May. 2010 DDR3 SDRAM Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved. -1- May. 2010 Product Guide DDR3 SDRAM Memory 1. DDR3 SDRAM MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 B X X X X X X X - X X X X Speed SAMSUNG Memory DRAM Temp & Power DRAM Type Package Type Density Revision Interface (VDD, VDDQ) Bit Organization # of Internal Banks 1. SAMSUNG Memory : K 7. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V) 2. DRAM : 4 8. Revision M A B C D E F G H 3. DRAM Type B : DDR3 SDRAM 4. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen : 8th Gen : 9th Gen 9. Package Type Z H J M 5. Bit Organization 04 : x 4 08 : x 8 16 : x16 : : : : FBGA (Lead-free) FBGA (Halogen-free & Lead-free) FBGA (Lead-free, DDP) FBGA (Halogen-free & Lead-free, DDP) 10. Temp & Power C : Commercial Temp.( 0°C ~ 85°C) & Normal Power L : Commercial Temp.( 0°C ~ 85°C) & Low Power Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V) 6. # of Internal Banks 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks 11. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 -2- (400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) May. 2010 Product Guide DDR3 SDRAM Memory 2. DDR3 SDRAM Component Product Guide Density 1Gb E-die 1Gb F-die 2Gb B-die 2Gb C-die DDP 2Gb E-die 4Gb A-die Banks 8Banks 8Banks 8Banks 8Banks 8Banks 8Banks DDP 4Gb B-die 8Banks DDP 4Gb C-die 8Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org. K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4 K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8 K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16 K4B1G0446E HYF7/F8/H9 256M x 4 K4B1G0846E HYF7/F8/H9 128M x 8 K4B1G0446F HC(L)F8/H9/K0 256M x 4 K4B1G0846F HC(L)F8/H9/K0 128M x 8 K4B1G0446F HY(L)F8/H9 256M x 4 K4B1G0846F HY(L)F8/H9 128M x 8 K4B2G0446B HC(L)F7/F8/H9 512M x 4 K4B2G0846B HC(L)F7/F8/H9 256M x 8 K4B2G1646B HC(L)F7/F8/H9 128M x 16 K4B2G0446B HYF7/F8/H9 512M x 4 K4B2G0846B HYF7/F8/H9 256M x 8 K4B2G0446C HC(L)F8/H9/K0 512M x 4 K4B2G0846C HC(L)F8/H9/K0 256M x 8 K4B2G0446C HY(L)F8/H9 512M x 4 K4B2G0846C HY(L)F8/H9 256M x 8 K4B2G0446E MC(L)F7/F8/H9 512M x 4 K4B2G0846E MC(L)F7/F8/H9 256M x 8 K4B4G0446A HC(L)F8/H9/K0 1G x 4 K4B2G0846A HC(L)F8/H9/K0 512M x 8 K4B4G0446A HY(L)F8/H9/K0 1G x 4 K4B2G0846A HY(L)F8/H9/K0 512M x 8 K4B4G0446B MC(L)F7/F8/H9 1G x 4 K4B2G0846B MC(L)F7/F8/H9 512M x 8 K4B4G0446C MC(L)F7/F8/H9 1G x 4 K4B2G0846C MC(L)F7/F8/H9 512M x 8 * NOTE : 1.35V product is 1.5V operatable. -3- VDD Voltage 1.5V PKG 78 ball FBGA 96 ball FBGA 1.35V Avail. Now 78 ball FBGA 1.5V 78 ball FBGA Now 1.35V 1.5V 78 ball FBGA 96 ball FBGA 1.35V Now 78 ball FBGA 1.5V 78 ball FBGA Now 78 ball FBGA Now 1.35V 1.5V 1.5V 78 ball FBGA Now 1.35V 1.5V 78 