DA1634.001 28 November, 2008 MAS1634 Quad LED Driver IC • • • • Quad Current Sink Output Wide Supply Voltage Range Low Power Consumption Power Down Control DESCRIPTION MAS1634 is a quad LED driver IC. It has four constant current sink type outputs for driving up to four LEDs. It has wide supply voltage range and low power consumption ideally suitable for low power applications. MAS1634 can be set into power down mode by a power down control pin. The LED driver control inputs have pull down resistors and which are disabled in the power down mode. FEATURES APPLICATIONS • • • • Quad Current Sink Output, 2.1 mA typ Wide Supply Voltage Range from 1.0 V to 3.1 V Low Power Consumption Power Down Control • • LED Driver for Portable Low Power Application IR LED Driver for Optical Hand Position Detection of Radio Controlled Watch 1 (8) DA1634.001 28 November, 2008 BLOCK DIAGRAM VDD1 VDD2 XPD DUMMY & IN1 OUT1 IN2 OUT2 IN3 OUT3 IN4 OUT4 MAS1634 4 x LED Driver GND1 GND2 Figure 1. MAS1634 Block Diagram Figure 1 presents MAS1634 block diagram. MAS1634 consists of four fixed current sink outputs for driving VDD connected LEDs. Each LED driver can be turned on or off independently. There is also common power-down control pin XPD which is active when low. The dummy pad is electrically unconnected and its only purpose is to make the pad layout symmetrical which helps in making the flip-chip connection even more reliable. VDD1 and VDD2 power supply pins are internally connected making only one supply voltage connection necessary. Also GND1 and GND2 pins are internally connected so that it is necessary to connect only one of the two ground pins to supply ground. 2 (8) DA1634.001 28 November, 2008 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Voltage Storage Temperature Input Voltage Latch-up Current Limit VDD TST VIN ILUT Conditions Min Max Unit For all pins (see note 1) -0.3 -55 -0.3 -100 6.0 +125 VDD+0.3 100 V C V mA o Stresses beyond those listed may cause permanent damage to the device. The device may not operate under these conditions, but it will not be destroyed. This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages (ESD). Note 1. In latch-up testing the supply voltages are connected normally to the tested device. Then pulsed test current is fed to each input separately and device current consumption is observed. If the device current consumption increases suddenly due to test current pulses and the abnormally high current consumption continues after test current pulses are cut off then the device has gone to latch up. Current pulse is turned on for 10 ms and off for 20 ms. Testing is done up to ± 300 mA. ELECTRICAL CHARACTERISTICS (Operating Conditions: VDD = 2.0V, Temperature = 25°C unless otherwise mentioned) Parameter Supply Voltage Operating Temperature Standby Current Quiescent Current Current driver Leakage current of an output Input high voltage Input low voltage Start up time Symbol VDD TA Conditions ISS ISC XPD = “0” XPD = “1”, OUTPUTS OFF (INx=”0”) XPD = “1”, 1 OUTPUT ON XPD = “1”, 2 OUTPUTS ON XPD = “1”, 3 OUTPUTS ON XPD = “1”, 4 OUTPUTS ON XPD = “1” VDD = 0.95V, OUT1-4 = 0.075V VDD = 1.15V, OUT1-4 = 0.025V VDD = 1.15V, OUT1-4 = 0.075V VDD = 1.25V, OUT1-4 = 0.175V VDD = 1.70V, OUT1-4 = 0.625V VDD = 1.70 V, VOUT1-4 = VDD VIN1-4 = GND ICD Ileak VIH VIL tst Min 1.0 -20 1.4 1 1.4 1.4 1.4 Typ 2.0 +25 Max 3.1 +60 Unit V ºC µA µA 140 270 390 500 0.5 0.5 300 500 700 900 4.5 4.0 3.45 3 3 100 mA VDD 0.2*VDD 50 V V µs 2.1 1.8 2.1 2.1 2.1 0.8*VDD GND VDD = 1.15 V 15 nA 3 (8) DA1634.001 28 November, 2008 FUNCTIONAL DESCRIPTION ◆ Main Functions ◆ Inverting input buffer MAS1634 has two functional blocks. First is the LED driver to drive LEDs in a wrist watch applications. Second is Bias voltage generator for generating bias current for the drivers The inverting buffers buffer the input signals. These blocks also contain pull-down resistors and they are switched in an inactive high impedance state if the XPD input is low. ◆ Operating Modes If the XPD pin is high then the INx inputs have pull down by the pull down resistors. Nominally the values of the pull down resistors are 1.7 MΩ but they can vary ±15%. MAS1634 has two operating modes. These modes are simply ON and OFF modes. ON mode is selected when XPD is high. In ON mode each of the four output drivers can be switched on separately by setting each of the INx control inputs high. If control input is low the corresponding current output driver is off. If all control inputs are low the bias generator is turned off. OFF mode is selected when XPD is low. In OFF mode the bias generator and the current drivers are in power down. The device has two supply voltage pins VDD1 and VDD2 and which are internally connected. It is sufficient to connect only one of the two supply pins but if both supplies are connected then they should be connected to same voltage