ONSEMI NLX3G17BMX1TCG

NLX3G17
Product Preview
Triple Non-Inverting
Schmitt-Trigger Buffer
The NLX3G17 MiniGatet is an advanced high-speed CMOS
triple non-inverting Schmitt-trigger buffer in ultra-small footprint.
The NLX3G17 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
The NLX3G17 can be used to enhance noise immunity or to square
up slowly changing waveforms.
Features
•Designed for 1.65 V to 5.5 V VCC Operation
•Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•24 mA Balanced Output Source and Sink Capability @ VCC = 3.0 V
•Balanced Propagation Delays
•Overvoltage Tolerant (OVT) Input and Output Pins
•Ultra-Small Packages
•These are Pb-Free Devices
IN A1
1
8
VCC
OUT Y3
2
7
OUT Y1
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MARKING
DIAGRAMS
KM
1
ULLGA8
1.45 x 1.0
CASE 613AA
1
ULLGA8
1.6 x 1.0
CASE 613AB
AEM
G
ULLGA8
1.95 x 1.0
CASE 613AC
AEM
G
1
K or AE = Specific Device Code
M
= Date Code
G
= Pb-Free Package
PIN ASSIGNMENT
3
IN A2
6
4
GND
IN A3
5
OUT Y2
Figure 1. Pinout (Top View)
IN A1
1
OUT Y1
IN A2
1
OUT Y2
IN A3
1
OUT Y3
1
IN A1
2
OUT Y3
3
IN A2
4
GND
5
OUT Y2
6
IN A3
7
OUT Y1
8
VCC
FUNCTION TABLE
A
Y
L
H
L
H
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. P1
1
Publication Order Number:
NLX3G17/D
NLX3G17
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
-0.5 to +7.0
V
VIN
DC Input Voltage
-0.5 to +7.0
V
DC Output Voltage
-0.5 to +7.0
V
VIN < GND
-50
mA
VOUT < GND
-50
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
-65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V-0 @ 0.125 in
Latchup Performance Above VCC and Below GND at 125 °C (Note 5)
±500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22-A114-A.
3. Tested to EIA/UESD22-A115-A.
4. Tested to JESD22-C101-A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
-55
+125
°C
0
0
0
No Limit
No Limit
No Limit
ns/V
VOUT
TA
Operating Free-Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
NLX3G17
DC ELECTRICAL CHARACTERISTICS
TA = 25 5C
TA = +855C
TA = -555C to
+1255C
VCC
(V)
Min
Typ
Max
Min
Max
Min
Max
Unit
Positive
Threshold
Voltage
1.65
2.3
2.7
3.0
4.5
5.5
0.6
1.0
1.2
1.3
1.9
2.2
1.0
1.5
1.7
1.9
2.7
3.3
1.4
1.8
2.0
2.2
3.1
3.6
0.6
1.0
1.2
1.3
1.9
2.2
1.4
1.8
2.0
2.2
3.1
3.6
0.6
1.0
1.2
1.3
1.9
2.2
1.4
1.8
2.0
2.2
3.1
3.6
V
VT-
Negative
Threshold
Voltage
1.65
2.3
2.7
3.0
4.5
5.5
0.2
0.4
0.5
0.6
1.0
1.2
0.5
0.75
0.87
1.0
1.5
1.9
0.8
1.15
1.4
1.5
2.0
2.3
0.2
0.4
0.5
0.6
1.0
1.2
0.8
1.15
1.4
1.5
2.0
2.3
0.2
0.4
0.5
0.6
1.0
1.2
0.8
1.15
1.4
1.5
2.0
2.3
V
VH
Low-Level
Input
Voltage
1.65
2.3
2.7
3.0
4.5
5.5
0.1
0.25
0.3
0.4
0.6
0.7
0.48
0.75
0.83
0.93
1.2
1.4
0.9
1.1
1.15
1.2
1.5
1.7
0.1
0.25
0.3
0.4
0.6
0.7
0.9
1.1
1.15
1.2
1.5
1.7
0.1
0.25
0.3
0.4
0.6
0.7
0.9
1.1
1.15
1.2
1.5
1.7
V
1.65 - 5.5
VCC 0.1
VCC
VCC 0.1
VCC 0.1
1.65
2.3
2.7
3.0
3.0
4.5
1.29
1.9
2.2
2.4
2.3
3.8
1.52
2.1
2.4
2.7
2.5
4.0
1.29
1.9
2.2
2.4
2.3
3.8
1.29
1.8
2.1
2.3
2.2
3.7
Symbol
Parameter
VT+
VOH
VOL
HighLevel
Output
Voltage
Low-Level
Output
Voltage
Conditions
VIN w VT+MAX
IOH = -100 mA
VIN w VT+MAX
IOH = -4 mA
IOH = -8 mA
IOH = -12 mA
IOH = -16 mA
IOH = -24 mA
IOH = -32 mA
VIN v VT-MIN
IOL = 100 mA
VIN v VT-MIN
IOH = 4 mA
IOH = 8 mA
IOH = 12 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
