MAXIM MAX2667_12

EVALUATION KIT AVAILABLE
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
General Description
Features
The MAX2667/MAX2669 high-gain, low-noise amplifiers
(LNAs) are designed for GPS L1, Galileo, and GLONASS
applications. Designed in Maxim’s advanced SiGe process, the devices achieve a high gain and our lowest
noise figure, while maximizing the input-referred 1dB
compression point and the 3rd-order intercept point.
S 19dB High-Power Gain (MAX2667)
The devices operate from a +1.6V to +3.3V single supply. The MAX2667 is optimized for low current. The
MAX2669 is optimized for high linearity. The shutdown
feature in the device reduces the supply current to be
less than 10μA. The devices are available in a very small,
lead-free, RoHS-compliant, 0.86mm x 1.26mm x 0.65mm
wafer-level package (WLP).
S Low Bill of Materials: Two Inductors, Three
Capacitors, and One Resistor
S Ultra-Low Noise Figure: 0.65dB
S Integrated 50Ω Output Matching Circuit
S Low 4.1mA Supply Current (MAX2667)
S Wide 1.6V to 3.3V Supply Voltage Range
S Small Footprint: 0.86mm x 1.26mm
S Thin Profile: 0.65mm
S 0.4mm-Pitch Wafer-Level Package (WLP)
Ordering Information
Applications
Automotive Navigation
PART
Location-Enabled Mobile Devices
Telematics (Asset Tracking and Management)
Personal Navigation Devices (PNDs)
TEMP RANGE
PIN-PACKAGE
MAX2667EWT+T
-40°C to +85°C
6 WLP
MAX2669EWT+T
-40°C to +85°C
6 WLP
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
Cellular Phones with GPS
Notebook PCs/Ultra-Mobile PCs
Recreational, Marine Navigation
Avionics
Watches
Typical Application Circuit
SHDN
+
C3
MAX2667
MAX2669
A1
BIAS
A2
RF INPUT
L1
RF OUTPUT
BIAS
L2
C1
25kΩ
RFOUT
VCC
RFIN
B1
B2
VCC
C2
GNDAC
L2 = 100nH
C3 = 39pF
C1
L1 = 6.2nH (MAX2667)
C1 = 100nF (MAX2667)
C2 = 39pF
C2
GNDDC
L1 = 3.3nH (MAX2669)
C1 = 100nF (MAX2669)
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-5518; Rev 1; 9/12
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
ABSOLUTE MAXIMUM RATINGS
VCC to GND_.........................................................-0.3V to +3.6V
RFOUT and BIAS to GND_...... -0.3V to (Operating VCC + 0.3V)
Maximum RF Input Power................................................ +5dBm
Continuous Power Dissipation (TA = +70°C)
WLP (derates 10.5mW/°C above +70°C).....................840mW
Maximum Current into RF Input..........................................10mA
Operating Temperature Range........................... -40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range............................. -65°C to +160°C
Soldering Temperature (reflow) (Note 1).........................+260°C
Note 1: Refer to Application Note 1891: Wafer-level packaging (WLP) and its applications.
CAUTION! ESD SENSITIVE DEVICE
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
Junction-to-Ambient Thermal Resistance (qJA)...........95°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS
(MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, no RF signals are applied, TA = -40°C to +85°C. Typical values are at VCC = 2.85V
and TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
Supply Voltage
Supply Current
SHDN = high
MIN
TYP
MAX
UNITS
1.6
2.85
3.3
V
MAX2667
4.1
MAX2669
7.7
Digital Input Logic-High
Shutdown mode, SHDN = low
TA = +25°C
Digital Input Logic-Low
TA = +25°C
mA
10
1.2
FA
V
0.45
V
AC ELECTRICAL CHARACTERISTICS
(MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, fRFIN = 1575.42MHz, TA = -40°C to +85°C. Typical values are at VCC = 2.85V and
TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
RF Frequency
CONDITIONS
VCC = 2.85V
Power Gain
VCC = 1.6V
Noise Figure
2 MIN
L1 band
TYP
1575.42
MAX2667
15.0
19.5
MAX2669
14.6
17.7
MAX2667
14.8
19.4
MAX2669
14.3
17.6
VCC = 1.8V
0.65
VCC = 3.3V
0.65
MAX
UNITS
MHz
dB
dB
Maxim Integrated
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, fRFIN = 1575.42MHz, TA = -40°C to +85°C. Typical values are at VCC = 2.85V and
TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
In-Band 3rd-Order Input
Intercept Point
(Note 3)
Out-of-Band 3rd-Order Input
Intercept Point
(Note 4)
Input 1dB Compression Point
(Note 5)
MIN
TYP
MAX2667
-3.5
MAX2669
+4.5
MAX2667
+2.5
MAX2669
+8
MAX2667
-12.5
MAX2669
-10
MAX
UNITS
dBm
dBm
dBm
Input Return Loss
10
dB
Output Return Loss
15
dB
Reverse Isolation
30
dB
Note 2: M
in and max limits guaranteed by test at TA = +25°C and guaranteed by design and characterization at TA = -40°C and
TA = +85°C.
