO
Serial data true output.
13
FAULT
Fault open drain output flag. Requires external pullup resistor and may be wire ORed with multiple
cable drivers.
H = Normal operation.
L = Loss of signal or termination fault for any output.
14
NC
No connect. Not bonded internally.
15
NC
No connect. Not bonded internally.
16
RSTO
Reset output. RSTO is automatically set to 1 when register 0 is written. It can be reset back to zero by
forcing RSTI to zero to reset the device. Used to daisy chain multiple cable drivers on the same
SMBus.
VEE
Connect exposed DAP to negative power supply (ground).
DAP
2
Name
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
−0.5V to 3.6V
Supply Voltage
−0.3V to VCC+0.3V
Input Voltage (all inputs)
Output Current
28 mA
−65°C to +150°C
Storage Temperature Range
Junction Temperature
+125°C
Lead Temperature (Soldering 4 Sec)
+260°C
Package Thermal Resistance
ESD Rating
θJA 16-pin WQFN
+43°C/W
θJC 16-pin WQFN
+7°C/W
HBM
8 kV
MM
400V
CDM
(1)
2 kV
Absolute Maximum Ratings are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of Electrical Characteristics specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC – VEE)
3.3V ±5%
−40°C to +85°C
Operating Free Air Temperature (TA)
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DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2).
Symbol
Parameter
VCMIN
Input Common Mode Voltage
VSDI
Input Voltage Swing
VCMOUT
Output Common Mode Voltage
VSDO
Output Voltage Swing
VIH
Input Voltage High Level
VIL
InputVoltage Low Level
ICC
Supply Current
Conditions
Reference
SDI, SDI
Differential
Min
Typ
1.6 +
VSDI/2
100
SDO, SDO
Single-ended, 75Ω load,
RREF = 750Ω 1%
Units
VCC –
VSDI/2
V
2200
mVP−P
VCC –
VSDO
720
SD/HD,
ENABLE
Max
800
V
880
mVP-P
2.0
V
0.8
V
47
57
mA
SD/HD = 1,
SDO/SDO enabled
40
47
mA
SDO/SDO disabled
1.3
2.5
mA
0.8
V
VSDD
V
SD/HD = 0,
SDO/SDO enabled
SMBus DC Specifications
VSIL
Data, Clock Input Low Voltage
VSIH
Data, Clock Input High Voltage
ISPULLUP
Current through pullup resistor or
current source
VSDD
Nominal Bus Voltage
ISLEAKB
Input Leakage per bus segment
ISLEAKP
Input Leakage per pin
CSI
Capacitance for SDA and SCL
(1)
(2)
(3)
(4)
4
2.1
VOL = 0.4 V
(3)
(3) (4)
4
mA
3.0
3.6
V
−200
200
µA
−10
10
µA
10
pF
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
Typical values are stated for VCC = +3.3V and TA = +25°C.
Recommended value — Parameter not tested.
Recommended maximum capacitive load per bus segment is 400 pF.
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AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1).
Symbol
Parameter
DRSDI
Input Data Rate
tjit
Additive Jitter
tr,tf
Conditions
Reference
Min
SDI, SDI
2.97 Gbps
Output Rise Time, Fall Time
SDO, SDO
Mismatch in Rise/Fall Time
Duty Cycle Distortion
RLSDO
Output Return Loss
Units
2970
Mbps
psP-P
1.485 Gbps
18
psP-P
270 Mbps
15
psP-P
SD/HD = 0, 20% – 80%,
130
ps
800
ps
SD/HD = 0
30
ps
SD/HD = 1
50
ps
SD/HD = 0, 2.97 Gbps (2)
27
ps
SD/HD = 0, 1.485 Gbps (2)
30
ps
SD/HD = 1
Output Overshoot
Max
20
90
SD/HD = 1, 20% – 80%
tOS
Typ
400
(2)
100
ps
SD/HD = 0 (2)
10
%
SD/HD = 1 (2)
8
%
5 MHz - 1.5 GHz (3)
15
dB
1.5 GHz - 3.0 GHz (3)
10
dB
SMBus AC Specifications
fSMB
Bus Operating Frequency
10
100
kHz
tBUF
Bus free time between Stop
and Start Condition
4.7
µs
tHD:STA
Hold time after (repeated) Start
Condition. After this period, the
first clock is generated.
