MCNIX MX27C512PC-12

MX27C512
512K-BIT [64Kx8] CMOS EPROM
FEATURES
•
•
•
•
•
•
64K x 8 organization
Single +5V power supply
+12.5V programming voltage
Fast access time: 45/55/70/90/100/120/150ns
Totally static operation
Completely TTL compatible
• Operating current: 30mA
• Standby current: 100uA
• Package type:
- 28 pin plastic DIP
- 32 pin PLCC
- 28 pin 8 x 13.4 mm TSOP(I)
GENERAL DESCRIPTION
The MX27C512 is a 5V only, 512K-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized
as 64K words by 8 bits per word, operates from a single
+5volt supply, has a static standby mode, and features
fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
programmers may be used. The MX27C512 supports
intelligent fast programming algorithm which can result
in programming time of less than fifteen seconds.
PIN CONFIGURATIONS
BLOCK DIAGRAM
A6
32
A13
1
A14
VCC
A15
4
NC
5
30
29
A9
A11
A2
25
MX27C512
OE/VPP
A1
A10
A0
CE
21
20
Q4
Q3
NC
GND
17
22
23
24
25
26
27
28
1
2
3
4
5
6
7
P/N: PM0235
MX27C512
Q0~Q7
.
.
.
.
.
Y-DECODER
X-DECODER
.
.
.
.
.
.
.
.
Y-SELECT
512K BIT
CELL
MAXTRIX
Q6
VCC
GND
Q5
13
14
PIN DESCRIPTION
8 x 13.4mm 28TSOP(I)
OE/VPP
A11
A9
A8
A13
A14
VCC
A15
A12
A7
A6
A5
A4
A3
A0~A15
ADDRESS
INPUTS
Q7
NC
Q0
.
.
.
NC
9
OUTPUT
BUFFERS
A8
A4
A3
CONTROL
LOGIC
CE
OE/VPP
A5
Q2
VCC
A14
A13
A8
A9
A11
OE/VPP
A10
CE
Q7
Q6
Q5
Q4
Q3
A7
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Q1
MX27C512
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A12
PLCC
PDIP
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
This EPROM is packaged in industry standard 28 pin
dual-in-line packages 32 lead PLCC, and 28 lead
TSOP(I) packages.
21
20
19
18
17
16
15
14
13
12
11
10
9
8
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
SYMBOL
PIN NAME
A0~A15
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE/VPP
Output Enable Input/Program Supply
Voltage
1
NC
No Internal Connection
VCC
Power Supply Pin (+5V)
GND
Ground Pin
REV. 4.5, NOV. 09, 2001
MX27C512
FUNCTIONAL DESCRIPTION
AUTO IDENTIFY MODE
THE PROGRAMMING OF THE MX27C512
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27C512.
When the MX27C512 is delivered, or it is erased, the
chip has all 512K bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27C512 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
To activate this mode, the programming equipment
must force 12.0 ± 0.5(VH) on address line A9 of the
device. Two identifier bytes may then be sequenced
from the device outputs by toggling address line A0 from
VIL to VIH. All other address lines must be held at VIL
during auto identify mode.
FAST PROGRAMMING
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27C512, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
The device is set up in the fast programming mode when
the programming voltage OE/VPP = 12.75V is applied,
with VCC = 6.25 V, (Algorithm is shown in Figure 1). The
programming is achieved by applying a single TTL low
level 100us pulse to the CE input after addresses and
data line are stable. If the data is not verified, an
additional pulse is applied for a maximum of 25 pulses.
This process is repeated while sequencing through
each address of the device. When the programming
mode is completed, the data in all address is verified at
VCC = 5V ± 10%.
READ MODE
The MX27C512 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.
PROGRAM INHIBIT MODE
Programming of multiple MX27C512s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C512 may be common. A
TTL low-level program pulse applied to an MX27C512
CE input with OE/VPP = 12.5 ± 0.5V will program that
MX27C512. A high-level CE input inhibits the other
MX27C512s from being programmed.
STANDBY MODE
The MX27C512 has a CMOS standby mode which
reduces the maximum VCC current to 100uA . It is
placed in CMOS standby when CE is at VCC ± 0.3 V.
