MICROCHIP TC3401

TC3401
16-Bit Low Cost, Low Power Sigma-Delta A/D Converter
Package Type
Features
• 16-bit Resolution at Eight Conversions Per
Second, Adjustable Down to 10-bit Resolution at
512 Conversions Per Second
• 1.8V – 5.5V Operation, Low Power Operating
300µA; Sleep: 50µA
• microPort™ Serial Bus Requires only two
Interface Lines
• Uses Internal or External Reference
• Automatically Enters Sleep Mode when not in use
• True Differential Inputs with Built-In Multiplexer
Provide Ratiometric Conversions
• Early Warning Power Fail Detector, also suitable as
Wake-Up Timer Operational in Shutdown Mode
• VDD Monitor and Reset Generator Operational in
Shutdown Mode
16-Pin PDIP
16-Pin QSOP
IN1+
1
16
VDD
IN1-
2
15
SCLK
IN2+
3
14
ADDR
IN2-
4
13
RESET
PFI
5
12
ENABLE
VTH
6
11
PFO
REFIN
7
10
SDAT
GND
8
9
REFOUT
TC3401
Applications
• Consumer Electronics, Thermostats, CO
Monitors, Humidity Meters, Security Sensors
• Embedded Systems, Data Loggers,
Portable Equipment
• Medical Instruments
Device Selection Table
Part
Number
Package
Temperature
Range
TC3401VPE
16-Pin PDIP (Narrow)
0°C to +85°C
TC3401VQR 16-Pin QSOP Narrow)
0°C to +85°C
General Description
The TC3401 is a low cost, low power analog-to-digital
converter based on Microchip’s Sigma-Delta technology. It will perform 16-bit conversions (15-bit plus sign)
at up to eight per second. The TC3401 is optimized for
use as a microcontroller peripheral in low cost, battery
operated systems. A voltage reference is included, or
an external reference can be used. A VDD monitor with
a reset generator provides Power-on Reset and Brownout protection while an extra threshold detector is suitable for use as an early warning Power Fail detector, or
as a Wake-up Timer.
The TC3401’s 2-wire microPort™ digital interface is
used for starting conversions and for reading out the
data. Driving the SCLK line low starts a conversion.
After the conversion starts, each additional falling edge
(up to six) detected on SCLK for t4 seconds reduces
the A/D resolution by one bit and cuts conversion time
in half. After a conversion is completed, clocking the
SCLK line puts the MSB through LSB of the resulting
data word onto the SDAT line, much like a shift register.
The part automatically sleeps when not performing a
data conversion.
The TC3401 is available in a 16-Pin PDIP and a 16-Pin
QSOP package.
 2002 Microchip Technology Inc.
DS21410B-page 1
TC3401
Typical Application
VBATT
VDD
+
Input 1
–
IN1+
IN1-
+
–
IN2+
IN2-
Input 2
VBATT R1
130k
TC3401
VBATT
RESET
R2
110k
REFIN
REFOUT
R3
390
±10%
I/01
I/02
I/03
µ
Controller
R6
100k
VTH
C1
0.1µF
VCC
ENABLE
SDAT
SCLK
ADDR
RST
VBATT
R7
100k
I/04
I/05
PFO
PFI
VBATT
C2
10µF
R4
1MΩ
Functional Block Diagram
VDD
REFOUT
1.193V
TC3401
x2
–
IN2+
+
IN2-
–
SET
D Q
ADDR
CLR
VTH
–
+
Start
Conv.
Data
Shift
Reg.
Σ–∆
Modulator
1 of 2
AMux
Clock
Generator
and Control
Circuitry
Reset Delay
Timer
SDAT
CLKOUT
IN1-
CONVCLK
+
CONV done
IN1+
REFIN
SCLK
ENABLE
RESET
1.23V
PFI
PFO
–
+
1.23V
GND
DS21410B-page 2
 2002 Microchip Technology Inc.
TC3401
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ..................................................... 6.0V
Voltage on Pins:
PFO, RESET .......................... (GND – 0.3V) to 5.5V
Input Voltage (All Other Pins):
.................................. (GND – 0.3V) to (VDD + 0.3V)
Operating Temperature Range ................. 0°C to 85°C
Storage Temperature ........................ -65°C to +150°C
TC3401 DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for
temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz.