4.0
µs
4.7
µs
At ISPULLUP = MAX
tSU:STA
Repeated Start Condition setup
time
tSU:STO
Stop Condition setup time
4.0
µs
tHD:DAT
Data hold time
300
ns
tSU:DAT
Data setup time
250
ns
tLOW
Clock low period
4.7
µs
tHIGH
Clock high period
4.0
50
µs
tF
Clock/Data Fall Time
300
ns
tR
Clock/Data Rise Time
1000
ns
tPOR
Time in which device must be
operational after power on
500
ms
(1)
(2)
(3)
Typical values are stated for VCC = +3.3V and TA = +25°C.
Specification is ensured by characterization.
Output return loss is dependent on board design. The LMH0303 meets this specification on the SD303 evaluation board.
TIMING DIAGRAM
tLOW
tR
tHIGH
SCL
tHD:STA
tBUF
tHD:DAT
tF
tSU:STA
tSU:DAT
tSU:STO
SDA
SP
ST
ST
SP
Figure 2. SMBus Timing Parameters
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DEVICE OPERATION
INPUT INTERFACING
The LMH0303 accepts either differential or single-ended input. For single-ended operation, the unused input
must be properly terminated.
OUTPUT INTERFACING
The LMH0303 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75Ω AC-coupled
coaxial cable with an RREF resistor of 750Ω. The RREF resistor is connected between the RREF pin and VCC. The
only resistor value that should be used for RREF is 750Ω.
The RREF resistor should be placed as close as possible to the RREF pin. In addition, the copper in the plane
layers below the RREF network should be removed to minimize parasitic capacitance.
OUTPUT SLEW RATE CONTROL
The LMH0303 output rise and fall times are selectable for either SMPTE 259M or SMPTE 424M / 292M
compliance via the SD/HD pin. For slower rise and fall times, or SMPTE 259M compliance, SD/HD is set high.
For faster rise and fall times, or SMPTE 424M and SMPTE 292M compliance, SD/HD is set low. SD/HD may
also be controlled using the SMBus, provided the SD/HD pin is held low. SD/HD has an internal pulldown.
OUTPUT ENABLE
The SDO/SDO output driver can be enabled or disabled with the ENABLE pin. When set low, the output driver is
powered off and the LMH0303 enters a deep power save mode. ENABLE has an internal pullup.
INPUT LOS OF SIGNAL DETECTION (LOS)
The LMH0303 detects when the input signal does not have a video-like pattern. Self oscillation and low levels of
noise are rejected. This loss of signal detect allows a very sensitive input stage that is robust against coupled
noise without any degradation of jitter performance.
Via the SMBus, the loss of signal detect can either add an input offset or mute the outputs. An offset is added by
default. Additionally, the loss of signal detect can be linked to the ENABLE functionality so that when the LOS
goes low, ENABLE will also go low.
OUTPUT CABLE DETECTION
The LMH0303 detects when an output is locally terminated. When a video signal (or AC test signal) is present on
SDI, the device senses the SDO and SDO amplitudes. If the output is not properly terminated (via a terminated
cable or local termination), the amplitude will be higher than expected, and the Termination Fault signal is
asserted. The Termination Fault signal is de-asserted when the proper termination is applied. This feature allows
the system designer the flexibility to react to cable attachment and removal. Note that a long length of cable will
look like a proper termination at the device output.
The cable driver must be enabled for the termination detection to operate. If the Termination Fault will be used to
power down the LMH0303, then periodic polling (enabling) is recommended to monitor the output termination.
For example, when a Fault condition is triggered, ENABLE can be driven low to power down the device. The
LMH0303 should be re-enabled periodically to check the status of the output termination. The LMH0303 needs to
be powered on for roughly 4 ms for Termination Fault detection to work.
SMBus Interface
The System Management Bus (SMBus) is a two-wire interface designed for the communication between various
system component chips. By accessing the control functions of the circuit via the SMBus, pincount is kept to a
minimum while allowing a maximum amount of versatility. The LMH0303 has several internal configuration
registers which may be accessed via the SMBus.
The 7-bit default address for the LMH0303 is 17h. The LSB is set to 0b for a WRITE and 1b for a READ, so the
8-bit default address for a WRITE is 2Eh and the 8-bit default address for a READ is 2Fh. The SMBus address
may be dynamically changed.
6
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In applications where there might be several LMH0303s, the SDA, SCL, and FAULT pins can be shared. The
SCL, SDA, and FAULT pins are open drain and require external pullup resistors. Multiple LMH0303s may have
the FAULT pin wire ORed. This signal becomes active when either loss of signal is detected or any termination
faults are detected. The registers may be read in order to determine the cause. Additionally, each signal can be
masked from the FAULT pin.
