ONSEMI MC14543B

MC14543B
BCD-to-Seven Segment
Latch/Decoder/Driver for
Liquid Crystals
The MC14543B BCD–to–seven segment latch/decoder/driver is
designed for use with liquid crystal readouts, and is constructed with
complementary MOS (CMOS) enhancement mode devices. The
circuit provides the functions of a 4–bit storage latch and an 8421
BCD–to–seven segment decoder and driver. The device has the
capability to invert the logic levels of the output combination. The
phase (Ph), blanking (BI), and latch disable (LD) inputs are used to
reverse the truth table phase, blank the display, and store a BCD code,
respectively. For liquid crystal (LC) readouts, a square wave is applied
to the Ph input of the circuit and the electrically common backplane of
the display. The outputs of the circuit are connected directly to the
segments of the LC readout. For other types of readouts, such as
light–emitting diode (LED), incandescent, gas discharge, and
fluorescent readouts, connection diagrams are given on this data sheet.
Applications include instrument (e.g., counter, DVM etc.) display
driver, computer/calculator display driver, cockpit display driver, and
various clock, watch, and timer uses.
•
•
•
•
•
•
•
•
Latch Storage of Code
Blanking Input
Readout Blanking on All Illegal Input Combinations
Direct LED (Common Anode or Cathode) Driving Capability
Supply Voltage Range = 3.0 V to 18 V
Capable of Driving 2 Low–power TTL Loads, 1 Low–power Schottky
TTL Load or 2 HTL Loads Over the Rated Temperature Range
Pin–for–Pin Replacement for CD4056A (with Pin 7 Tied to VSS).
Chip Complexity: 207 FETs or 52 Equivalent Gates
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol
Parameter
Value
Unit
– 0.5 to +18.0
V
– 0.5 to VDD + 0.5
V
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MARKING
DIAGRAMS
16
PDIP–16
P SUFFIX
CASE 648
MC14543BCP
AWLYYWW
1
16
SOIC–16
D SUFFIX
CASE 751B
14543B
AWLYWW
1
16
SOEIAJ–16
F SUFFIX
CASE 966
MC14543B
AWLYWW
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
Device
Package
Shipping
MC14543BCP
PDIP–16
2000/Box
MC14543BD
SOIC–16
48/Rail
MC14543BDR2
SOIC–16
2500/Tape & Reel
VDD
DC Supply Voltage Range
Vin
Input Voltage Range, All Inputs
Iin
DC Input Current per Pin
± 10
mA
MC14543BF
SOEIAJ–16
See Note 1.
PD
Power Dissipation,
per Package (Note 3.)
500
mW
MC14543BFEL
SOEIAJ–16
See Note 1.
TA
Operating Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
IOHmax
IOLmax
Maximum Continuous Output
Drive Current (Source or Sink)
10
(per Output)
mA
POHmax
POLmax
Maximum Continuous Output
Power (Source or Sink) (4.)
70
(per Output)
mW
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
4. POHmax = IOH (VOH – VDD) and POLmax = IOL (VOL – VSS)
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
This device contains protection circuitry to guard
against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high–impedance circuit. For proper
operation, Vin and Vout should be constrained to the
range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate
logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
v
v
Publication Order Number:
MC14543B/D
MC14543B
PIN ASSIGNMENT
LD
1
16
VDD
C
2
15
f
B
3
14
g
D
4
13
e
A
5
12
d
PH
6
11
c
BI
7
10
b
VSS
8
9
a
TRUTH TABLE
Inputs
LD
Outputs
BI Ph*
D
C
B A a b c d e
f
g
Display
X
1
0
X
X
X X 0
0
0
0
0
0
0
Blank
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
1
0
1
1
1
1
1
1
1
1
0
1
1
0
1
1
1
0
1
0
1
0
0
0
0
0
1
1
0
1
2
3
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
1
1
1
0
1
1
0
0
0
1
0
1
1
1
0
1
1
1
0
4
5
6
7
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
1
1
0
1
0
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
0
0
1
1
0
0
1
1
0
0
8
9
Blank
Blank
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Blank
Blank
Blank
Blank
0
0
0
X
X
X X
†
†
†
†
**
Inverse of Output
Combinations
Above
**
Display
as above
X = Don’t care
† = Above Combinations
* = For liquid crystal readouts, apply a square wave to Ph
For common cathode LED readouts, select Ph = 0
For common anode LED readouts, select Ph = 1
** = Depends upon the BCD code previously applied when LD = 1
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2
MC14543B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
– 55_C
VDD
25_C
125_C
Symbol
Vdc
Min
Max
Min
Typ (5.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
10
15
– 3.0
– 0.64
—
– 1.6
– 4.2
—
—
—
—
—
– 2.4
– 0.51
—
– 1.3
– 3.4
– 4.2
– 0.88
– 10.1
– 2.25
– 8.8
—
—
—
—
—
– 1.7
– 0.36
—
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
10
15
0.64
1.6
—
4.2
—
—
—
—
0.51
1.3
—
3.4
0.88
2.25
10.1
8.8
—
—
—
—
0.36
0.9
—
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package) Vin = 0 or VDD,
Iout = 0 µA
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
Total Supply Current (6.) (7.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT
5.0
10
15
Characteristic
Output Voltage
Vin = VDD or 0
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 0.5 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 9.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
mAdc
IT = (1.6 µA/kHz) f + IDD
IT = (3.1 µA/kHz) f + IDD
IT = (4.7 µA/kHz) f + IDD
5. Noise immunity specified for worst–case input combination.
Noise Margin for both “1” and “0” level = 1.0 V min @ VDD = 5.0 V
= 2.0 V min @ VDD = 10 V
= 2.5 V min @ VDD = 15 V
6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + 3.5 x 10–3 (CL – 50) VDDf
where: IT is in µA (per package), CL in pF, VDD in V, and f in kHz is input frequency.
