NL37WZ16 Triple Buffer The NL37WZ16 is a high performance buffer with inputs operating from a 1.65 to 5.5 V supply. The NL37WZ16 can be used as a line receiver which will receive slow input signals. Features http://onsemi.com • Designed for 1.65 V to 5.5 V VCC Operation • Over Voltage Tolerant Inputs and Outputs • LVTTL Compatible − Interface Capability with 5 V TTL Logic • • • • • • with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Current Drive Capability is 24 mA at the Outputs Chip Complexity: FET = 94 Pb−Free Package is Available MARKING DIAGRAM 8 8 1 LR M G G US8 US SUFFIX CASE 493 1 LR M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) IN A1 1 8 VCC OUT Y3 2 7 OUT Y1 *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT IN A2 GND 3 6 4 5 IN A3 OUT Y2 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC Figure 1. Pinout (Top View) FUNCTION TABLE A Input IN A1 1 OUT Y1 IN A2 1 OUT Y2 IN A3 1 OUT Y3 L H Y Output L H ORDERING INFORMATION Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2006 April, 2006 − Rev. 4 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. 1 Publication Order Number: NL37WZ16/D NL37WZ16 MAXIMUM RATINGS Symbol Parameter Value Unit *0.5 to )7.0 V *0.5 ≤ VI ≤ )7.0 V *0.5 ≤ VO ≤ 7.0 V VI < GND *50 mA VO < GND *50 mA VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85_C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Output in Z or LOW State (Note 1) (Note 2) 260 _C )150 _C 333 _C/W 200 mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) > 2000 > 200 N/A V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Min Max Unit 1.65 1.5 5.5 5.5 V (Note 6) 0 5.5 V (HIGH or LOW State) 0 5.5 V *40 )85 _C 0 0 0 20 10 5 ns/V Operating Data Retention Only VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. http://onsemi.com 2 NL37WZ16 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Condition Min 0.7 VCC VIH High−Level Input Voltage 1.65 to 5.5 VIL Low−Level Input Voltage 1.65 to 5.5 VOH High−Level Output Voltage VIN = VIH or VIL VOL Low−Level Output Voltage VIN = VIH or VIL IOH = −100 mA *40°C ≤ TA ≤ 85°C TA = 25°C (V) Typ Max Min Max 0.7 VCC 0.3 VCC V 0.3 VCC 1.65 to 5.5 VCC − 0.1 VCC VCC − 0.1 IOH = −4 mA 1.65 1.55 1.50 1.55 IOH = −8 mA 2.3 1.9 2.1 1.9 IOH = −12 mA 2.7 2.2 2.4 2.2 IOH = −16 mA 3.0 2.4 2.7 2.4 IOH = −24 mA 3.0 2.3 2.5 2.3 IOH = −32 mA 4.5 3.8 4.0 3.8 IOL = 100 mA 1.65 to 5.5 0.1 0.1 1.65 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 4.5 0.42 IOL = 32 mA Input Leakage Current VIN = VCC or GND IOFF Power Off−Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND V V IOL = 4 mA IIN Unit V 0.55 0.55 0 to 5.5 $0.1 $1.0 mA 0 1 10 mA 5.5 1 10 mA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W *40°C ≤ TA ≤ 85°C TA = 25°C Symbol tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) VCC (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 $ 0.15 1.8 6.0 7.9 1.8 8.8 ns RL = 1 MW, CL = 15 pF 2.5 $ 0.2 1.0 3.0 5.2 1.0 5.8 RL = 1 MW, CL = 15 pF 3.3 $ 0.3 0.8 2.3 3.6 0.8 4.0 1.2 3.0 4.6 1.2 5.1 0.5 1..8 2.9 0.5 3.2 0.8 2.4 3.8 0.8 4.2 Condition RL = 500 W, CL = 50 pF 5.0 $ 0.5 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Input Capacitance CPD Power Dissipation Capacitance (Note 7) Condition Typical Unit VCC = 5.5 V, VI = 0 V or VCC 7.0 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. http://onsemi.com 3 NL37WZ16 VCC VCC A 50% GND tPLH Y tPHL PULSE GENERATOR DUT RT 50% VCC PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns CL RL RT = ZOUT of pulse generator (typically 50 W) Figure 3. Switching Waveforms Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number NL37WZ16US NL37WZ16USG Package Type Tape and Reel Size† US8 178 mm, 3000 Units / Tape & Reel US8 (Pb−Free) 178 mm, 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL37WZ16 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B −X− A 8 −Y− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). J DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE D 0.10 (0.004) M H 0.10 (0.004) T K N R 0.10 TYP T X Y V M F DETAIL E DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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