The MX27C512 also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with OE/VPP and
CE, at VIL. Data should be verified tDV after the falling
edge of CE.
P/N:PM0235
2
REV. 4.5, NOV. 09, 2001
MX27C512
TWO-LINE OUTPUT CONTROL FUNCTION
SYSTEM CONSIDERATIONS
To accommodate multiple memory connections, a twoline control function is provided to allow for:
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
MODE SELECT TABLE
PINS
MODE
CE
OE/VPP
A0
A9
OUTPUTS
Read
VIL
VIL
X
X
DOUT
Output Disable
VIL
VIH
X
X
High Z
Standby (TTL)
VIH
X
X
X
High Z
Standby (CMOS)
VCC±0.3V
X
X
X
High Z
Program
VIL
VPP
X
X
DIN
Program Verify
VIL
VIL
X
X
DOUT
Program Inhibit
VIH
VPP
X
X
High Z
Manufacturer Code(3)
VIL
VIL
VIL
VH
C2H
Device Code(3)
VIL
VIL
VIH
VH
91H
NOTES: 1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
P/N:PM0235
3. A1 - A8 = A10 - A15 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during
programming.
3
REV. 4.5, NOV. 09, 2001
MX27C512
Figure1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
OE/VPP = 12.75V
PROGRAM ONE 100us PULSE
NO
INCREMENT ADDRESS
LAST
ADDRESS ?
YES
ADDRESS = FIRST LOCATION
X=0
INCREMENT ADDRESS
NO
LAST
ADDRESS ?
PASS
VERIFY BYTE
FAIL
INCREMENT X
YES
NO
PROGRAM ONE 100us PULSE
YES
VCC = 5.25V
OE/VPP = VIL
COMPARE
ALL BYTES
TO ORIGINAL
DATA
X = 25 ?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
P/N:PM0235
4
REV. 4.5, NOV. 09, 2001
MX27C512
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
CL
6.2K ohm
CL = 100 pF including jig capacitance (30pF for 45/55/70 ns parts)
SWITCHING TEST WAVEFORMS
2.0V
2.0V
TEST POINTS
AC driving levels
0.8V
0.8V
OUTPUT
INPUT
AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade.
Input pulse rise and fall times are < 10ns.
1.5V
AC driving levels
1.5V
TEST POINTS
OUTPUT
INPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
(2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70.
P/N:PM0235
5
REV. 4.5, NOV. 09, 2001
MX27C512
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature
-40oC to 125oC
Storage Temperature
-65oC to 125oC
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to VCC + 0.5V
VCC to Ground Potential
-0.5V to 7.0V
A9 & Vpp
-0.5V to 13.5V
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are subject to change.
DC/AC Operating Conditions for Read Operation
MX27C512
-45
Operating
Commercial 0°C to 55°C
Temperature Industrial
-55
0°C to 70°C
-70
-90
0°C to 70°C
-12
0°C to 70°C
-15
0°C to 70°C
0°C to 70°C
-40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C
Automotive
Vcc Power Supply
0°C to 70°C
-10
-40°C to 125°C -40°C to 125°C -40°C to 125°C -40°C to 125°C
5V ± 5%
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
DC CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
VOH
Output High Voltage
2.4
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MAX.
UNIT
CONDITIONS
V
IOH = -0.4mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.2
0.8
V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 5.5V
ILO
Output Leakage Current
-10
10
uA
VOUT = 0 to 5.5V
ICC3
VCC Power-Down Current
100
uA
CE = VCC ± 0.3V
ICC2
VCC Standby Current
1.5
mA
CE = VIH
ICC1
VCC Active Current
30
mA
CE = VIL, f=5MHz, Iout =0mA
IPP
VPP Supply Current Read
10
uA
CE = VIL, VPP = 5.5V
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
CONDITIONS
CIN
Input Capacitance
8
12
pF
VIN = 0V
COUT
Output Capacitance
8
12
pF
VOUT = 0V
Vpp
VPP Capacitance
18
25
pF
VPP = 0V
P/N:PM0235
6
REV. 4.5, NOV. 09, 2001
MX27C512
AC CHARACTERISTICS
SYMBOL PARAMETER
27C512-45
27C512-55
27C512-70
27C512-90
MIN.