potential. The XPD input doesn’t have pull down resistor so this input must be driven by the controller or be connected to VDD (always ON mode) in order to achieve properly controlled operation. ◆ Output Driver Four switchable low-voltage 2.1 mA constant current sinks with very low drop-out voltage are implemented to drive external VDD connected LEDs. ◆ Bias Generator Bias voltage generator supplies bias current for the output drivers. It is turned on if XPD is high and if any of the four control inputs is high. The device has also two supply ground pins GND1 and GND2 and which are internally connected. It is sufficient to connect only one of the two ground pins but if both grounds are connected then they should be connected to same ground potential. 4 (8) DA1634.001 28 November, 2008 MAS1634 PAD LAYOUT VDD1 GND1 XPD DUMMY IN1 OUT1 IN2 OUT2 IN3 OUT3 MAS1634 IN4 VDD2 OUT4 GND2 1660 µm (Y-scribe line width 210 µm) 1580 µm (X-scribe line width 100 µm) DIE size = 1.58 mm x 1.66 mm; PAD size = 90 µm x 90 µm Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left floating. Please make sure that GND1 and GND2 are the first pads to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. MAS1634 PAD COORDINATES Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die. Pad Identification Positive Power Supply Power Down Input LED Current Driver Input 1 LED Current Driver Input 2 LED Current Driver Input 3 LED Current Driver Input 4 Positive Power Supply Power Supply Ground Unused Dummy Pad LED Current Driver Output 1 LED Current Driver Output 2 LED Current Driver Output 3 LED Current Driver Output 4 Power Supply Ground Name X-coordinate Y-coordinate Note VDD1 XPD IN1 IN2 IN3 IN4 VDD2 GND1 DUMMY OUT1 OUT2 OUT3 OUT4 GND2 158 µm 158 µm 158 µm 158 µm 158 µm 158 µm 158 µm 1422 µm 1422 µm 1422 µm 1422 µm 1422 µm 1422 µm 1422 µm 1435 µm 1225 µm 1014 µm 814 µm 603 µm 392 µm 182 µm 1435 µm 1225 µm 1014 µm 814 µm 603 µm 392 µm 182 µm 1 3 4 4 4 4 1 2 5 2 Notes: 1) Keep VDD1 and VDD2 in same potential since both are internally connected together. Due to internal connection it is only necessary to connect at least one of the two VDD pins to supply voltage. 2) Keep GND1 and GND2 in same potential since both are internally connected together. Due to internal connection it is only necessary to connect at least one of the two GND pins to supply ground. 3) Power down mode when XPD is low and operating mode when XPD is high. 4) Each led driver input has 1.7MΩ ± 15% pull-down resistor but which are in an inactive high impedance state if the XPD input is low (i.e. power down mode). This is the reason why XPD pin requires external control to achieve properly controlled operation. 5) Dummy pad is electrically unconnected and its only purpose is to make pad layout symmetrical. 5 (8) DA1634.001 28 November, 2008 TYPICAL APPLICATION VDD VDD VDD1 VDD2 XPD DUMMY & VDD OUT1 IN1 VDD OUT2 IN2 MCU VDD OUT3 IN3 VDD OUT4 IN4 MAS1634 GND1 4 x LED Driver GND GND2 GND Figure 2. Application circuit of MAS1634 quad LED driver 6 (8) DA1634.001 28 November, 2008 MAS1634 SAMPLES IN DIL-20 PACKAGE 1 20 19 GND1 18 2 VDD1 3 IN2 6 IN3 7 IN4 8 MAS1634xx YYWW XXXXX.X XPD 4 IN1 5 VDD2 9 17 OUT1 16 OUT2 15 OUT3 14 OUT4 13 GND2 12 11 10 Top Marking Definitions: YYWW = Year Week XXXXX.X = Lot Number xx = Sample Version PIN DESCRIPTION Pin Name VDD1 XPD IN1 IN2 IN3 IN4 VDD2 GND2 OUT4 OUT3 OUT2 OUT1 GND1 Pin Type 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NC NC P DI DI DI DI DI P NC NC NC G AO AO AO AO NC G NC Function Note Positive Power Supply Power Down Input LED Current Driver Input 1 LED Current Driver Input 2 LED Current Driver Input 3 LED Current Driver Input 4 Positive Power Supply 1 3 4 4 4 4 1 Power Supply Ground LED Current Driver Output 4 LED Current Driver Output 3 LED Current Driver Output 2 LED Current Driver Output 1 2 Power Supply Ground 2 A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected Notes: 1) Keep VDD1 and VDD2 in same potential since both are internally connected together. Due to internal connection it is only necessary to connect at least one of the two VDD pins to supply voltage. 2) Keep GND1 and GND2 in same potential since both are internally connected together. Due to internal connection it is only necessary to connect at least one of the two GND pins to supply ground. 3) Power down mode when XPD is low and operating mode when XPD is high. 4) Each led driver input has 1.7MΩ ± 15% pull-down resistor but which are in an inactive high impedance state if the XPD input is low (i.e. power down mode). This is the reason why XPD pin requires external control to achieve properly controlled operation. 7 (8) DA1634.001 28 November, 2008 ORDERING INFORMATION Product Code Product Description MAS1634AA1WA611 Quad LED Driver IC EWS-tested 300 µm thick MAS1634 wafer LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 8 (8)