7. The formulas given are for the typical characteristics only at 25_C.
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3
µAdc
MC14543B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (8.) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise Time
tTLH = (3.0 ns/pF) CL + 30 ns
tTLH = (1.5 ns/pF) CL + 15 ns
tTLH = (1.1 ns/pF) CL + 10 ns
tTLH
Output Fall Time
tTHL = (1.5 ns/pF) CL + 25 ns
tTHL = (0.75 ns/pF) CL + 12.5 ns
tTHL = (0.55 ns/pF) CL + 12.5 ns
tTHL
Turn–Off Delay Time
tPLH = (1.7 ns/pF) CL + 520 ns
tPLH = (0.66 ns/pF) CL + 217 ns
tPLH = (0.5 ns/pF) CL + 160 ns
tPLH
Turn–On Delay Time
tPHL = (1.7 ns/pF) CL + 420 ns
tPHL = (0.66 ns/pF) CL + 172 ns
tPHL = (0.5 ns/pF) CL + 130 ns
tPHL
VDD
Min
Typ
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
605
250
185
1210
500
370
5.0
10
15
—
—
—
505
205
155
1650
660
495
Unit
ns
ns
ns
ns
Setup Time
tsu
5.0
10
15
350
450
500
—
—
—
ns
Hold Time
th
5.0
10
15
40
30
20
—
—
—
ns
tWH
5.0
10
15
250
100
80
—
—
—
ns
Latch Disable Pulse Width (Strobing Data)
125
50
40
8. The formulas given are for the typical characteristics only.
LOGIC DIAGRAM
BI 7
VDD = PIN 16
VSS = PIN 8
9 a
A 5
10 b
11 c
B 3
12 d
13 e
C 2
15 f
14 g
D 4
LD 1
PHASE 6
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4
MC14543B
24
VDD = 15 Vdc
VDD = 5.0 Vdc
POHmax = 70 mWdc
IOL , SINK CURRENT (mAdc)
IOH, SOURCE CURRENT (mAdc)
0
– 6.0
VDD = 10 Vdc
– 12
– 18
18
VDD = 10 Vdc
12
6.0
VDD = 15 Vdc
– 24
– 16
POLmax = 70 mWdc
VDD = 5.0 Vdc
VSS = 0 Vdc
VSS = 0 Vdc
0
– 12
– 8.0
– 4.0
(VOH – VDD), SOURCE DEVICE VOLTAGE (Vdc)
0
0
4.0
8.0
12
(VOL – VSS), SINK DEVICE VOLTAGE (Vdc)
Figure 1. Typical Output Source
Characteristics
16
Figure 2. Typical Output Sink
Characteristics
(a) Inputs D, Ph, and BI low, and Inputs A, B, and LD high.
20 ns
20 ns
90%
10%
C
VDD
50%
tPLH
tPHL
90%
50%
g
VOH
10%
tTLH
tTHL
VSS
VOL
(b) Inputs D, Ph, and BI low, and Inputs A and B high.
20 ns
90%
10%
LD
VDD
50%
VSS
tsu
Inputs BI and Ph low, and Inputs D and LD high.
f in respect to a system clock.
C
th
50%
50%
VSS
All outputs connected to respective CL loads.
20 ns
A, B, AND C
10%
ANY OUTPUT
20 ns
90%
50%
1
2f
50% DUTY CYCLE
VDD
VOH
g
VDD
VOL
VSS
(c) Data DCBA strobed into latches
VDD
VOH
LD
VOL
50%
tWH
Figure 3. Dynamic Power Dissipation
Signal Waveforms
Figure 4. Dynamic Signal Waveforms
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5
VSS
MC14543B
CONNECTIONS TO VARIOUS DISPLAY READOUTS
LIQUID CRYSTAL (LC) READOUT
MC14543B
OUTPUT
Ph
INCANDESCENT READOUT
APPROPRIATE
VOLTAGE
ONE OF SEVEN SEGMENTS
COMMON
BACKPLANE
MC14543B
OUTPUT
Ph
SQUARE WAVE
(VSS TO VDD)
VSS
GAS DISCHARGE READOUT
LIGHT EMITTING DIODE (LED) READOUT
COMMON
CATHODE LED
COMMON
ANODE LED
MC14543B
OUTPUT
Ph
APPROPRIATE
VOLTAGE
VDD
MC14543B
OUTPUT
Ph
MC14543B
OUTPUT
Ph
VSS
VDD
NOTE: Bipolar transistors may be added for gain (for VDD
v 10 V or Iout ≥ 10 mA).
VSS
CONNECTIONS TO SEGMENTS
a
f
g
b
e
c
d
VDD = PIN 16
VSS = PIN 8
DISPLAY
0
1
2
3
4
5
6
7
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6
8
9
MC14543B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
–T–
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
M
T B
S
A
S
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7
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14543B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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