ENA1982 D

Ordering number : ENA1982D
LV5683P
Bi-CMOS IC
Multi Voltage Regulator IC
for Car Audio Systems
http://onsemi.com
Overview
The LV5683P is a multi voltage regulator suitable
for USB silicon tuner car-audio systems.
This IC has 4 outputs, VDD 5V(3.3V), AUDIO(8.5V),
SWU(3.3V) and USB5V(CD 8V: available).
About protection circuits, it has Over-current-protection,
Over-voltage-protection and Thermal-shut-down.
VCC1(SWU and USB supply) is independent terminal
from VCC, and accepts lower voltage (ex. From DC/DC
converter) which enables to reduce power dissipation.
HZIP15
Features
• 4 system regulator
VDD(LCD micon) : VOUT 5.0V(3.3V), IO max 300mA,
reverse current prevention.
Audio
: VOUT 8.5V, IO max 400mA
SWU(systems)
: VOUT 3.3V, IO max 500mA
USB
: VOUT 5.0V(8.0V available for CD),
IO max 1100mA
• Over-current-protection
• Thermal-shut-down Typ 175ºC
• Over-voltage-protection: Typ 21V(except VDD)
• Applied Pch-LDMOS for output stages.
(Warning)The protector functions only improve the IC’s tolerance and they do not
guarantee the safety of the IC if used under the conditions out of safety range or ratings.
Use of the IC such as use under overcurrent protection range or thermal shut down state
may degrade the IC’s reliability and eventually damage the IC.
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Conditions
Conditions
Ratings
Unit
Supply voltage
VCC max
36
V
Allowable Power dissipation
Pd max
IC unit
1.3
W
(*Ta ≤ 25°C)
With Al heatsink(50×50×1.5mm3)
5.3
W
Infinite heat rediation
26
W
Peak supply voltage
VCC peak
See below pulse wave.
50
V
Operating ambient temperature
Topr
-40 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
Junction temperature
Tj max
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of this data sheet.
Semiconductor Components Industries, LLC, 2013
December, 2013
D0413 NK 20131127-S00004/52312 SY/
30712 SY/O2611 SY 20111014-S00006/O1211 SY 20110928-S00007 No.A1982-1/10
LV5683P
Peak voltage testing pulse wave
50V
90%
10%
16V
5msec
100msec
Recommended Operating condition at Ta = 25°C
Parameter
Conditions
Ratings
Unit
Power supply voltage rating 1
VDD output(5V/3.3V)
7 to 16
V
Power supply voltage rating 2
USB(5V) output, SWU output: VCC=VCC1
7.5 to 16
V
Power supply voltage rating 3
AUDIO output
10 to 16
V
Power supply voltage rating 4
USB(8V) output: VCC=VCC1
10.5 to 16
V
Electrical Characteristics at Ta = 25°C, VCC = VCC1 =14.4V (*1)
Ratings
Parameter
Symbol
Conditions
Unit
min
Quiescent current
ICC
typ
VDD no load, ALL EN terminal = ⎡L⎦
max
50
100
μA
0.5
V
AUDIO_EN Input
Low input voltage
VIL1
0
High input voltage
VIH1
2.8
Input impedance
RIN1
280
400
5.5
V
520
kΩ
V
SWU_EN Input
Low input voltage
VIL2
0
0.5
High input voltage
VIH2
2.8
5.5
V
Input impedance
RIN2
280
520
kΩ
V
400
USB_EN input
Low input voltage
VIL3
0
0.5
High input voltage
VIH3
2.8
5.5
V
Input impedance
RIN3
280
400
520
kΩ
5.0
5.25
VDD (5V/3.3V)output(reverse current prevention diode implemented)
VDD output voltage 1
VO11
IO11 = 200mA, IKVDD=OPEN, or VDDout
4.75
VDD output current 1
IO11
VO11 ≥ 4.7V
300
VDD output voltage 2
VO12
IO12 = 200mA, IKVDD=GND
3.13
VDD output current 2
IO12
VO12 ≥ 3.1V
300
Line regulation
ΔVOLN1
7V < VCC < 16V, IO1 = 200mA
Load regulation
ΔVOLD1
Dropout voltage 1
VDROP1
VCC ripple rejection
RREJ1
f=120Hz, VCC=1VPP, IO1=200mA
VDD reverse current
IREV
VO11=5.0V, VCC=0V
USB output voltage 1
VO21
IO21 = 1000mA, IKUSB=OPEN, or USBout
USB output current 1
IO21
VO21 ≥ 7.45V
1100
USB output voltage 2
VO22
IO22 = 1000mA, IKUSB=GND
4.75
USB output current 2
IO22
VO22 ≥ 4.6V
1100
Line regulation
ΔVOLN2
10.5V < VCC1 < 16V, IO2 = 1000mA
Load regulation
ΔVOLD2
Dropout voltage
VDROP2
VCC1 ripple rejection
RREJ2
f=120Hz, VCC1=1VPP, IO2=1000mA
V
mA
3.3
3.47
V
mA
50
100
mV
1mA < IO11, IO12 < 200mA
80
150
mV
IO1 = 200mA (implemented diode)
1.5
2.5
40(*2)
50(*2)
V
dB
10
100
μA
8.0
8.4
V
5.0
5.25
USB/CD output ; USB_EN = High
7.6
mA
V
mA
50
100
mV
10mA < IO21, IO22 < 1000mA
100
200
mV
IO21, IO22 = 1000mA
1.0
2.0
40(*2)
50(*2)
V
dB
Continued on next page.
No.A1982-2/10
LV5683P
Continued from preceding page.