Symbol
Parameter
Min
Typ
Max
Unit
1.8
—
5.5
V
µA
µA
µA
Test Conditions
Power Supply
VDD
Supply Voltage
IDD
Supply Current, During Data Conversion
—
300
—
IDD SLEEP
Supply Current, Sleep Mode
—
50
80
—
50
130
TA = +25°C
Accuracy (Differential Inputs)
RES
Resolution
—
16
—
Bits
INL
Integral Non-Linearity
—
.0038
—
%FSR
VDD = 2.7V
VOS
Offset Error
—
—
±0.9
%FSR
IN+, IN- = 0V
VNOISE
Referred to input
—
60
—
µVrms
CMR
Common Mode Rejection
—
75
—
dB
FSE
Full Scale Error
—
0.4%
—
%FS
PSRR
Power Supply Rejection Ratio
—
75
—
dB
VDD = 2.5V to 3.5V
Note 1
At DC
IN+, INVIN ±
Differential Input Voltage
Absolute Voltage Range on IN+, IN-
—
—
VDD
V
GND
—
VDD
V
Input Bias Current
—
1
100
nA
CIN
Input Sampling Capacitance
—
2
—
pF
RIN
Differential Input Resistance
—
2.0
—
MΩ
Note 2
REFIN, REFOUT
VREF
REFIN Voltage Range
0
—
1.25
V
IREF
REFIN Input Current
—
1
—
µA
VREFOUT
REFOUT Voltage
—
1.193
—
V
REFSINK
REFOUT Current Sink Capability
—
10
—
µA
REFSRC
REFOUT Current Source Capability
300
—
—
µA
Note 1: Differential input voltage defined as (VIN+ – VIN -).
2: Resistance from INn+ to INn- or INn to GND.
3: @ VDD = 1.8V, ISOURCE ≤ 200µA.
 2002 Microchip Technology Inc.
DS21410B-page 3
TC3401
TC3401 DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for
temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz.
Symbol
Parameter
Min
Typ
Max
Unit
V
Test Conditions
SCLK, ADDR, ENABLE
VIL
Input Low Voltage
—
—
0.3 x VDD
VIH
Input High Voltage
0.7 x VDD
—
—
V
ILEAK
Leakage Current
—
1
—
µA
SDAT, RESET, PFO
VOL
Output Low Voltage
VOH
Output High Voltage (SDAT)
VDD MIN
Minimum VDD for PFO, RESET Valid
—
—
0.4
V
IOL = 1.5mA
0.9 x VDD
—
—
V
ISOURCE = 400µA (Note 3)
—
1.1
1.3
µA
VTH , PFI
VCCPFI
PFI Input Voltage Range
0
—
VDD
V
-0.1
.01
0.1
µA
Threshold (VTH, PFI)
—
1.23
—
V
Threshold Hysteresis
—
30
—
mV
Threshold Tempco
—
30
—
ppm/°C
V TH, PFI Input Current
VTHR
Note 1: Differential input voltage defined as (VIN+ – VIN -).
2: Resistance from INn+ to INn- or INn to GND.
3: @ VDD = 1.8V, ISOURCE ≤ 200µA.
TC3401 AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for
temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz.
Parameter
Min
Typ
Max
Unit
t1
Symbol
Resolution Reduction Clock Width
1
—
—
µsec
Width of SCLK (Negative)
t2
Resolution Reduction Clock Width
1
—
—
µsec
Width of SCLK (Positive)
t3
Conversion Time (15-bit Plus Sign)
—
125
—
msec
16-bit Conversion, TA = 25°C (Note 1)
Conversion Time (14-bit Plus Sign)
—
t3/2.0
—
msec
15-bit Conversion
Conversion Time (13-bit Plus Sign)
—
t3/4.0
—
msec
14-bit Conversion
Conversion Time (12-bit Plus Sign)
—
t3/7.8
—
msec
13-bit Conversion
Conversion Time (11-bit Plus Sign)
—
t3/15.1
—
msec
12-bit Conversion
Conversion Time (10-bit Plus Sign)
—
t3/28.6
—
msec
11-bit Conversion
Conversion Time (9-bit Plus Sign)
—
t3/51.4
—
msec
10-bit Conversion
Width of SCLK
t4
Resolution Reduction Window
t5
SCLK to Data Valid
t6
Test Conditions
—
t3/85.7
—
msec
1000
—
—
nsec
SCLK Falling Edge to SDAT Valid
Address Setup
0
—
—
nsec
Address Valid to SCLK
t7
Address Hold
1000
—
—
nsec
SCLK to Address Valid Hold
t8
Acknowledge Delay
—
—
1000
nsec
SCLK to SDAT Delay
t9
RESET Active Time-out Period
—
t3*2
—
msec
Delay from POR or Brown-out
Recovery to RESET = VOH
t10
PFO Delay
—
25
—
µsec
PFI to PFO Delay
t11
RESET Delay
5
—
64
µsec
Delay VTH Falling at 10V/msec to
RESET Low
Note 1: Nominal temperature drift is -2830ppm/C° for temperature less than 25°C and -1340ppm/°C for temperatures
greater than 25°C.