Note 3: Measured with the two tones located at 1MHz and 2MHz offset from the center of the GPS band with -30dBm/tone for
MAX2667 and -27dBm/tone for MAX2669.
Note 4: Measured with input tones at 1713MHz (-25dBm) and 1851MHz (-49dBm).
Note 5: Measured with a tone located at 5MHz offset from the center of the GPS band.
Maxim Integrated
3
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Typical Operating Characteristics
(MAX2667/MAX2669 EV kit. Typical values are at VCC = 2.85V, fRFIN = 1575.42MHz, TA = +25°C, unless otherwise noted.)
MAX2669
MAX2667
20
MAX2669
-30
-20
MAX2667
|S12| (dB)
-15
-25
10
5
-35
1500
MAX2667
-70
-10
1000
-50
-60
-5
500
-40
0
-30
2000
2500
1000
500
1500
2000
500
2500
1500
2500
2000
FREQUENCY (MHz)
FREQUENCY (MHz)
OUTPUT RETURN LOSS vs. FREQUENCY
MAX2667 IN-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TWO TONES LOCATED AT 1MHz AND
2MHz OFFSET WITH -35dBm/TONE)
MAX2669 IN-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TWO TONES LOCATED AT 1MHz AND
2MHz OFFSET WITH -30dBm/TONE)
IIP3 (dBm)
-10
MAX2669
-15
6
-2
-40NC
-3
-40NC
4
+25NC
+25NC
2
-4
-20
MAX2667 toc06
-1
IIP3 (dBm)
MAX2667
8
MAX2667 toc05
0
MAX2667 toc04
-5
+85NC
+85NC
-5
-25
500
1000
1500
FREQUENCY (MHz)
4 1000
FREQUENCY (MHz)
0
|S22| (dB)
MAX2669
15
GAIN (dB)
|S11| (dB)
-10
-20
MAX2667 toc02
MAX2667 toc01
-5
REVERSE ISOLATION vs. FREQUENCY
GAIN vs. FREQUENCY
25
MAX2667 toc03
INPUT RETURN LOSS vs. FREQUENCY
0
2000
2500
1.6
1.8
2.0
2.2
2.4
2.6
SUPPLY VOLTAGE (V)
2.8
3.0
3.2
0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
SUPPLY VOLTAGE (V)
Maxim Integrated
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Typical Operating Characteristics (continued)
(MAX2667/MAX2669 EV kit. Typical values are at VCC = 2.85V, fRFIN = 1575.42MHz, TA = +25°C, unless otherwise noted.)
MAX2667 OUT-OF-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TONE 1 AT 1713MHz, -25dBm;
TONE 2 AT 1851MHz, -49dBm)
MAX2667 toc08
10
MAX2667 toc07
3
MAX2669 OUT-OF-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TONE 1 AT 1713MHz, -25dBm;
TONE 2 AT 1851MHz, -49dBm)
9
+85NC
8
+25NC
+85NC
1
IIP3 (dBm)
IIP3 (dBm)
2
-40NC
7
+25NC
6
0
-40NC
5
4
-1
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
1.8
2.0
2.4
2.6
2.8
3.0
3.2
SUPPLY VOLTAGE (V)
MAX2667 INPUT P1dB COMPRESSION
vs. SUPPLY VOLTAGE AND TEMPERATURE
MAX2669 INPUT P1dB COMPRESSION vs.