TRANSFER OF DATA VIA THE SMBus
During normal operation the data on SDA must be stable during the time when SCL is High.
There are three unique states for the SMBus:
START: A High-to-Low transition on SDA while SCL is High indicates a message START condition.
STOP: A Low-to-High transition on SDA while SCL is High indicates a message STOP condition.
IDLE: If SCL and SDA are both High for a time exceeding tBUF from the last detected STOP condition or if they
are High for a total exceeding the maximum specification for tHIGH then the bus will transfer to the IDLE state.
SMBus TRANSACTIONS
The device supports WRITE and READ transactions. See Table 1 for register address, type (Read/Write, Read
Only), default value and function information.
WRITING A REGISTER
To
1.
2.
3.
4.
5.
6.
7.
write a register, the following protocol is used (see SMBus 2.0 specification).
The Host drives a START condition, the 7-bit SMBus address, and a “0” indicating a WRITE.
The Device (Slave) drives the ACK bit (“0”).
The Host drives the 8-bit Register Address.
The Device drives an ACK bit (“0”).
The Host drives the 8-bit data byte.
The Device drives an ACK bit (“0”).
The Host drives a STOP condition.
The WRITE transaction is completed, the bus goes IDLE and communication with other SMBus devices may
now occur.
READING A REGISTER
To read a register, the following protocol is used (see SMBus 2.0 specification).
1. The Host drives a START condition, the 7-bit SMBus address, and a “0” indicating a WRITE.
2. The Device (Slave) drives the ACK bit (“0”).
3. The Host drives the 8-bit Register Address.
4. The Device drives an ACK bit (“0”).
5. The Host drives a START condition.
6. The Host drives the 7-bit SMBus Address, and a “1” indicating a READ.
7. The Device drives an ACK bit “0”.
8. The Device drives the 8-bit data value (register contents).
9. The Host drives a NACK bit “1”indicating end of the READ transfer.
10. The Host drives a STOP condition.
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APPLICATION INFORMATION
Figure 3 shows the application circuit for the LMH0303.
VCC
VCC
10 k:
FAULT
75:
0.1 PF
75:
RSTO
13
FAULT
14
15
SD/HD
4.7 PF Coaxial Cable
75:
4.7 PF Coaxial Cable
12
11
10
75:
75:
6.8 nH
9
DAP
RSTI
5
VCC
SCL
RREF
VCC
75:
8
4
LMH0303
VEE
SDA
3
SDO
7
0.1 PF
SDI
ENABLE
2
SDO
SDI
6
1
49.9:
Differential
Input
NC
RSTO
49.9:
NC
16
6.8 nH
750:
RSTI
VCC
ENABLE
SDA
SCL
VCC
0.1 PF
10 k:
10 k:
SD/HD
Figure 3. Application Circuit
COMMUNICATING WITH MULTIPLE LMH0303 CABLE DRIVERS VIA THE SMBus
A common application for the LMH0303 will utilize multiple cable driver devices. Even though the LMH0303
devices all have the same default SMBus device ID (address), it is still possible for them share the SMBus
signals as shown in Figure 4. A third signal is required from the host to the first device. This signal acts as a
“Enable / Reset” signal. Additional LMH0303s are controlled from the upstream device. In this control scheme,
multiple LMH0303s may be controlled via the two-wire SMBus and the use of one GPO (General Purpose
Output) signal. Other SMBus devices may also be connected to the two wires, assuming they have their own
unique SMBus addresses.
8
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3.3V
RSTO
RSTI
RSTO
SDA
RSTI
LMH0303
#N
SCL
RSTO
SCL
GPO
SCL
LVCMOS GPIO
SMBus Interface
RSTI
SDA
Host
(e.g. FPGA)
LMH0303
#2
SDA
LMH0303
#1
SCL
SDA
Figure 4. SMBus Configuration for Multiple LMH0303 Cable Drivers
The RSTI pin of the first device is controlled by the system with a GPO pin from the host. The first LMH0303
RSTO pin is then daisy chained to the next device's RSTI pin. That device’s RSTO pin is connected to the next
device and so on.
The procedure at initialization is to:
1. Hold the host GPO pin Low in RESET, to the first device. RSTO output default is also Low which holds the
next device in RESET in the chain.