DS21410B-page 4
 2002 Microchip Technology Inc.
TC3401
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(16-Pin PDIP)
(16-Pin QSOP)
Symbol
1
IN1+
Analog Input. This is the positive terminal of a true differential input consisting of IN1+ and IN1-.
VIN1 = (IN1+ – IN-). See Section 1.0, Electrical Characteristics.
2
IN1-
Analog Input. This is the negative terminal of a true differential input consisting of IN1+ and IN1-.
VIN1 = (IN+ – IN-) IN1- can swing to, but not below, ground. See Section 1.0, Electrical Characteristics.
3
IN2+
Analog Input. This is the positive terminal of a true differential input consisting of IN2+ and IN2-.
VIN2 = (IN2+ – IN-). See Section 1.0, Electrical Characteristics.
4
IN2-
Analog Input. This is the negative terminal of a true differential input consisting of IN2+ and IN2-.
VIN2 = (IN+ – IN-) IN2- can swing to, but not below, ground. See Section 1.0, Electrical Characteristics.
5
PFI
Analog Input. This is the positive input to an internal comparator used as a threshold detector
The negative input is tied to an internal reference.
6
VTH
Analog Input. This is the positive input to the internal comparator used to monitor the voltage supply.
The negative input is tied to an internal reference. When VTH falls below the internal reference, the
reset generator drives RESET low. See Section 1.0, Electrical Characteristics.
7
REFIN
Analog Input. The converter’s reference voltage is the differential between this pin and ground times
two. It may be tied directly to REFOUT or scaled using a resistor divider. Any user supplied
reference voltage less than 1.25 may be used in place of REFOUT.
8
GND
Ground Terminal.
9
REFOUT
10
SDAT
Digital Output (push-pull). This is the microPort™ serial data output. SDAT is driven low while the
TC3401 is converting data, effectively providing a “busy” signal. After the conversion is complete,
every high to low transition on the SCLK pin puts a bit from the resulting data word on the SDAT pin
(from MSB to LSB).
11
PFO
Digital Output (open drain). This is the output of the internal threshold detector. When PFI is less
than the internal reference, PFO is driven low.
12
ENABLE
Digital Input. When this input control is pulled low, the part is internally restarted. That is, any data
conversion or data read sequence is cleared and the part goes into Sleep mode. When ENABLE
returns high, the part resumes normal operation.
13
RESET
Digital Output (open drain). This is the output of the VDD monitor reset generator. RESET is driven low
when a Power-on Reset or Brown-out condition is detected. See Section 1.0, AC Electrical Characteristics.
14
ADDR
Digital Input. This input controls the analog input multiplexer to select one of two input channels.
This address is latched at the falling edge of the SCLK, which starts an A/Dconversion.
(0 = Input 1, 1 = Input 2).
15
SCLK
Digital Input. This is the microPort™ serial clock input. The TC3401 comes out of Sleep mode and a
conversion cycle begins when this pin is driven low. After the conversion starts, each additional
falling edge (up to six) detected on SCLK for t4 seconds reduces the A/D resolution by one bit. When
the conversion is complete, the data word can be shifted out on the SDAT pin by clocking the SCLK
pin.
16
VDD
Description
Analog Output. The internal reference connects to this pin. It may be scaled externally and tied to
the REFIN input to provide the converter’s reference voltage. Care must be taken in connecting
external circuitry to this pin. This pin is in a high impedance state during Sleep mode.