ball FBGA Now 1.5V 78 ball FBGA Feb.’10 NOTE May. 2010 Product Guide DDR3 SDRAM Memory 3. DDR3 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 M X X X B X X X X X X X - X X X Memory Module DIMM Type Data bits Speed DRAM Component Type Temp & Power Depth PCB Revision Package # of Banks in Comp. & Interface Component Revision Bit Organization 1. Memory Module : M 8. Component Revision M : 1st Gen. B : 3rd Gen. D : 5th Gen. F : 7th Gen. 2. DIMM Type 3 : DIMM 4 : SODIMM 3. Data Bits 71 : 78 : 91 : 92 : 93 : x64 x64 x72 x72 x72 204pin Unbuffered SODIMM 240pin Unbuffered DIMM 240pin ECC unbuffered DIMM 240pin VLP Registered DIMM 240pin Registered DIMM A C E G : : : : 2nd Gen. 4th Gen. 6th Gen. 8th Gen. 9. Package : FBGA(Lead-free) Z : FBGA(Lead-free & Halogen-free) H : FBGA(Lead-free, DDP) J M : FBGA(Lead-free & Halogen-free, DDP) 10. PCB Revision 0 : None 2 : 2nd Rev. 4 : 4th Rev. 4. DRAM Component Type 1 : 1st Rev. 3 : 3rd Rev. S : Reduced Layer B : DDR3 SDRAM (1.5V VDD) 5. Depth 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G : 1G 2G : 2G 33 65 29 57 52 1K 2K : 32M (for 128Mb/512Mb) : 64M (for 128Mb/512Mb) : 128M (for 128Mb/512Mb) : 256M (for 512Mb/2Gb) : 512M (for 512Mb/2Gb) : 1G (for 2Gb) : 2G (for 2Gb) 6. # of Banks in comp. & Interface 7 : 11. Temp & Power C : Commercial Temp.( 0°C ~ 85°C) & Normal Power Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V) 12. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 (400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) 8Banks & SSTL-1.5V NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC3-10600(DDR3-1333), PC3-12800(DDR3-1600) 7. Bit Organization 0 : x4 3 : x8 4 : x16 -4- May. 2010 Product Guide DDR3 SDRAM Memory 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) 240Pin DDR3 Unbuffered DIMM Org. Density 128Mx 64 1GB 128Mx 72 1GB 256Mx 64 2GB 256Mx 72 2GB Part Number Speed M378B2873EH1 CF8/H9 M378B2873FH0 CF8/H9/K0* M391B2873EH1 CF8/H9 M391B2873FH0 CF8/H9/K0* M378B5673EH1 CF8/H9 M378B5673FH0 CF8/H9/K0* M378B5773CH0 CF8/H9/K0* M391B5673EH1 CF8/H9 M391B5673FH0 CF8/H9/K0* M391B5773CH0 CF8/H9/K0* M378B5273BH1 CF8/H9 M378B5273CH0 CF8/H9/K0* M391B5273BH1 CF8/H9 M391B5273CH0 CF8/H9/K0* 8GB M378B1G73AH0 CF8/H9/K0* 8GB M391B1G73AH0 CF8/H9/K0* 512Mx 64 4GB 512Mx 72 4GB 1Gx 64 1Gx 72 Raw Card A(1Rx8) D(1Rx8) B(2Rx8) A(1Rx8) E(2Rx8) D(1Rx8) Composition Comp. Version 128M x 8 * 8 pcs 1Gb E-die 128M x 8 * 8 pcs 1Gb F-die 128M x 8 * 9 pcs 1Gb E-die 128M x 8 * 9 pcs 1Gb F-die 128M x 8 * 16 pcs 1Gb E-die 128M x 8 * 16 pcs 1Gb F-die 256M x 8 * 8 pcs 2Gb C-die 128M x 8 * 18 pcs 1Gb E-die 128M x 8 * 18 pcs 1Gb F-die 256M x 8 * 9 pcs 2Gb C-die 256M x 8 * 16 pcs 2Gb B-die 256M x 8 * 16 pcs 2Gb C-die 256M x 8 * 18 pcs 2Gb B-die 256M x 8 * 18 pcs 2Gb C-die B(2Rx8) 512M x 8 * 16 pcs 4Gb E(2Rx8) 512M x 8 * 18 pcs 4Gb B(2Rx8) E(2Rx8) Internal Banks Rank PKG Height Avail. 