SUPPLY VOLTAGE AND TEMPERATURE
+85NC
-14
+25NC
-15
+85NC
-10
INPUT P1dB (dBm)
-13
-11
-12
+25NC
-16
-13
-40NC
-17
MAX2667 toc10
-9
MAX2667 toc09
-12
-40NC
-18
-14
1.6
1.8
2.0
2.2
2.4
2.6
SUPPLY VOLTAGE (V)
Maxim Integrated
2.2
SUPPLY VOLTAGE (V)
-11
INPUT P1dB (dBm)
1.6
3.2
2.8
3.0
3.2
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
SUPPLY VOLTAGE (V)
5
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Bump Configuration
TOP VIEW
BUMP SIDE DOWN
MAX2667/MAX2669
1
2
A
BIAS
RFOUT/
SHDN
B
RFIN
VCC
C
GNDAC
GNDDC
+
WLP
Bump Description
BUMP
NAME
FUNCTION
A1
BIAS
Provides Bias for LNA Input. Connect to B1 (RFIN) through a high-value inductor (100nH),
and bypass to ground close to the pin.
A2
RFOUT/SHDN
RF Output and SHDN Logic Input. RFOUT is internally matched to 50I and has an internal
DC-blocking capacitor. The SHDN logic requires an external 25kΩ resistor to the logic
control.
B1
RFIN
RF Input. Connect to A1 through bias choke, and connect matching network and
DC-blocking capacitor.
B2
VCC
Supply Voltage. Bypass to ground with a capacitor close to the IC.
C1
GNDAC
Ground of the RF Path. Connect to the 2nd-layer PCB ground plane with a via next to the
pin pad.
C2
GNDDC
Ground of Bias Circuit. Connect to the 2nd-layer PCB ground plane with a separate via
from pin C1. Sharing a ground via with pin C1 might cause stability problems.
Detailed Description
The MAX2667/MAX2669 are LNAs designed for GPS
L1, Galileo, and GLONASS applications. The devices
feature a power-shutdown control mode to eliminate the
need for an external supply switch. The devices achieve
a high gain and an ultra-low noise figure.
Input and Output Matching
The devices require an off-chip input matching. Only
an inductor in series with a DC-blocking capacitor is
6 needed to form the input matching circuit. The Typical
Application Circuit shows the recommended inputmatching network. These values are optimized for the
best simultaneous gain, noise figure, and return loss
performance. Tables 1 and 2 list typical device S parameters and Kf values. The devices integrate an on-chip
output matching to 50Ω at the output, eliminating the
need for external matching components. The value of the
input coupling capacitor affects IIP3. A smaller coupling
capacitor results in lower IIP3.
Maxim Integrated
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Shutdown
The devices include a shutdown feature to turn off the
entire chip. A logic-high must be applied to the RFOUT/
(SHDN) pin using a 25kΩ external resistor to place the
part in active mode, and a logic-low to place the part in
shutdown mode.
Applications Information
A properly designed PCB is essential to any RF microwave circuit. Use controlled-impedance lines on all
high-frequency inputs and outputs. Bypass VCC with
decoupling capacitors located close to the device. For
long VCC lines, it may be necessary to add decoupling
capacitors. Locate these additional capacitors further
away from the device package. Proper grounding of
the GND_ pins is essential. If the PCB uses a topside
RF ground, connect it directly to the GND_ pins. For a
board where the ground is not on the component layer,
connect the GND_ pins to the board with multiple vias
close to the package.
Table 1. MAX2667 Typical Device S-Parameter Values and K-Factor
FREQ.
