ONSEMI NSB9435T1

NSB9435T1
Preferred Device
High Current Bias
Resistor Transistor
PNP Silicon
• Collector –Emitter Sustaining Voltage –
http://onsemi.com
VCEO(sus) = 30 Vdc (Min) @ IC = 10 mAdc
• High DC Current Gain –
POWER BJT
IC = 3.0 AMPERES
BVCEO = 30 VOLTS
VCE(sat) = 0.275 VOLTS
hFE = 125 (Min) @ IC = 0.8 Adc
= 90 (Min) @ IC = 3.0 Adc
• Low Collector –Emitter Saturation Voltage –
•
•
VCE(sat) = 0.275 Vdc (Max) @ IC = 1.2 Adc
= 0.55 Vdc (Max) @ IC = 3.0 Adc
SOT–223 Surface Mount Packaging
ESD Rating – Human Body Model: Class 1B
ESD Rating – Machine Model: Class B
COLLECTOR 2,4
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
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Rating
BASE
1
Symbol
Value
Unit
VCEO
30
Vdc
Collector–Base Voltage
VCB
45
Vdc
Emitter–Base Voltage
VEB
±6.0
Vdc
Base Current – Continuous
IB
1.0
Adc
Collector Current – Continuous
Collector Current – Peak
IC
3.0
5.0
Adc
Total Power Dissipation @ TC = 25C
Derate above 25C
Total PD @ TA = 25C mounted on 1″
sq. (645 sq. mm) Collector pad on
FR–4 bd material
Total PD @ TA = 25C mounted on
0.012″ sq. (7.6 sq. mm) Collector
pad on FR–4 bd material
PD
3.0
24
1.56
Watts
mW/C
Watts
SOT–223
CASE 318E
STYLE 1
0.72
Watts
MARKING DIAGRAM
TJ, Tstg
–55 to
+150
C
9435R
Characteristic
Symbol
Max
Unit
Thermal Resistance – Junction to Case
– Junction to Ambient on 1″ sq.
(645 sq. mm) Collector pad on
FR–4 board material
– Junction to Ambient on 0.012″ sq.
(7.6 sq. mm) Collector pad on FR–4
board material
RθJC
RθJA
42
80
C/W
RθJA
174
Collector–Emitter Voltage
Operating and Storage Junction
Temperature Range
EMITTER 3
4
1
3
THERMAL CHARACTERISTICS
Maximum Lead Temperature for
Soldering Purposes, 1/8″ from
case for 5 seconds
 Semiconductor Components Industries, LLC, 2002
April, 2002 – Rev. 2
TL
C
260
1
2
9435R = Device Code
ORDERING INFORMATION
Device
NSB9435T1
Package
Shipping
SOT–223
1000/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
NSB9435T1/D
NSB9435T1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristics
Symbol
Min
Typ
Max
30
–
–
6.0
–
–
–
–
–
–
20
200
–
–
700
–
–
–
0.155
–
–
0.210
0.275
0.550
–
–
1.25
–
–
1.10
125
110
90
220
–
–
–
–
–
7.5
10
12.5
–
100
150
–
135
–
–
110
–
Unit
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OFF CHARACTERISTICS
Collector–Emitter Sustaining Voltage
(IC = 10 mAdc, IB = 0 Adc)
VCEO(sus)
Emitter–Base Voltage
(IE = 50 Adc, IC = 0 Adc)
VEBO
Collector Cutoff Current
(VCE = 25 Vdc)
(VCE = 25 Vdc, TJ = 125°C)
ICER
Emitter Cutoff Current
(VBE = 5.0 Vdc)
IEBO
Vdc
Vdc
µAdc
Adc
ON CHARACTERISTICS (Note 1)
Collector–Emitter Saturation Voltage
(IC = 0.8 Adc, IB = 20 mAdc)
(IC = 1.2 Adc, IB = 20 mAdc)
(IC = 3.0 Adc, IB = 0.3 Adc)
VCE(sat)
Base–Emitter Saturation Voltage
(IC = 3.0 Adc, IB = 0.3 Adc)
VBE(sat)
Base–Emitter On Voltage
(IC = 1.2 Adc, VCE = 4.0 Vdc)
VBE(on)
DC Current Gain
(IC = 0.8 Adc, VCE = 1.0 Vdc)
(IC = 1.2 Adc, VCE = 1.0 Vdc)
(IC = 3.0 Adc, VCE = 1.0 Vdc)
hFE
Resistor
R1
Vdc
Vdc
Vdc
–
k
DYNAMIC CHARACTERISTICS
Output Capacitance
(VCB = 10 Vdc, IE = 0 Adc, f = 1.0 MHz)
Cob
Input Capacitance
(VEB = 8.0 Vdc)
Cib
Current–Gain – Bandwidth Product (Note 2)
(IC = 500 mA, VCE = 10 V, Ftest = 1.0 MHz)
fT
1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
2. fT = |hFE| ftest
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2