2. Raise the host GPO signal to LMH0303 #1 RSTI input pin.
3. Write to Address 8’h2E (7’h17) Register 0 with the new address value (e.g. 8’h2C (7’h16).
4. Upon writing Register 0 in LMH0303 #1, its RSTO signal will switch High. Its new address is 8’h2C (7’h16),
and the next LMH0303 in the chain will now respond to the default address of 8’h2E (7’h17).
5. The process is repeated until all LMH0303 devices have a unique address loaded.
6. Direct SMBus writes and reads may now take place between the host and any addressed device.
The 7-bit address field allows for 128 unique addresses. The above procedure allows for the reprogramming of
the LMH0303 devices such that multiple devices may share the two-wire SMBus. Make sure all devices on the
bus have unique device IDs.
If power is toggled to the system, the SMBus address routine needs to be repeated.
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SMBUS REGISTERS
Table 1. SMBus Registers
Address
R/W
Name
Bits
Field
Default
Description
00h
R/W
ID
7:1
DEVID
0010111
Device ID. Writing this register will force the
RSTO pin high. Further accesses to the
device must use this 7-bit address.
0
RSVD
0
01h
R
STATUS
7:3
RSVD
00000
02h
10
R/W
MASK
Reserved as 0. Always write 0 to this bit.
Reserved.
2
TFN
0
Termination Fault for SDI.
0: No Termination Fault Detected.
1: Termination Fault Detected.
1
TFP
0
Termination Fault for SDI.
0: No Termination Fault Detected.
1: Termination Fault Detected.
0
LOS
0
Loss Of Signal (LOS) detect at input.
0: No Signal Detected.
1: Signal Detected.
7
SD
0
SD Rate select bit. If the SD/HD pin is set to
VCC, it overrides this bit. With the SD/HD pin
set to ground, this bit selects the output edge
rate as follows:
0: HD edge rate.
1: SD edge rate.
6
RSVD
0
Reserved as 0. Always write 0 to this bit.
5
PD
0
Power Down for SDO output stage. If the
ENABLE pin is set to ground, it overrides this
bit. With the ENABLE pin set to VCC, PD
functions as follows:
0: SDO active.
1: SDO powered down.
4:3
RSVD
00
Reserved as 00. Always write 00 to these bits.
2
MTFN
0
Mask TFN from affecting FAULT pin.
0: TFN=1 will cause FAULT to be 0.
1: TFN=1 will not affect FAULT; the condition
is masked off.
1
MTFP
0
Mask TFP from affecting FAULT pin.
0: TFP=1 will cause FAULT to be 0.
1: TFP=1 will not affect FAULT; the condition
is masked off.
0
MLOS
0
Mask LOS from affecting FAULT pin.
0: LOS=0 will cause FAULT to be 0.
1: LOS=0 will not affect FAULT; the condition
is masked off.
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Table 1. SMBus Registers (continued)
Address
R/W
Name
03h
R/W
DIRECTION
04h
R/W
OUTPUT
Bits
Field
Default
Description
7
HDTFThreshLSB
1
Least Significant Bit for HDTFThresh
detection threshold. Combines with
HDTFThresh bits in register 04h.
6
SDTFThreshLSB
1
Least Significant Bit for SDTFThresh
detection threshold. Combines with
SDTFThresh bits in register 05h.
5:3
RSVD
000
2
DTFN
0
Direction of TFN that affects FAULT pin (when
not masked).
0: TFN=1 will cause FAULT to be 0 (when the
condition is not masked off).
1: TFN=0 will cause FAULT to be 0 (when the
condition is not masked off).
1
DTFP
0
Direction of TFP that affects FAULT pin (when
not masked).
0: TFP=1 will cause FAULT to be 0 (when the
condition is not masked off).
1: TFP=0 will cause FAULT to be 0 (when the
condition is not masked off).
0
DLOS
0
Direction of LOS that affects FAULT pin
(when not masked).
0: LOS=0 will cause FAULT to be 0 (when the
condition is not masked off).
1: LOS=1 will cause FAULT to be 0 (when the
condition is not masked off).
100
Sets the Termination Fault threshold for SDO,
when SD is set to HD rates (0). Combines
with HDTFThreshLSB in register 03h (default
for combined value is 1001).
10000
SDO output amplitude in roughly 5 mV steps.
7:5
HDTFThresh
4:0
AMP
Reserved as 000. Always write 000 to these
bits.
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Table 1. SMBus Registers (continued)
12
Address
R/W
Name
05h
R/W
OUTPUTCTRL
Bits
Field
Default
7
RSVD
0
Reserved as 0. Always write 0 to this bit.
