Ordering number : ENA1982A Monolithic Linear IC LV5683P For Car Audio Systems Multi Voltage Regulator IC Overview The LV5683P is a multi voltage regulator suitable for USB silicon tuner car-audio systems. This IC has 4 outputs, VDD 5V(3.3V), AUDIO(8.5V), SWU(3.3V) and USB5V(CD 8V: available). About protection circuits, it has Over-current-protection, Over-voltage-protection and Thermal-shut-down. VCC1(SWU and USB supply) is independent terminal from VCC, and accepts lower voltage(ex. From DC/DC converter) which enables to reduce power dissipation. Features • 4 system regulator VDD(LCD micon) : VOUT 5.0V(3.3V), IO max 300mA, reverse current prevention. Audio : VOUT 8.5V, IO max 300mA SWU(systems) : VOUT 3.3V, IO max 500mA USB : VOUT 5.0V(8.0V available for CD), IO max 1100mA • Over-current-protection • Over-voltage-protection: Typ 21V(except VDD) • Thermal-shut-down Typ 175ºC • Applied Pch-LDMOS for output stages. (Warning)The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range or thermal shut down state may degrade the IC’s reliability and eventually damage the IC. Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Conditions Supply voltage VCC max Allowable Power dissipation Pd max (*Ta ≤ 25°C) Conditions Ratings Unit 36 V IC unit 1.3 W With Al heatsink(50×50×1.5mm3) 5.3 W Infinite heat rediation 26 W See below pulse wave. 50 V Peak supply voltage VCC peak Operating ambient temperature Topr -40 to +85 °C Storage temperature Tstg -55 to +150 °C Junction temperature Tj max 150 °C Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. O2611 SY 20111014-S00006/O1211 SY 20110928-S00007 No.A1982-1/9 LV5683P Peak voltage testing pulse wave 50V 90% 10% 16V 5msec 100msec Recommended Operating condition at Ta = 25°C Parameter Conditions Ratings Unit Power supply voltage rating 1 VDD output(5V/3.3V) 7 to 16 V Power supply voltage rating 2 USB(5V) output, SWU output: VCC=VCC1 7.5 to 16 V Power supply voltage rating 3 AUDIO output 10 to 16 V Power supply voltage rating 4 USB(8V) output: VCC=VCC1 10.5 to 16 V Electrical Characteristics at Ta = 25°C, VCC = VCC1 =14.4V (*1) Ratings Parameter Symbol Conditions Unit min Quiescent current ICC typ VDD no load, ALL EN terminal = ⎡L⎦ max 50 100 μA 0.5 V AUDIO_EN Input Low input voltage VIL1 0 High input voltage VIH1 2.8 Input impedance RIH1 280 400 5.5 V 520 kΩ V SWU_EN Input Low input voltage VIL2 0 0.5 High input voltage VIH2 2.8 5.5 V Input impedance RIH2 280 520 kΩ V 400 USB_EN input Low input voltage VIL3 0 0.5 High input voltage VIH3 2.8 5.5 V Input impedance RIH3 280 400 520 kΩ 5.0 5.25 VDD (5V/3.3V)output(reverse current prevention diode implemented) VDD output voltage 1 VO11 IO11 = 200mA, IKVDD=OPEN, or VDDout 4.75 VDD output current 1 IO11 VO11 ≥ 4.7V 300 VDD output voltage 2 VO12 IO12 = 200mA, IKVDD=GND 3.13 VDD output current 2 IO12 VO12 ≥ 3.1V 300 Line regulation ΔVOLN1 7V < VCC < 16V, IO1 = 200mA Load regulation ΔVOLD1 Dropout voltage 1 VDROP1 VCC ripple rejection RREJ1 f=120Hz, VCC=1VPP, IO1=200mA VDD reverse current IREV VO11=5.0V, VCC=0V USB output voltage 1 VO21 IO21 = 200mA, IKUSB=OPEN, or USBout USB output current 1 IO21 VO21 ≥ 7.45V 1100 USB output voltage 2 VO22 IO22 = 1000mA, IKUSB=GND 4.75 USB output current 2 IO22 VO22 ≥ 4.6V 1100 Line regulation ΔVOLN2 10.5V < VCC1 < 16V, IO2 = 1000mA Load regulation ΔVOLD2 Dropout voltage 1 VDROP2 VCC1 ripple rejection RREJ2 f=120Hz, VCC1=1VPP, IO2=1000mA V mA 3.3 3.47 V mA 50 100 mV 1mA < IO11, IO12 < 200mA 80 150 mV IO1 = 200mA (implemented diode) 1.5 2.5 40(*2) 50(*2) V dB 10 100 μA 8.0 8.4 V 5.0 