8 1 78 ball FBGA 30mm Now 8 1 78 ball FBGA 30mm Now 8 2 78 ball FBGA 30mm Now 8 1 78 ball FBGA 30mm Now 8 2 NOTE 1 8 2 78 ball FBGA 30mm Now 8 2 78 ball FBGA 30mm Now A-die 8 2 78 ball FBGA 30mm Now A-die 8 2 78 ball FBGA 30mm Now Internal Banks Rank PKG Height Avail. 8 1 78 ball FBGA 30mm Now 8 2 78 ball FBGA 30mm Now 8 1 8 2 78 ball FBGA 30mm Now 8 2 78 ball FBGA 30mm Now * NOTE : K0(1600Mbps) will be available by ES level 4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product) 240Pin DDR3 Unbuffered DIMM Org. Density 128Mx 72 1GB 256Mx 72 2GB 512Mx 72 4GB 1Gx 72 8GB Part Number Speed M391B2873EH1 YF8/H9 M391B2873FH0 YF8/H9 M391B5673EH1 YF8/H9 M391B5673FH0 YF8/H9 M391B5773CH0 YF8/H9 M391B5273BH1 YF8/H9 M391B5273CH0 YF8/H9 M391B1G73AH0 YF8/H9 Raw Card D(1Rx8) E(2Rx8) D(1Rx8) E(2Rx8) E(2Rx8) Composition Comp. Version 128M x 8 * 9 pcs 1Gb E-die 128M x 8 * 9 pcs 1Gb F-die 128M x 8 * 18 pcs 1Gb E-die 128M x 8 * 18 pcs 1Gb F-die 256M x 8 * 9 pcs 2Gb C-die 256M x 8 * 18 pcs 2Gb B-die 256M x 8 * 18 pcs 2Gb C-die 512M x 8 * 18 pcs 4Gb A-die * NOTE : 1.35V product is 1.5V operatable. -5- NOTE May. 2010 Product Guide DDR3 SDRAM Memory 4.3 204Pin DDR3 SoDIMM (1.5V Product) 204Pin DDR3 SODIMM Org. 128Mx 64 256Mx 64 Density 1GB 2GB 512Mx 64 4GB 1Gx 64 8GB Comp. Version Part Number Speed Raw Card Composition M471B2873EH1 CF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb M471B2874EH1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb M471B2873FHS CF8/H9 M471B5673EH1 CF8/H9 M471B5673FH0 CF8/H9 M471B5773CHS CF8/H9 M471B5273BH1 CF8/H9 M471B5273CH0 CF8/H9 M471B1G73AH0 CF8/H9 B(1Rx8) F(2Rx8) B(1Rx8) F(2Rx8) F(2Rx8) Internal Banks Rank PKG E-die 8 1 78 ball FBGA E-die 8 2 96 ball 8 1 78 ball FBGA 8 2 8 1 8 Height Avail. 30mm Now 78 ball FBGA 30mm Now 2 78 ball FBGA 30mm Now 8 2 78 ball FBGA 30mm Now Internal Banks Rank PKG Height Avail. F-die 8 1 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now 64M x 16 * 8 pcs 1Gb F-die 128M x 8 * 16 pcs 1Gb E-die 128M x 8 * 16 pcs 1Gb F-die 256M x 8 * 8 pcs 2Gb C-die 256M x 8 * 16 pcs 2Gb B-die 256M x 8 * 16 pcs 2Gb C-die 512M x 8 * 16 pcs 4Gb A-die NOTE 4.4 204Pin DDR3 SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Comp. Version Org. Density Part Number Speed Raw Card Composition 128Mx 64 1GB M471B2873FHS YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb 256Mx 64 2GB M471B5673FH0 YF8/H9 F(2Rx8) 128M x 8 * 16 pcs 1Gb F-die 8 2 M471B5773CHS YF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1 512Mx 64 4GB 8 2 78 ball FBGA 30mm Now 1Gx 64 8GB 8 2 78 ball