Ratings
Parameter
Symbol
Conditions
Unit
min
typ
max
AUDIO output ; AUDIO_EN = High
AUDIO output voltage
VO3
IO3 = 300mA
8.1
AUDIO output current
IO3
VO3 ≥ 8V
400
8.5
8.9
V
Line regulation
ΔVOLN3
10V < VCC < 16V, IO3 = 300mA
30
100
mV
Load regulation
ΔVOLD3
1mA < IO3 < 300mA
70
140
mV
Dropout voltage
VDROP3
IO3 = 300mA
0.6
1.05
V
VCC ripple rejection
RREJ3
f = 120Hz, VCC=1VPP, IO3=300mA
mA
40(*2)
50(*2)
3.3
dB
SWU (3.3V) Output ; SEU_EN = High
SWU output voltage
VO4
IO4 = 400mA
3.13
SWU output current
IO4
VO4 ≥ 3.1V
500
3.47
V
Line regulation
ΔVOLN4
7.5V < VCC1 < 16V, IO4 = 400mA
30
100
mV
Load regulation
ΔVOLD4
1mA < IO4 < 400mA
80
150
mV
mA
VCC1 ripple rejection
RREJ4
f = 120Hz, VCC1=1VPP, IO4=400mA
40(*2)
50(*2)
dB
*1: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta(=25°C) are almost equal. There tests were
performed with pulse load to minimize the increase of junction temperature(Tj).
*2 : design certification
Allowable power dissipation derating curve
Pd max -- Ta
Allowable power dissipation, Pd max - W
8
7
6
(a) IC unit(HZIP15)
(b) With Al heatsink(50×50×1.5mm3)
Al heatsink mounting conditions
Tightening torque: 39N·cm, using silicone
grease
5.3
5
Al heat sink (50 × 50 × 1.5mm3)
4
3
2
1.3
IC unit
1
0
0
25
50
75
100
125
150
Ambient temperature, Ta - C
No.A1982-3/10
LV5683P
Package Dimensions
unit : mm
HZIP15
CASE 945AB
ISSUE A
GENERIC
MARKING DIAGRAM*
XXXXXXXXXX
YMDDD
SOLDERING FOOTPRINT*
Through Hole Area
(Unit: mm)
Package name
HZIP15
2.54
1.2
(1.91)
2.54
2.54
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ ”,
may or may not be present.
2.54
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
No.A1982-4/10
LV5683P
1
5
7
11
GND
SWU
12
USB
10
9
USB_EN
IKESB
SWU_EN
VCC
8
VCC 1
6
(NC)
4
3
IKVDD
(NC)
VDD
2
LV5683P
AUDIO
AUDIO_EN
(NC)
Pin assignment
14
15
13
Block Diagram
B+
VCC
+
8
Start
up
OverVoltage
Protection
+
AUDIO(8.5V)
3
+ 400mA
Vref
+
5
AUDIO_EN 2
6
VDD(5V/3.3V)
+ 300mA
IKVDD: VDD(3.3/5.0V) select
IKVDD=OPEN or VDD out 5.0V
IKVDD=GND: 3.3V
OUTPUT
SWU_EN 10
9
Control
+
USB_EN 12
Thermal
VCC1
+
ex.) DC-DC
13
USB/CD(5V/8V)
+
1100mA
11
IKUSB: USB(5/8V) select
IKUSB=OPEN or USB out: 8V
IKUSB=GND: 5V
Shut Down
+
GND
14
15
SWU(3.3V)
+ 500mA
No.A1982-5/10
LV5683P
Pin Function
Pin No.
Pin name
Description
1
N.C.
-
2
AUDIO_EN
AUDIO output CTRL
Equivalent Circuit
-
VCC
8
2
14
3
AUDIO
AUDIO output when AUDIO_EN = High, ON
8.5V/0.4A
GND
VCC
8
3
14
4
N.C.
-
5
VDD
VDD output
5.0V, 3.3V/0.3A
GND
-
VCC
8
5
14
6
IKVDD
VDD output voltage select
OPEN : VDD = 5.0V
GND
VCC
8
GND : VDD = 3.3V
6
14
7
N.C.
-
8
VCC
VCC
9
VCC1
VCC1
GND
-
8
VCC
9
14
GND
Continued on next page.
No.A1982-6/10
LV5683P
Continued from preceding page.
Pin No.
10
Pin name
SWU_EN
Description
Equivalent Circuit
SWU output CTRL
9
VCC1
10
14
11
IKUSB
GND
USB output voltage select
9
OPEN : VDD = 8.0V
VCC1
GND : VDD = 5.0V
11
12
USB_EN
14
GND
9
VCC1
USB output CTRL
12
14
13
USB
USB output when USB_EN = High, ON
5.0V, 8.0V/1.1A
GND
VCC1
9
13
14
14
GND
GND
15
SWU
SWU output when SWU_EN = High, ON
3.3V/0.5A
GND
9
VCC1
15
14
GND
No.A1982-7/10
LV5683P
Timing Chart
21V
VCC
(8PIN)
VCC1
(9PIN)
VDD
(5PIN)
USB_EN
(12PIN)
USB
(13PIN)
AUDIO_EN
(2PIN)
AUDIO
(3PIN)
SWU_EN
(10PIN)
SWU
(15PIN)
No.A1982-8/10
LV5683P
HZIP15 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm,
and should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A1982-9/10
LV5683P
ORDERING INFORMATION
Device
LV5683P-E
Package
HZIP15
(Pb-Free)
Shipping (Qty / Packing)
20 / Fan-Fold
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performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
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harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or
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PS No.A1982-10/10
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