6
FLOSOF
0
Force LOS to always OFF in regard to its
effect on the output signal. This forces the
device into either the mute or “add offset”
state. The LOS bit in register 01h still reflects
the correct state of LOS.
0: LOS operates normally, muting or adding
offset as specified by the MUTE bit.
1: Muting or adding offset is always in place
as specified by the MUTE bit.
5
FLOSON
0
Force LOS to always ON in regard to its effect
on the output signal. This prevents the device
from muting or adding offset. The LOS bit in
register 01h still reflects the correct state of
LOS.
0: LOS operates normally, muting or adding
offset as specified in the MUTE bit.
1: Muting or adding offset never occurs.
4
LOSEN
0
Configures LOS to be combined with the
ENABLE functionality.
0: Only the PD bit and ENABLE pin affect the
power down state of the output drivers.
1: If the ENABLE pin is set to ground, it
powers down the output drivers regardless of
the state of LOS or the PD bit. With the
ENABLE pin set to VCC, LOS=0 will power
down the output drivers, and LOS=1 will leave
the power down state dependent on the PD
bit.
3
MUTE
0
Selects whether the device will MUTE when
loss of signal is detected or add an offset to
prevent self oscillation. When an input signal
is detected (LOS=1), the device will operate
normally.
0: Loss of signal will force a small offset to
prevent self oscillation.
1: Loss of signal will force the channel to
MUTE.
010
Sets the Termination Fault threshold for SDO,
when SD is set to SD rates (1). Combines
with SDTFThreshLSB in register 03h (default
for combined value is 0101).
2:0
SDTFThresh
Description
06h
R/W
RSVD
7:0
RSVD
00000000
Reserved as 00000000. Always write
00000000 to these bits.
07h
R/W
RSVD
7:0
RSVD
00000000
Reserved as 00000000. Always write
00000000 to these bits.
08h
R/W
TEST
7:5
CMPCMD
4:0
RSVD
000
00000
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Compare command. Determines whether the
peak value or the current value of the
Termination Fault counters is read in registers
0Ah and 0Bh.
000: Resets compare value to 00; registers
0Ah and 0Bh show current counter values.
Sets detection to look for MAX peak values.
001: Capture counter 0. Register 0Ah shows
peak value.
010: Capture counter 1. Register 0Bh shows
peak value.
011, 100: Reserved.
101: Resets compare value to 1Fh. Sets
detection to look for MIN peak values.
110, 111: Reserved.
Reserved as 00000. Always write 00000 to
these bits.
Copyright © 2008–2013, Texas Instruments Incorporated
Product Folder Links: LMH0303
LMH0303
www.ti.com
SNLS285G – APRIL 2008 – REVISED APRIL 2013
Table 1. SMBus Registers (continued)
Address
R/W
09h
R
0Ah
0Bh
R
R
Name
Bits
Field
Default
REV
7:5
RSVD
000
Reserved.
4:3
DIREV
10
Die Revision.
2:0
PARTID
011
Part Identifier. Note that single output devices
(LMH0303) have the LSB=1. Dual output
devices (LMH0307) have the LSB=0.
7:5
RSVD
000
Reserved.
4:0
TFPCOUNT
7:5
RSVD
4:0
TFNCOUNT
TFPCOUNT
TFNCOUNT
00000
000
00000
Description
This is either the current value of TFP
Counter, or the peak value of the counter,
depending on CMPCMD in register 08h.
Reserved.
This is either the current value of TFN
Counter, or the peak value of the counter,
depending on CMPCMD in register 08h.
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Product Folder Links: LMH0303
13
LMH0303
SNLS285G – APRIL 2008 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision F (April 2013) to Revision G
•
14
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
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Copyright © 2008–2013, Texas Instruments Incorporated
Product Folder Links: LMH0303
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LMH0303SQ/NOPB
ACTIVE
WQFN
RUM
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
L0303
LMH0303SQE/NOPB
ACTIVE
WQFN
RUM
16
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
L0303
LMH0303SQX/NOPB
ACTIVE
WQFN
RUM
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
L0303
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMH0303SQ/NOPB
WQFN
RUM
16
LMH0303SQE/NOPB
WQFN
RUM
LMH0303SQX/NOPB
WQFN
RUM
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
16
250
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMH0303SQ/NOPB
WQFN
RUM
16
1000
213.0
191.0
55.0
LMH0303SQE/NOPB
WQFN
RUM
16
250
213.0
191.0
55.0
LMH0303SQX/NOPB
WQFN
RUM
16
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
RUM0016A
SQB16A (Rev A)
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