FBGA 30mm Now M471B5273BH1 YF8/H9 M471B5273CH0 YF8/H9 M471B1G73AH0 YF8/H9 F(2Rx8) F(2Rx8) 256M x 8 * 16 pcs 2Gb B-die 256M x 8 * 16 pcs 2Gb C-die 512M x 8 * 16 pcs 4Gb A-die * NOTE : 1.35V product is 1.5V operatable. -6- NOTE May. 2010 Product Guide DDR3 SDRAM Memory 4.5 240Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Org. Density 128Mx 72 1GB 256Mx 72 512Mx 72 1Gx 72 2GB 4GB 8GB Part Number Speed M393B2873EH1 CF8/H9 M393B2873FH0 CF8/H9 M393B5673EH1 CF8/H9 M393B5673FH0 CF8/H9 M393B5670EH1 CF8/H9 M393B5670FH0 CF8/H9 M393B5773CH0 CF8/H9 M393B5173EH1 CF8 M393B5173FH0 CF8/H9 M393B5170EH1 CF8/H9 M393B5170FH0 CF8/H9 M393B5273BH1 CF8/H9 M393B5273CH0 CF8/H9 M393B5270BH1 CF8/H9 M393B5270CH0 CF8/H9 M393B1G70EM1 CF8 M393B1K73BH1 CF8 M393B1K73CH0 CF8/H9 M393B1K70BH1 CF8/H9 M393B1K70CH0 CF8/H9 M393B2K70BM1 CF8 Raw Card A(1Rx8) B(2Rx8) C(1Rx4) A(1Rx8) H(4Rx8 E(2Rx4) B(2Rx8) C(1Rx4) F(4Rx4) H(4Rx8) E(2Rx4) F(4Rx4) 2Gx 72 4Gx 72 16GB 32GB Composition Comp. Version 128M x 8 * 9 pcs 1Gb E-die 128M x 8 * 9 pcs 1Gb F-die 128M x 8 * 18 pcs 1Gb E-die 128M x 8 * 18 pcs 1Gb F-die 256M x 4 * 18 pcs 1Gb E-die 256M x 4 * 18 pcs 1Gb F-die 256M x 8 * 9 pcs 2Gb C-die 128M x 8 * 36 pcs 1Gb E-die 128M x 8 * 36 pcs 1Gb F-die 256M x 4 * 36 pcs 1Gb E-die 256M x 4 * 36 pcs 1Gb F-die 256M x 8 * 18 pcs 2Gb B-die 256M x 8 * 18 pcs 2Gb C-die 512M x 4 * 18 pcs 2Gb B-die 512M x 4 * 18 pcs 2Gb C-die DDP x 4 * 36 pcs 512M 1Gb E-die 256M x 8 * 36 pcs 2Gb B-die 256M x 8 * 36 pcs 2Gb C-die 512M x 4 * 36 pcs 2Gb B-die 512M x 4 * 36 pcs 2Gb C-die DDP x 4 * 36 pcs 1G 2Gb B-die DDP x 4 * 36 pcs 1G 2Gb C-die Internal Banks Rank PKG Height Avail. 8 1 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now 2 8 1 4 2 8 2 1 4 8 4 2 4 M393B2K70CM0 CF8/H9 M393B2G70AH0 CF8/H9 E(2Rx4) 1G x 4 * 36 pcs 4Gb A-die 2 M393B2G73AH0 CF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb A-die 4 M393B4G70AH0 CF8/H9 AB(4Rx4) DDP x 4 * 36 pcs 2G 4Gb A-die -7- 8 8 4 NOTE May. 2010 Product Guide DDR3 SDRAM Memory 4.6 240Pin DDR3 Registered DIMM (1.35V Product) 240Pin DDR3 Registered DIMM Org. Density 128Mx 72 1GB 256Mx 72 512Mx 72 1Gx 72 2GB 4GB 8GB Part Number Speed M393B2873EH1 YF8/H9 M393B2873FH0 YF8/H9 M393B5673EH1 YF8/H9 M393B5673FH0 YF8/H9 M393B5670EH1 YF8/H9 M393B5670FH0 YF8/H9 M393B5773CH0 YF8/H9 M393B5173EH1 YF8 M393B5173FH0 YF8/H9 M393B5170EH1 YF8/H9 M393B5170FH0 YF8/H9 M393B5273BH1 YF8/H9 M393B5273CH0 YF8/H9 M393B5270BH1 YF8/H9 M393B5270CH0 YF8/H9 M393B1G70EM1 YF8 M393B1K73BH1 YF8 M393B1K73CH0 YF8/H9 M393B1K70BH1 YF8/H9 M393B1K70CH0 YF8/H9 M393B2K70BM1 YF8 Raw Card A(1Rx8) B(2Rx8) C(1Rx4) A(1Rx8) H(4Rx8) E(2Rx4) B(2Rx8) C(1Rx4) F(4Rx4) H(4Rx8) E(2Rx4) F(4Rx4) 2Gx 72 4Gx 72 16GB 32GB Composition Comp. Version 128M x 