TI LP324NE4

LP324, LP2902
ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS460A – MARCH 2005 – REVISED MAY 2005
FEATURES
•
•
•
•
•
•
•
D, N, OR PW PACKAGE
(TOP VIEW)
Low Supply Current . . . 85 µA Typ
Low Offset Voltage . . . 2 mV Typ
Low Input Bias Current . . . 2 nA Typ
Input Common Mode to GND
Wide Supply Voltage . . . 3 V < VCC < 32 V
Pin Compatible With LM324
Applications
– LCD Displays
– Portable Instrumentation
– Sensor/Metering Equipment
– Consumer Electronics (MP3 Players, Toys,
Etc.)
– Power Supplies
1OUT
1IN−
1IN+
VCC
2IN+
2IN−
2OUT
1
14
2
13
3
12
4
11
5
10
6
9
7
8
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
DESCRIPTION/ORDERING INFORMATION
The LP324 and LP2902 are quadruple low-power operational amplifiers especially suited for battery-operated
applications. Good input specifications and wide supply-voltage range still are achieved, despite the ultra-low
supply current. Single-supply operation is achieved with an input common-mode range that includes GND.
The LP324 and LP2902 are ideal in applications where wide supply voltage and low power are more important
than speed and bandwidth. These applications include portable instrumentation, LCD displays, consumer
electronics (MP3 players, toys, etc.), and power supplies.
ORDERING INFORMATION
PACKAGE (1)
TA
PDIP – N
0°C to 70°C
SOIC – D
TSSOP – PW
PDIP – N
–40°C to 85°C
SOIC – D
TSSOP – PW
(1)
ORDERABLE PART NUMBER
Tube of 25
LP324N
Tube of 50
LP324D
Reel of 2500
LP324DR
Tube of 90
LP324PW
Reel of 2000
LP324PWR
Tube of 25
LP2902N
Tube of 50
LP2902D
Reel of 2500
LP2902DR
Tube of 50
LP2902PW
Reel of 2500
LP2902PWR
TOP-SIDE MARKING
LP324N
LP324
LP324
LP2902N
LP2902
LP2902
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
SYMBOL (EACH AMPLIFIER)
−
IN−
OUT
+
IN+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
LP324, LP2902
ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS460A – MARCH 2005 – REVISED MAY 2005
SCHEMATIC (EACH AMPLIFIER)
VCC
OUT
IN−
IN+
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
VCC
MAX
Supply voltage range (2)
V
±32
V
32
V
voltage (3)
VID
Differential input
VI
Input voltage (either input)
–0.3
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C, VCC ≤ 15 V (4)
Unlimited
D package
θJA
Package thermal
impedance (5) (6)
86
N package
80
PW package
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
UNIT
±16 or 32
°C/W
113
–65
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
Differential voltages are at IN+, with respect to IN–.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
ESD Protection
TEST CONDITIONS
Human-Body Model
2
TYP
UNIT
±2
kV
LP324, LP2902
ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS460A – MARCH 2005 – REVISED MAY 2005
Electrical Characteristics
TA = 25°C, VCC = 5 V, VIC = VCC/2, RL = 100 kΩ to GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS (1)
TA (2)
LP324
MAX
MIN TYP (3)
MAX
2
4
2
4
25°C
VIO
Input offset voltage
IIB
Input bias current
IIO
Input offset current
AV
Large-signal
voltage gain
RL = 10 kΩ to GND,
VCC = 30 V
25°C
50
Full range
40
CMRR
Common-mode
rejection ratio
VCC = 30 V,
VIC = 0 V to VCC – 1.5 V
25°C
80
Full range
75
kVSR
Power-supply
rejection ratio
VCC = 5 V to 30 V
25°C
80
Full range
75
ICC
Supply current
RL = ∞
VOH
Output voltage
swing (high)
IL = 0.35 mA to GND,
VIC = 0 V
VOL
Output voltage
swing (low)
IL = 0.35 mA from VCC,
VIC = 0 V
IO
Output source
current
VO = 3 V, VID = 1 V
Full range
9
25°C
2
Full range
25°C
0.2
25°C
Output sink current
VO = 1.5 V, VID = –1 V,
VIC = 0 V
25°C
25°C
2
2
0.5
40
70
90
80
90
80
90
85
1
25°C
7
Full range
4
25°C
4
Full range
3
25°C
2
Full range
1
150
275
3.6
3.4
3.6
0.82
0.7
7
10
mA
4
5
4
5
3
4
2
µA
V
1
10
nA
V
VCC – 1.9
0.7
nA
V
75
150
mV
dB
75
90
UNIT
V/mV
30
VCC – 1.9
0.82
4
8
250
3.4
20
40
100
85
Full range
25°C
10
4
Full range
Full range
10
20
Full range
VO = 1.5 V, VID = –1 V
IO
LP2902
MIN TYP (3)
mA
4
1
20
35
20
35
IOS,GND
Output short to GND VID = 1 V
IOS,VCC
Output short to VCC
∝VIO
Input offset
voltage drift
25°C
10
10
µV/°C
∝IIO
Input offset
current drift
25°C
10
10
pA/°C
(1)
(2)
(3)
VID = –1 V
Full range
25°C
40
15
Full range
30
40
15
45
30
45
mA
mA
For full-range temperature limits: VCC = 3 V to 32 V, VICR = 0 V to VCC – 1.5 V (unless otherwise noted)
Full range is 0°C to 70°C for LP324 and –40°C to 85°C for LP2902.
All typical values are at TA = 25°C.
Operating Conditions
VCC = ±15 V, TA = 25°C
PARAMETER
TYP
UNIT
GBW
Gain bandwidth product
100
kHz
SR
Slew rate
50
V/ms
3
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LP2902D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LP2902NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LP2902PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP2902PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LP324NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LP324PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LP324PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LP324PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP2902DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
LP2902PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
LP324DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
LP324PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP2902DR
SOIC
D
14
2500
333.2
345.9
28.6
LP2902PWR
TSSOP
PW
14
2000
346.0
346.0
29.0
LP324DR
SOIC
D
14
2500
333.2
345.9
28.6
LP324PWR
TSSOP
PW
14
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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