MIN.
MIN.
MIN.
MAX.
UNIT CONDITIONS
tACC
Address to Output Delay
45
MAX.
55
MAX.
70
MAX.
90
ns
CE = OE = VIL
tCE
Chip Enable to Output Delay
45
55
70
90
ns
OE = VIL
tOE
Output Enable to Output
25
30
35
40
ns
CE = VIL
25
ns
Delay
tDF
OE High to Output Float,
0
17
0
20
0
20
0
or CE High to Output Float
tOH
Output Hold from Address,
0
0
0
0
ns
CE or OE which ever occurred
first
27C512-10
MIN.
MAX.
27C512-12
MIN.
SYMBOL
PARAMETER
tACC
Address to Output Delay
tCE
Chip Enable to Output Delay
100
120
150
ns
OE = VIL
tOE
Output Enable to Output
45
50
65
ns
CE = VIL
50
ns
100
MAX.
27C512-15
MIN.
120
MAX.
UNIT
CONDITIONS
150
ns
CE = OE = VIL
Delay
tDF
OE High to Output Float,
tOH
Output Hold from Address,
0
30
0
35
0
or CE High to Output Float
0
0
0
ns
CE or OE which ever occurred
first
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
VOH
Output High Voltage
2.4
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
UNIT
CONDITIONS
V
IOH = -0.40mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.2
0.8
V
ILI
Input Leakage Current
-10
10
uA
VH
A9 Auto Select Voltage
11.5
12.5
V
ICC3
VCC Supply Current(Program & Verify)
40
mA
IPP2
VPP Supply Current(Program)
30
mA
VCC1
Fast Programming Supply Voltage
6.00
6.50
V
VPP1
Fast Programming Voltage
12.5
13.0
V
P/N:PM0235
7
MAX.
VIN = 0 to 5.5V
CE = VIL
REV. 4.5, NOV. 09, 2001
MX27C512
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
tAS
Address Setup Time
2
us
tDS
Data Setup Time
2
us
tAH
Address Hold Time
0
us
tDH
Data Hold Time
2
us
tDFP
Chip Enable to Output Float Delay
0
tVPS
VPP Setup Time
2
tPW
CE Program Pulse Width
95
tVCS
Vcc Setup Time
2
tDV
Data Valid from CE
tOEH
OE/VPP Hold Time
2
ns
tVR
OE/VPP Recovery Time
2
ns
P/N:PM0235
MAX.
130
CONDITIONS
ns
us
105
us
us
150
8
UNIT
ns
REV. 4.5, NOV. 09, 2001
MX27C512
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA ADDRESS
tACC
CE
tCE
OE
tDF
DATA
OUT
VALID DATA
tOE
tOH
FAST PROGRAMMING ALGORITHM WAVEFORM
PROGRAM
PROGRAM VERIFY
VIH
Addresses
VIL
Hi-z
tAS
DATA OUT VALID
DATA
tDV
tDS
tDH
tDFP
VPP1
OE/VPP
VIL
tVPS
tVR
tPW
VIH
CE
tVPS
tAH
VIL
tVCS
VCC1
VCC
P/N:PM0235
VCC
9
REV. 4.5, NOV. 09, 2001
MX27C512
ORDERING INFORMATION
PLASTIC PACKAGE
PART NO.