8 * 9 pcs 1Gb E-die 128M x 8 * 9 pcs 1Gb F-die 128M x 8 * 18 pcs 1Gb E-die 128M x 8 * 18 pcs 1Gb F-die 256M x 4 * 18 pcs 1Gb E-die 256M x 4 * 18 pcs 1Gb F-die 256M x 8 * 2Gb C-die 128M x 8 * 36 pcs 1Gb E-die 128M x 8 * 36 pcs 1Gb F-die 256M x 4 * 36 pcs 1Gb E-die 256M x 4 * 36 pcs 1Gb F-die 256M x 8 * 18 pcs 2Gb B-die 256M x 8 * 18 pcs 2Gb C-die 9 pcs 512M x 4 * 18 pcs 2Gb B-die 512M x 4 * 18 pcs 2Gb C-die DDP x 4 * 36 pcs 512M 1Gb E-die 256M x 8 * 36 pcs 2Gb B-die 256M x 8 * 36 pcs 2Gb C-die 512M x 4 * 36 pcs 2Gb B-die 512M x 4 * 36 pcs 2Gb C-die DDP x 4 * 36 pcs 1G 2Gb B-die DDP x 4 * 36 pcs 1G 2Gb C-die M393B2K70CM0 YF8/H9 M393B2G70AH0 YF8/H9 E(2Rx4) 1G x 4 * 36 pcs 4Gb A-die M393B2G73AH0 YF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb A-die M393B4G70AH0 YF8/H9 AB(4Rx4) DDP x 4 * 36 pcs 2G 4Gb A-die * NOTE : 1.35V product is 1.5V operatable. -8- Internal Banks Rank PKG Height Avail. 8 1 78 ball FBGA 30mm Now 8 2 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now 8 1 8 4 8 2 8 2 8 1 8 4 8 4 8 2 8 4 78 ball FBGA 30mm Now 8 4 78 ball FBGA 30mm Now NOTE May. 2010 Product Guide DDR3 SDRAM Memory 4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org. Density 128Mx 72 1GB 256Mx 72 2GB Part Number Speed M392B2873EH1 CF8/H9 M392B2873FH0 CF8/H9 M392B5673EH1 CF8/H9 M392B5673FH0 CF8/H9 M392B5670EH1 CF8/H9 M392B5670FH0 CF8/H9 M392B5773CH0 CF8/H9 M392B5170EM1 Raw Card K(1Rx8) L(2Rx8 M(1Rx4) K(1Rx8) CF8/H9 N(2Rx4) 512Mx 72 4GB M392B5170FM0 CF8/H9 M392B5273BH1 CF8/H9 M392B5273CH0 CF8/H9 M392B5270BH1 CF8/H9 M392B5270CH0 CF8/H9 M392B1K73BM1 CF8 L(2Rx8) M(1Rx4) V(4Rx8) 1Gx 72 Comp. Version 128M x 8 * 9 pcs 1Gb E-die 128M x 8 * 9 pcs 1Gb F-die 128M x 8 * 18 pcs 1Gb E-die 128M x 8 * 18 pcs 1Gb F-die 256M x 4 * 18 pcs 1Gb E-die 256M x 4 * 18 pcs 1Gb F-die 128M x 8 * 9 pcs 1Gb F-die DDP x 4 * 18 pcs 512M 1Gb E-die DDP x 4 * 18 pcs 512M 1Gb F-die 256M x 8 * 18 pcs 2Gb B-die 256M x 8 * 18 pcs 2Gb C-die 512M x 4 * 18 pcs 2Gb B-die 512M x 4 * 18 pcs 2Gb C-die DDP x 8 * 18 pcs 512M 2Gb B-die DDP x 8 * 18 pcs 512M 2Gb C-die M392B1K70BM1 CF8/H9 DDP x 4 * 18 pcs 1G 2Gb B-die M392B1K70CM0 CF8/H9 DDP x 4 * 18 pcs 1G 2Gb C-die M392B2G70AM0 CF8/H9 DDP x4 * 18 pcs 2G 4Gb A-die DDP x8 * 18 pcs 1G 4Gb N(2Rx4) 16GB M392B2G73AM0 CF8/H9 V(4Rx8) -9- Rank PKG Height Avail. 8 1 78 ball FBGA 18.75mm Now 78 ball FBGA 18.75mm Now 78 ball FBGA 18.75mm Now 78 ball FBGA 18.75mm Now 78 ball FBGA 18.75mm 2 8 1 1 8 2 1 4 CF8/H9 8GB Internal Banks 2 M392B1K73CM0 N(2Rx4) 2Gx 72 Composition 8 2 2 8 A-die 4 Jun.’10 Jun.’10 NOTE May. 2010 Product Guide DDR3 SDRAM Memory 4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product) 240Pin DDR3 VLP Registered DIMM Org. Density 128Mx 72 1GB 256Mx 72 