Power Supply Input.
 2002 Microchip Technology Inc.
DS21410B-page 5
TC3401
3.0
DETAILED DESCRIPTION
The TC3401 has a 16-bit sigma-delta A/D converter. It
has two differential inputs, an analog multiplexer, a VDD
monitor with reset generator and an early warning
Power Fail detector. See the Typical Application circuit
and the Functional Block diagram. The key
components of the TC3401 are described below.
Also refer to Figure 3-5, A/D Operational Flowchart and
the Timing Diagrams, Figure 3-1, Figure 3-2 and
Figure 3-3.
3.1
A/D Converter Operation
When the TC3401 is not converting, it is in Sleep mode
with both the SCLK and SDAT lines high. An A/D
conversion is initiated by a high to low transition on the
SCLK line at which time the internal clock of the
TC3401 is started and the address value (ADDR) is
internally latched. The address value steers the analog
multiplexer to select the input channel to be converted.
Each additional high to low transition of SCLK (following the initial SCLK falling edge) during the time interval
t4, will decrement the conversion resolution by one bit
and reduce the conversion time by one half. The time
interval t4 is referred to as the resolution reduction
window. The minimum conversion resolution is 10-bits
so any more than 6 SCLK transitions during t4 will be
ignored.
After each high to low transition of SCLK, in the t4
interval, the SDAT output is driven high by the TC3401
to acknowledge that the resolution has been decremented. When the SCLK returns high or the t4 interval
ends, the SDAT line returns low (see Figure 3-2). When
the conversion is complete SDAT is driven high. The
TC3401 now enters Sleep mode and the conversion
value can be read as a serial data word on the SDAT
line.
3.2
TABLE 3-1:
DATA CONVERSION WORD
VS. VOLTAGE INPUT
(REFIN = 1.193V)
Data Word
INn+ – INn- (Volts)
0111 1111 1111 1111
2.38596 (Positive Full Scale)
0000 0000 0000 0001
72.8 E -6
0000 0000 0000 0000
0
1111 1111 1111 1111
-72.8 E -6
1000 0000 0000 0001
-2.38596 (Negative Full Scale)
1000 0000 0000 0000
Reserved Code
The SCLK input has a filter which rejects any positive
or negative pulse of width less than 50nsec to reduce
noise. The rejection width of this pulse can vary
between 50nsec and 750nsec depending on processing parameters and supply voltage.
Figure 3-1 and Table 3-2 show information for determining the mode of operation for the TC3401 part by
recording the value of SDAT for SCLK in a high, then
low, then high state. For example, if SCLK goes
through a 1-0-1 transition and the corresponding
values of SDAT are 1-1-0, then the SCLK falling edge
started a new data conversion. A 0-1-0 for SDAT would
have indicated a resolution reduction had occurred.
This is useful if the microcontroller has a Watchdog
Reset or otherwise loses track of where the TC3401 is
in the conversion and data readout sequence. The
microcontroller can simply transition SCLK until it
“finds” a Start Conversion condition.
FIGURE 3-1:
SCLK, SDAT LOGIC
STATE DIAGRAM
SCLK
Reading the Data Word
After the conversion is complete and SDAT goes high,
the conversion value can be clocked serially onto the
SDAT line by high to low transitions of the SCLK. The
data word is in two’s compliment format with the sign bit
clocked onto the SDAT line, first followed by the MSB
and ending in the LSB. For a 16-bit conversion the data
word would consist of a sign bit followed by 15 magnitude bits, Table 3-1 shows the data word versus input
voltage for a 16-bit conversion. Note that the full scale
input voltage range is ±(2 REFIN – 1LSB). When
REFOUT is fed back directly to REFIN, an LSB is 73µV
for a 16-bit conversion, as REFOUT is typically 1.193V.
Figure 3-4 shows typical SCLK and SDAT waveforms
for 16, 12 and 10-bit conversions. Note that any complete convert and read cycle requires 17 negative edge
clock pulses. The first is the convert command. Then,
up to six of these can occur in the resolution reduction
window, t4, to decrement resolution. The remaining
pulses clock out the conversion data word.