pF
pF
MHz
NSB9435T1
1000
0.25
hFE, DC CURRENT GAIN
VCE(sat), COLLECTOR–EMITTER
SATURATION VOLTAGE (V)
0.3
IC = 3.0 A
0.2
0.15
TA = 150°C
25°C
100
0.1
1.2 A
0.8 A
0.05
0.5 A
0.25 A
0
0.001
0.01
–55°C
VCE = 1.0 V
10
0.1
0.1
1
IB, BASE CURRENT (mA)
10
IC, COLLECTOR CURRENT (A)
Figure 1. Collector Saturation Region
Figure 2. DC Current Gain
1000
10
TA = 150°C
V, VOLTAGE (V)
hFE, DC CURRENT GAIN
1
25°C
100
–55°C
VBE(sat)
1
VCE(sat)
0.1
VCE = 4.0 V
IC/IB = 10
10
0.01
0.1
1
10
1.0E–01
IC, COLLECTOR CURRENT (A)
1.0E+00
1.0E+01
IC, COLLECTOR CURRENT (A)
Figure 3. DC Current Gain
Figure 4. “ON” Voltages
1.0E+00
1.2
VBE(sat)
V, VOLTAGE (V)
V, VOLTAGE (V)
1
VCE(sat)
1.0E–01
–55°C
0.8
25°C
0.6
TA = 155°C
0.4
0.2
IC/IB = 50
1.0E–02
0
1.0E–01
1.0E+00
1.0E+01
0.1
IC, COLLECTOR CURRENT (A)
1
IC, COLLECTOR CURRENT (A)
Figure 5. “ON” Voltages
Figure 6. VBE(on) Voltage
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3
10
NSB9435T1
10
IC, COLLECTOR CURRENT (A)
Cob, OUTPUT CAPACITANCE (pF)
1000
100
10
f = 1 MHz
TA = 25°C
1
100 ms
0.1
0.01
BONDING WIRE LIMIT
THERMAL LIMIT (Single Pulse)
SECONDARY BREAKDOWN LIMIT
0.001
0.1
10
1
100
0.1
10
100
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 7. Output Capacitance
Figure 8. Active Region Safe Operating Area
There are two limitations on the power handling ability of
a transistor: average junction temperature and secondary
breakdown. Safe operating area curves indicate IC – VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 8 is based on TJ(pk) = 150C; TC is
variable depending on conditions. Secondary breakdown
pulse limits are valid for duty cycles to 10% provided TJ(pk)
150C. TJ(pk) may be calculated from the data in
Figure 10. At high case temperatures, thermal limitations
will reduce the power that can be handled to values less than
the limitations imposed by secondary breakdown.
3.0
TC
2.0
1.0
TA
0
25
1.0
VR, REVERSE VOLTAGE (V)
4.0
PD, POWER DISSIPATION (WATTS)
0.5 ms
5.0 ms
1.0
50
75
100
125
150
T, TEMPERATURE (°C)
r(t), EFFECTIVE TRANSIENT THERMAL
RESISTANCE (NORMALIZED)
Figure 9. Power Derating
1.0
D = 0.5
0.1
0.01
0.2
0.1
0.05
0.02
0.01
RθJA(t) = r(t) θJA
θJA = 174°C/W
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TA = P(pk) θJA(t)
SINGLE PULSE
0.001
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
0.0001
0.0001
0.001
0.01
1.0
0.1
t, TIME (seconds)
Figure 10. Thermal Response
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4
10
100
1000
NSB9435T1
PACKAGE DIMENSIONS
SOT–223 (TO–261)
PLASTIC PACKAGE
CASE 318E–04
ISSUE K
A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
S
1
2
3
B
D
L
G
J
C
0.08 (0003)
H
M
K
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5
INCHES
DIM MIN
MAX
A
0.249
0.263
B
0.130
0.145
C
0.060
0.068
D
0.024
0.035
F
0.115
0.126
G
0.087
0.094
H 0.0008 0.0040
J
0.009
0.014
K
0.060
0.078
L
0.033
0.041
M
0
10 S
0.264
0.287
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
MILLIMETERS
MIN
MAX
6.30
6.70
3.30
3.70
1.50
1.75
0.60
0.89
2.90
3.20
2.20
2.40
0.020
0.100
0.24
0.35
1.50
2.00
0.85
1.05
0
10 6.70
7.30
NSB9435T1
Notes
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6
NSB9435T1
Notes
http://onsemi.com
7
NSB9435T1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
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8
NSB9435T1/D