Input
Leakage
Current
0 v VIN v 5.5 V
IOFF
Power-Off
Output
Leakage
Current
VOUT = 5.5 V
ICC
Quiescent
Supply
Current
0 v VIN v VCC
IIN
V
V
1.65 - 5.5
0
0.1
0.1
0.1
1.65
2.3
2.7
3.0
3.0
4.5
0.08
0.2
0.22
0.28
0.38
0.42
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.4
0.5
0.5
0.55
0.55
0 to 5.5
±0.1
±1.0
±1.0
mA
0
1.0
10
10
mA
5.5
1.0
10
10
mA
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3
NLX3G17
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS)
Symbol
tPLH,
tPHL
Parameter
Propagation
Delay Input A to
Output
VCC
(V)
Test
Condition
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
TA = 25 5C
TA = +855C
TA = -555C to
+1255C
Min
Typ
Max
Min
Max
Min
Max
Unit
RL = 1 MW,
CL = 15 pF
1.8
4.3
7.4
1.8
8.1
1.8
9.1
ns
RL = 1 MW,
CL = 15 pF
1.5
3.3
5.0
1.5
5.5
1.5
6.5
RL = 500 W,
CL = 50 pF
1.8
4.0
5.0
1.8
6.6
1.8
7.6
RL = 1 MW,
CL = 15 pF
1.0
2.7
4.1
1.0
4.5
1.0
5.5
RL = 500 W,
CL = 50 pF
1.2
3.2
4.9
1.2
5.4
1.2
6.4
CIN
Input
Capacitance
5.5
VIN = 0 V or VCC
7.0
pF
CPD
Power
Dissipation
Capacitance
(Note 6)
3.3
5.5
10 MHz
VIN = 0 V or VCC
9.0
11
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
VCC
A or B
50%
GND
tPLH
Y
tPHL
50% VCC
Figure 3. Switching Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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4
RL
NLX3G17
VT, TYPICAL INPUT THRESHOLD
VOLTAGE (V)
4
3
(VT+)
2
VHtyp
(VT-)
1
2
2.5
3
3.5
3.6
VCC, POWER SUPPLY VOLTAGE (V)
VHtyp = (VT + typ) - (VT - typ)
Figure 5. Typical Input Threshold, VT+, VTversus Power Supply Voltage
VH
VCC
VT+
VT-
VIN
VCC
VH
VT+
VT-
VIN
GND
GND
VOH
VOH
VOUT
Vout
VOL
VOL
(a) A Schmitt-Trigger Squares Up Inputs With Slow Rise and Fall Times
(b) A Schmitt-Trigger Offers Maximum Noise Immunity
Figure 6. Typical Schmitt-Trigger Applications
ORDERING INFORMATION
Package
Shipping†
NLX3G17AMX1TCG
ULLGA8, 1.95 x 1.0, 0.5P
(Pb-Free)
3000 / Tape & Reel
NLX3G17BMX1TCG
ULLGA8, 1.6 x 1.0, 0.4P
(Pb-Free)
3000 / Tape & Reel
NLX3G17CMX1TCG
ULLGA8, 1.45 x 1.0, 0.35P
(Pb-Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NLX3G17
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P
CASE 613AA-01
ISSUE A
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
7X
0.48
8X
0.22
e/2
e
1
7X
L
NOTE 4
4
1.18
L1
0.53
8
5
8X
PKG
OUTLINE
b
0.05 C
0.35
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
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6
NLX3G17
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P
CASE 613AB-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
7X
0.49
8X
0.26
e/2
e
1
7X
L
NOTE 4
4
1.24
L1
0.53
8
5
8X
b
0.05 C
0.40
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
PKG
OUTLINE
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
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7
NLX3G17
PACKAGE DIMENSIONS
ULLGA8 1.95x1.0, 0.5P
CASE 613AC-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
8X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
7X
C
A1
0.49
8X
0.30
e/2
e
7X
L
NOTE 4
4
1
1.24
L1
0.53
8
5
8X
BOTTOM VIEW
b
0.10 C A B
0.05 C
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
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8
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NLX3G17/D