5.25 USB/CD output ; USB_EN = High 7.6 mA V mA 50 100 mV 10mA < IO21, IO22 < 1000mA 100 200 mV IO21, IO22 = 1000mA 1.0 2.0 40(*2) 50(*2) V dB Continued on next page. No.A1982-2/9 LV5683P Continued from preceding page. Ratings Parameter Symbol Conditions Unit min typ max AUDIO output ; AUDIO_EN = High AUDIO output voltage VO3 IO3 = 200mA 8.1 AUDIO output current IO3 VO3 ≥ 8V 300 8.5 8.9 V Line regulation ΔVOLN3 10V < VCC < 16V, IO3 = 200mA 30 100 mV Load regulation ΔVOLD3 1mA < IO3 < 200mA 70 140 mV Dropout voltage VDROP3 IO3 = 200mA 0.4 0.7 V VCC ripple rejection RREJ3 f = 120Hz, VCC=1VPP, IO3=200mA μA 40(*2) 50(*2) 3.3 dB SWU (3.3V) Output ; SEU_EN = High ILM output voltage VO4 IO4 = 400mA 3.13 ILM output current IO4 VO4 ≥ 3.1V 500 3.47 V Line regulation ΔVOLN4 7.5V < VCC1 < 16V, IO4 = 400mA 30 100 mV Load regulation ΔVOLD4 1mA < IO4 < 400mA 80 150 mV mA VCC1 ripple rejection RREJ4 f = 120Hz, VCC1=1VPP, IO4=400mA 40(*2) 50(*2) dB *1: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta(=25°C) are almost equal. There tests were performed with pulse load to minimize the increase of junction temperature(Tj). *2 : design certification Package Dimensions unit : mm (typ) 3336 21.6 HEAT SPREADER (20.0) 3.0 (11.0) (11.0) 3.35 12.4 (9.05) (14.55) 17.9 (8.6) (R1.75) 1 0.4 15 (1.91) 1.27 2.54 2.54 0.7 SANYO : HZIP15 Allowable power dissipation derating curve Pd max -- Ta Allowable power dissipation, Pd max - W 8 7 6 (a) IC unit(HZIP15) (b) With Al heatsink(50×50×1.5mm3) Al heatsink mounting conditions Tightening torque: 39N·cm, using silicone grease 5.3 5 Al heat sink (50 × 50 × 1.5mm3) 4 3 2 1.3 IC unit 1 0 0 25 50 75 100 125 150 Ambient temperature, Ta - C No.A1982-3/9 LV5683P 5 7 11 GND SWU 12 USB 10 9 USB_EN IKESB VCC 8 VCC 1 6 (NC) 4 3 IKVDD VDD 2 1 (NC) AUDIO LV5683P SWU_EN AUDIO_EN (NC) Pin assignment 14 15 13 Block Diagram B+ VCC + 8 Start up OverVoltage Protection + AUDIO(8.5V) 3 + 300mA Vref + 5 AUDIO_EN 2 6 VDD(5V/3.3V) + 300mA IKVDD: VDD(3.3/5.0V) select IKVDD=OPEN or VDD out 5.0V IKVDD=GND: 3.3V OUTPUT SWU_EN 10 9 Control + USB_EN 12 Thermal VCC1 + ex.) DC-DC 13 USB/CD(5V/8V) + 1100mA 11 IKUSB: USB(5/8V) select IKUSB=OPEN or USB out: 8V IKUSB=GND: 5V Shut Down + GND 14 15 SWU(3.3V) + 500mA No.A1982-4/9 LV5683P Pin Function Pin No. Pin name Description 1 N.C. - 2 AUDIO_EN AUDIO output CTRL Equivalent Circuit - VCC 8 2 14 3 AUDIO AUDIO output when AUDIO_EN = High, ON 8.5V/0.3A GND VCC 8 3 14 4 N.C. - 5 VDD VDD output 5.0V, 3.3V/0.3A GND - VCC 8 5 14 6 IKVDD VDD output voltage select OPEN : VDD = 5.0V GND VCC 8 GND : VDD = 3.3V 6 14 7 N.C. - 8 VCC VCC VCC1 VCC1 GND - 8 VCC 9 9 14 GND Continued on next page. No.A1982-5/9 LV5683P Continued from preceding page. Pin No. 10 Pin name SWU_EN Description Equivalent Circuit SWU output CTRL 8 VCC1 10 14 11 IKUSB GND USB output voltage select 8 OPEN : VDD = 8.0V VCC1 GND : VDD = 5.0V 11 12 USB_EN 14 GND 8 VCC1 USB output CTRL 12 14 13 USB USB output when USB_EN = High, ON 5.0V, 8.0V/1.1A GND VCC1 8 13 14 14 GND GND 15 SWU SWU output when SWU_EN = High, ON 3.3V/0.5A GND 8 VCC1 15 14 GND No.A1982-6/9 LV5683P Timing Chart 21V VCC (8PIN) VCC1 (9PIN) VDD (5PIN) USB_EN (12PIN) USB (13PIN) AUDIO_EN (2PIN) AUDIO (3PIN) SWU_EN (10PIN) SWU (15PIN) No.A1982-7/9 LV5683P HZIP15 Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) d. Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. No.A1982-8/9 LV5683P SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of October, 2011. Specifications and information herein are subject to change without notice. PS No.A1982-9/9