512Mx 72 2GB 4GB Part Number Speed M392B2873EH1 YF8/H9 M392B2873FH0 YF8/H9 M392B5673EH1 YF8/H9 M392B5673FH0 YF8/H9 M392B5670EH1 YF8/H9 Raw Card K(1Rx8) L(2Rx8) M(1Rx4) 128M x 8 * 9 pcs 1Gb E-die 128M x 8 * 9 pcs 1Gb F-die 128M x 8 * 18 pcs 1Gb E-die 128M x 8 * 18 pcs 1Gb F-die 256M x 4 * 18 pcs 1Gb E-die M392B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die YF8/H9 K(1Rx8) 512M x 4 * 9 pcs 2Gb C-die M392B5170EM1 YF8/H9 N(2Rx4) DDP x 4 * 18 pcs 512M 1Gb E-die M392B5170FM0 YF8/H9 N(2Rx4) 512M x 4 * 18 pcs 1Gb F-die M392B5273BH1 YF8/H9 256M x 8 * 18 pcs 2Gb B-die M392B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die M392B5270BH1 YF8/H9 M392B5270CH0 YF8/H9 M392B1K73BM1 YF8 L(2Rx8) M(1Rx4) 512M x 4 * 18 pcs 2Gb B-die 512M x 4 * 18 pcs 2Gb C-die DDP x 8 * 18 pcs 512M 2Gb B-die M392B1K73CM0 YF8 DDP x 8 * 18 pcs 512M 2Gb C-die M392B1K70BM1 YF8/H9 DDP x 4 * 18 pcs 1G 2Gb B-die M392B1K70CM0 YF8/H9 DDP x 4 * 18 pcs 1G 2Gb C-die M392B2G70AM0 YF8/H9 DDP x4 * 18 pcs 2G 4Gb A-die DDP x8 * 18 pcs 1G 4Gb 8GB N(2Rx4) 2Gx 72 Comp. Version M392B5773CH0 V(4Rx8) 1Gx 72 Composition N(2Rx4) 16GB M392B2G73AM0 YF8/H9 V(4Rx8) * NOTE : 1.35V product is 1.5V operatable. - 10 - Internal Banks Rank PKG Height Avail. 8 1 78 ball FBGA 18.75mm Now 8 2 78 ball FBGA 18.75mm Now 78 ball 18.75mm FBGA Now 78 ball FBGA 18.75mm Now 78 ball FBGA 18.75mm 8 1 8 2 8 2 8 1 8 4 8 2 2 8 A-die 4 Now Jun.’10 NOTE May. 2010 Product Guide DDR3 SDRAM Memory 5. RDIMM RCD Information 5.1 5.1 RCD Identification in JEDEC Description in Module Label 5.2 5.2 Label Example 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P1 Made in Korea M393B5170EH1-CH9 0920 5.3 RCD Information - Example Voltage Vendor Revision Module P/N JEDEC Description On Label Inphi LV GS02 C0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-P1 IDT LV DDR3 B0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-D2 Inphi LV GS02 C0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-P1 IDT LV DDR3 B0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-D2 1.5V 1.35V - 11 - May. 2010 Product Guide DDR3 SDRAM Memory 6. Package Dimension 7.50 ± 0.10 A 0.80 x 8 = 6.40 #A1 INDEX MARK 3.20 #A1 0.50 ± 0.05 0.80 x 12 = 9.60 0.80 4.80 A B C D E F G H J K L M N 0.80 (Datum B) 7.50 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.00 ± 0.10 0.80 1.60 11.00 ± 0.10 (Datum A) 0.10MAX 78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8) 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Top Bottom A 0.80 x 8 = 6.40 0.80 1.60 3.20 #A1 INDEX MARK B 9 8 7 6 5 4 3 2 1 13.30 ± 0.10 13.30 ± 0.10 0.35 ± 0.05 (0.95) 96 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) 0.2 M A B 0.80 x 15 = 12.00 6.00 0.40 (Datum B) A B C D E F G H J K L