ACCESS TIME
OPERATING
STANDBY
OPERATING
(ns)
CURRENT MAX.(mA)
CURRENT MAX.(uA)
TEMPERATURE
PACKAGE
MX27C512PC-45
45
30
100
0°C to 70°C
28 Pin DIP
MX27C512QC-45
45
30
100
0°C to 70°C
32 Pin PLCC
MX27C512TC-45
45
30
100
0°C to 70°C
28 PinTSOP(I)
MX27C512PC-55
55
30
100
0°C to 70°C
28 Pin DIP
MX27C512QC-55
55
30
100
0°C to 70°C
32 Pin PLCC
MX27C512TC-55
55
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C512PC-70
70
30
100
0°C to 70°C
28 Pin DIP
MX27C512QC-70
70
30
100
0°C to 70°C
32 Pin PLCC
MX27C512TC-70
70
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C512PC-90
90
30
100
0°C to 70°C
28 Pin DIP
MX27C512QC-90
90
30
100
0°C to 70°C
32 Pin PLCC
MX27C512TC-90
90
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C512PC-12
120
30
100
0°C to 70°C
28 Pin DIP
MX27C512QC-12
120
30
100
0°C to 70°C
32 Pin PLCC
MX27C512TC-12
120
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C512PC-15
150
30
100
0°C to 70°C
28 Pin DIP
MX27C512QC-15
150
30
100
0°C to 70°C
32 Pin PLCC
MX27C512TC-15
150
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C512PI-45
45
30
100
-40°C to 85°C
28 Pin DIP
MX27C512QI-45
45
30
100
-40°C to 85°C
32 Pin PLCC
MX27C512TI-45
45
30
100
-40°C to 85°C
28 PinTSOP(I)
MX27C512PI-55
55
30
100
-40°C to 85°C
28 Pin DIP
MX27C512QI-55
55
30
100
-40°C to 85°C
32 Pin PLCC
MX27C512TI-55
55
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C512PI-70
70
30
100
-40°C to 85°C
28 Pin DIP
MX27C512QI-70
70
30
100
-40°C to 85°C
32 Pin PLCC
MX27C512TI-70
70
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C512PI-90
90
30
100
-40°C to 85°C
28 Pin DIP
MX27C512QI-90
90
30
100
-40°C to 85°C
32 Pin PLCC
MX27C512TI-90
90
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C512PI-12
120
30
100
-40°C to 85°C
28 Pin DIP
MX27C512QI-12
120
30
100
-40°C to 85°C
32 Pin PLCC
MX27C512TI-12
120
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C512PI-15
150
30
100
-40°C to 85°C
28 Pin DIP
MX27C512QI-15
150
30
100
-40°C to 85°C
32 Pin PLCC
MX27C512TI-15
150
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C512TA-90
90
30
100
-40°C to 125°C
28 Pin TSOP(I)
MX27C512TA-120
120
30
100
-40°C to 125°C
28 Pin TSOP(I)
P/N:PM0235
10
REV. 4.5, NOV. 09, 2001
MX27C512
PACKAGE INFORMATION
28-PIN PLASTIC DIP (600 mil)
P/N:PM0235
11
REV. 4.5, NOV. 09, 2001
MX27C512
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
P/N:PM0235
12
REV. 4.5, NOV. 09, 2001
MX27C512
8 x 13.4mm 28-PIN PLASTIC TSOP
P/N:PM0235
13
REV. 4.5, NOV. 09, 2001
MX27C512
REVISION HISTORY
Revision #
3.3
4.0
4.1
4.2
4.3
4.4
4.5
P/N:PM0235
Description
Programming Flow Chart corrected, programming verify after whole
array programmed with 1 pulse.
1) Reduce operating current change from 40mA to 30mA.
2) Add 28-TSOP(I) and 28-SOP packages offering.
3) Eliminate Interactive Programming Mode.
IPP 100uA --> 10uA
CDIP 70/90/100/120/150ns speed grades deleted from ordering
information.
Cancel ceramic DIP package type
Remove 28-pin SOP Package
Package Information format changed
Add automotive grade
14
Page
Date
08/07/1997
05/07/1998
P1,2,10,12
P1,10
P11~13
P6,10
MAR/02/2000
SEP/19/2001
NOV/09/2001
REV. 4.5, NOV. 09, 2001
MX27C512
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688
FAX:+886-3-563-2888
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TEL:+32-2-456-8020
FAX:+32-2-456-8021
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TEL:+81-44-246-9100
FAX:+81-44-246-9105
SINGAPORE OFFICE:
TEL:+65-348-8385
FAX:+65-348-8096
TAIPEI OFFICE:
TEL:+886-2-2509-3300
FAX:+886-2-2509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-453-8088
FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900
FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
15