(MHz)
S11 MAG
(dB)
S11
PHASE
(Degrees)
S21 MAG
(dB)
S21
PHASE
(Degrees)
S12 MAG
(dB)
S12
PHASE
(Degrees)
S22 MAG
(dB)
S22
PHASE
(Degrees)
Kf
1000
-2.0
-47.7
6.0
-100.0
-47.5
-148.0
-1.0
-55.0
5.1
1100
-2.1
-48.6
7.4
-100.6
-45.7
-150.0
-1.0
-58.1
3.8
1200
-2.2
-51.6
9.6
-107.3
-42.9
-153.5
-1.4
-65.4
3.1
1300
-2.4
-55.0
12.0
-117.2
-39.6
-160.2
-2.1
-74.1
2.5
1400
-2.7
-58.6
14.0
-129.5
-37.0
-168.5
-3.6
-85.5
2.3
1500
-6.5
-61.9
16.2
-146.5
-34.1
178.5
-7.4
-100.0
2.8
1575
-4.3
-62.3
17.1
-164.2
-32.9
162.8
-15.3
-100.8
2.1
1600
-4.6
-61.6
17.3
-170.6
-32.8
156.6
-20.6
-78.9
2.0
1700
-5.4
-55.3
17.1
165.5
-32.5
136.5
-9.5
10.0
1.8
1800
-5.2
-49.8
15.7
145.8
-33.8
121.6
-4.5
-2.4
1.6
1900
-4.8
-47.3
13.9
135.2
-35.2
113.8
-2.7
-13.2
1.6
2000
-4.5
-46.7
12.7
127.3
-36.7
109.6
-1.8
-21.2
1.5
Table 2. MAX2669 Typical Device S-Parameter Values and K-Factor
FREQ.
(MHz)
S11 MAG
(dB)
S11
PHASE
(Degrees)
S21 MAG
(dB)
S21
PHASE
(Degrees)
S12 MAG
(dB)
S12
PHASE
(Degrees)
S22 MAG
(dB)
S22
PHASE
(Degrees)
Kf
1000
-3.0
-57.0
10.8
-120.0
-43.0
-154.0
-1.3
-65.0
3.2
1100
-3.3
-58.2
11.6
-124.5
-42.1
-155.0
-1.6
-70.2
3.3
1200
-3.5
-60.0
13.4
-134.6
-39.3
-160.5
-2.4
-79.6
2.8
1300
-3.8
-62.3
14.9
-148.0
-37.2
-168.3
-4.0
-90.0
2.7
1400
-4.3
-63.3
15.9
-162.3
-35.4
-178.2
-7.3
-101.0
2.7
1500
-4.9
-62.0
16.6
-178.9
-33.9
171.0
-14.5
-100.6
2.6
1575
-5.3
-59.7
16.6
168.0
-33.5
161.7
-19.6
-26.0
2.5
1600
-5.4
-58.5
16.5
163.9
-33.6
157.5
-16.7
-6.0
2.5
1700
-5.5
-53.7
15.8
149.3
-33.6
148.3
-9.0
3.6
2.3
1800
-5.3
-50.3
14.7
136.8
-34.2
142.5
-5.7
-2.8
2.2
1900
-5.1
-48.0
13.4
130.0
-35.1
139.6
-4.0
-9.6
2.3
2000
-4.9
-46.3
12.7
123.9
-35.8
138.6
-3.0
-15.0
2.1
Maxim Integrated
7
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Table 3. MAX2667 Typical Noise Parameters (VCC = 2.85V, TA = +25°C)
FREQUENCY (MHz)
FMIN (dB)
|GOPT|
|GOPT| ANGLE
1550
0.54
0.48
39.9
RN (I)
8.43
1560
0.55
0.48
40.2
8.42
1570
0.55
0.48
40.5
8.41
1575
0.55
0.48
40.7
8.41
1580
0.55
0.48
40.9
8.40
1590
0.55
0.48
41.2
8.39
1600
0.55
0.48
41.5
8.38
Table 4. MAX2669 Typical Noise Parameters (VCC = 2.85V, TA = +25°C)
FREQUENCY (MHz)
FMIN (dB)
|GOPT|
|GOPT| ANGLE
RN (I)
1550
0.57
0.29
76.1
4.53
1560
0.57
0.29
76.6
4.53
1570
0.57
0.29
77.0
4.53
1575
0.57
0.29
77.3
4.52
1580
0.57
0.29
77.5
4.52
1590
0.57
0.29
78.0
4.52
1600
0.57
0.29
78.5
4.52
Chip Information
PROCESS: SiGe BiCMOS
8 Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
6 WLP
W61B1+1
21-0217
Refer to
Application 1891
Maxim Integrated
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Revision History
REVISION
NUMBER
REVISION
DATE
0
9/10
Initial release
1
9/12
Updated Bump Description, updated Shutdown section
DESCRIPTION
PAGES
CHANGED
—
5, 6
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
© 2012
Maxim Integrated
9
The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.