M N P R T 7.50 ± 0.10 0.80 (Datum A) #A1 0.50 ± 0.05 7.50 ± 0.10 0.10MAX 96Ball FBGA for 1Gb E-die (x16) MOLDING AREA 1.10 ± 0.10 (1.90) Top Bottom - 12 - May. 2010 Product Guide DDR3 SDRAM Memory 9.00 ± 0.10 0.80 A #A1 INDEX MARK 3.20 1.60 #A1 11.50 ± 0.10 0.80 x 12 = 9.60 0.80 4.80 A B C D E F G H J K L M N 0.80 (Datum B) 9.00 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.50 ± 0.10 (Datum A) 0.10MAX 78Ball FBGA for 2Gb B-die (x4/x8) 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Top Bottom 9.00 ± 0.10 0.10MAX 96Ball FBGA for 2Gb B-die (x16) A #A1 INDEX MARK 1.60 3.20 #A1 9 8 7 6 5 4 3 2 1 13.30 ± 0.10 0.35 ± 0.05 (0.95) 96 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B 0.80 x 12 = 12.00 6.00 0.40 (Datum B) A B C D E F G H J K L M N P R T 0.80 (Datum A) 9.00 ± 0.10 B 13.30 ± 0.10 0.80 MOLDING AREA 1.10 ± 0.10 (1.90) Top Bottom - 13 - May. 2010 Product Guide DDR3 SDRAM Memory 9.00 ± 0.10 A 0.80 x 8 = 6.40 0.80 1.60 #A1 INDEX MARK 3.20 #A1 11.50 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 9.00 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.50 ± 0.10 (Datum A) 0.10MAX 78Ball DDP for 1Gb E-die (x4/x8) 0.35 ± 0.05 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 1.40 ± 0.10 0.2 M A B Top Bottom 10.00 ± 0.10 A 0.80 x 8 = 6.40 0.80 1.60 #A1 INDEX MARK 3.20 #A1 11.50 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 10.00 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.50 ± 0.10 (Datum A) 0.10MAX 78Ball DDP for 2Gb B-die (x4/x8) 0.35 ± 0.05 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 1.40 ± 0.10 0.2 M A B Top Bottom - 14 - May. 2010 Product Guide DDR3 SDRAM Memory 8.00 ± 0.10 0.80 x 8 = 6.40 (Datum A) 0.80 1.60 0.10MAX 78Ball DDP for 2Gb C-die (x4/x8) A #A1 INDEX MARK 3.20 #A1 9 8 7 6 5 4 3 2 1 11.00 ± 0.10 11.00 ± 0.10 0.80 x 12 = 9.60 0.80 0.80 4.80 A B C (Datum B) D E F G H J K L M N 8.00 ± 0.10 B 0.35 ± 0.05 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 1.40 ± 0.10 0.2 M A B TOP VIEW BOTTOM VIEW 78Ball for 4Gb A-die (x4/x8) A 0.10MAX 10.00 ± 0.10 0.80 x 8 = 6.40 3.20 #A1 INDEX MARK 1.60 B 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B 0.80 x 12 = 9.60 9 8 7 6 5 4 3 2 1 #A1 10.00 ± 0.10 12.50 ± 0.10 0.80 12.50 ± 0.10 (Datum A) (0.95) MOLDING AREA 0.35 ± 0.05 1.10 ± 0.10 (1.90) BOTTOM VIEW TOP VIEW - 15 - May. 2010 Product Guide DDR3 SDRAM Memory 7. Module Dimension x64/x72 240pin DDR3 SDRAM Unbuffered DIMM Units : Millimeters 128.95 ECC SPD 17.30 9.50 N/A (for x64) 2.30 (for x72) 30.00 ± 0.15 (4X)3.00 ± 0.1 133.35 ± 0.15 (2) 2.50 54.675 A B 47.00 Max 4.0 71.00 N/A (for x64) ECC (for x72) 2.50 ± 0.20 1.270 ± 0.10 5.00 0.80 ± 0.05 3.80 0.2 ± 0.15 1.50±0.10 1.00 2.50 Detail A Detail B - 16 - 2x 2.10 ± 0.15 May. 2010 Product Guide DDR3 SDRAM Memory x64 204pin DDR3 SDRAM Unbuffered SODIMM Units : Millimeters 67.60 0.10 M C A B 63.60 6 20.00 SPD 30.00 ± 0.15 Max 3.8 1.00 ± 0.10 24.80 A 21.00 B 39.00 2X 1.80 0.10 M C A B (OPTIONAL HOLES) 2X 4.00 ± 0.10 0.10 M C A B 0.60 0.45 ± 0.03 1.65 4.00 ± 0.10 2.55 0.25 MAX 1.00 ± 0.10 Detail A Detail B - 17 - May. 2010 Product Guide DDR3 SDRAM Memory x72 240pin DDR3 SDRAM Registered DIMM Units : Millimeters C 128.95 32.40 18.93 9.74 Max 4.0 54.675 2.30 2.50 A 1.0 max B 47.00 1.27 ± 0.10 2.50 ± 0.20 71.00 5.00 0.80 ± 0.05 3.80 0.2 ± 0.15 1.00 10.9 R 1.50±0.10 Detail A Detail B Detail C 2x 2.10 ± 0.15 Register 2.50 17.30 Register 30.00 ± 0.15 18.92 0. 50 10.9 9.50 9.76 (2X)3.00 133.35 ± 0.15 Address, Command and Control lines - 18 - 0.4 May. 2010 Product Guide DDR3 SDRAM Memory Registered DIMM Heat Spreader Design 1. FRONT PART Outside R0.2 4.65± 0.12 2 2 2 ± 0.1 2.6 ± 0.2 0.4 Inside Green Line : TIM Attatch Line 7.45 Reg. pedestal line 80.78 119.29 128.5 2. BACK PART Outside Inside 0.15 1.3 Green Line : TIM Attatch Line - 19 - 1.3 1 0. R 127 ± 0.12 25.6 ± 0.15 31.4 23.6 ± 0.15 11.9 29.77 1 25.6 ± 0.15 0.65 ± 0.2 130.45 ± 0.15 9.26 1+0/ -0.3 133.15 ± 0.2 May. 2010 Product Guide DDR3 SDRAM Memory 3. CLIP PART 39.3 ± 0.2 Upper Bending Tilting Gap 29.77 0.1 ~ 0.3 R B 1. 5 A C 0.5 4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness) 1.27 1.05 132.95 ± 133.45 39.3 ± 0.2 19 19 ± 0.1 D K text mark ’B’ or ’K’ punch press_stamp - 20 - E (Clip open size) May. 2010 Product Guide DDR3 SDRAM Memory x72 240pin DDR3 SDRAM VLP Registered DIMM Units : Millimeters 133.35 ± 0.15 128.95 C 20.92 32.40 20.93 Max 4.0 9.74 Register 18.75 ± 0.15 9.76 54.675 A B 12.60 47.00 1.0 max 71.00 1.27 ± 0.10 SPD/TS 2.50 ± 0.20 18.10 0.80 ± 0.05 9.9 3.80 0.6 5.00 0.2 ± 0.15 Detail B Detail C VTT Register Detail A R 1.00 2.50 VTT 0. 50 1.50±0.10 VTT VTT SPD/TS Address, Command and Control lines - 21 - May. 2010 Product Guide DDR3 SDRAM Memory VLP Registered DIMM Heat Spreader Design 1. FRONT PART Outside 130.45 67 20.82 17.9 6.4 20.82 8.69 14.3 0.4 8.69 Driver IC(DP:0.18mm) DRIVER IC 0.18 -0/+0.1 Inside Driver IC(DP:0.18mm) 2. BACK PART Outside Driver IC(DP:0.18mm) Inside Driver IC(DP:0.18mm) - 22 - May. 2010 Product Guide DDR3 SDRAM Memory 3. CLIP PART 35.82 9.16 ± 0.12 7.4 ± 0.1 9.16 9.16 ± 0.12 7.4 ± 0.1 Clip open size 3.2~4.5 0.1 SIDE-L FRONT SIDE-R 4. ASS’Y VIEW 7.71 Reference thickness total (Maximum) : 7.71 (With Clip thickness) TIM Thickness 0.25 * Dimension Index Mono DDP Note Min. Typ. Max. Min. Typ. Max. A - 43.9 - - 44.4 - B 6.7 6.8 6.9 7.2 7.3 7.4 C - 5.8 - - 6.3 - D 6.7 6.8 6.9 7.2 7.3 7.4 E (Clip open size) 2.5 - 3.6 2.6 - 3.8 - 23 -