DS21410B-page 6
SDAT
B
A
TABLE 3-2:
C
SCLK, SDAT LOGIC STATE
A
B
C
Status
1
1
0
Start Conversion
0
1
0
Resolution Reduction
x
1
1
Data Transfer
x
0
0
Data Transfer or Busy*
*Note: The code X00 has a dual meaning: Data Transfer or
Busy converting. To avoid confusion, the user should
send only the required number of pulses for the
desired resolution, then wait for SDAT to rise to 1,
indicating conversion is complete before clocking
SCLK again to read out data bits.
 2002 Microchip Technology Inc.
TC3401
FIGURE 3-2:
CONVERSION AND DATA OUTPUT TIMING
t2
t1
SCLK
t4
t8
t8
t5
Sleep
Mode
SDAT
DN
(MSB)
DN-1
DN-1
D0
(LSB)
t3
Data Conversion
Complete
t6 t7
ADDR
Start Conversion and Resolution Control Timing
RESET AND POWER FAIL TIMING
VDD
Volts
FIGURE 3-3:
Data Output Timing
1.80
VTH
1.23
1.20
Hysteresis
1.1
Time
0
t9
t11
t11
t9
RESET
VDD Reset Generator Timing
Volts
VDD
PFI
1.23
1.20
Hysteresis
1.1
Time
0
t10
t10
t10
t10
PFO
Power Fail Comparator Timing
 2002 Microchip Technology Inc.
DS21410B-page 7
TC3401
FIGURE 3-4:
SCLK AND SDAT WAVEFORMS FOR 16, 12 AND 10-BIT CONVERSIONS
16-bit Data Conversion,
Data Word A5A5h
SCLK
t3a
SDAT
Data Conversion
Complete
16-bit Data Conversion, Long Start Pulse,
Data Word 5A5Ah
SCLK
> t3a
SDAT
Data Conversion
Complete
12-bit Conversion,
Data Word = AB3h
SCLK
< t4
SDAT
t3e
Data Conversion
Complete
10-bit Conversion with "Extra"
Data Reduction Clocks, Data Word = 3A4h
SCLK
< t4
t3g
SDAT
Data Conversion
Complete
DS21410B-page 8
 2002 Microchip Technology Inc.
TC3401
FIGURE 3-5:
A/D OPERATIONAL FLOWCHART
SDAT = Low
POR
CONVCLK = 2m?
(Conversion Done?)
Sleep
SDAT = High
No
Yes
No
SCLK
Hgh to Low?
Power Down Analog,
Conversion Complete,
SDAT = High
Yes
Power Up Analog,
Start CONVCLK (= 0),
Start Conversion,
Resolution = 2m
(m = 16), Latch Input
Channel Address (if applicable).
SCLK
Low to High
transition?
SCLK
High to Low?
No
Yes
No
SDAT = Dm;
m=m–1
Yes
SDAT = Low
m ≥ 0?
CONVCLK
< 29?
Yes
No
No
Yes
SDAT = High
Internal Reset
No
SCLK
High to Low?
Yes
No
Sleep
A/D
Resolution
> 210?
Yes
Reduce A/D
Resolution by 1-bit
(m = m – 1);
SDAT = High
 2002 Microchip Technology Inc.
DS21410B-page 9
TC3401
3.3
VDD Monitor
The TC3401 RESET output is in high impedance
provided the voltage at V TH is greater than the internal
voltage reference. This reference is approximately the
same value as the voltage appearing at REFOUT. When
VTH is less than the internal reference, RESET is pulled
low. When VTH rises above the internal reference
voltage again, RESET is held low for the reset active
time-out period, t9, before being released. The RESET
output is ensured to be valid for VDD = 1.3V to 5.5V.
When used to generate a Power-on or Brown-out
Reset, an external resistor network is required to divide
the appropriate V DD threshold down to 1.23V at the
VTH input, (See the Typical Application circuit). For
example, to generate a POR for a VDD at 3V -10%, the
values of R1 and R2 should be 137kΩ and 115kΩ
respectively.
Since RESET is an open drain, it can be wired-OR’ed
with another open drain or external switch if desired.
DS21410B-page 10
3.4
Power Fail Detector
The Power Fail detector is a comparator in which the
inverting input is connected to the internal voltage
reference. The non-inverting input is the PFI pin of the
TC3401 and the PFO pin is the active low, open drain
output. This comparator is suitable as an early warning
fail or low battery indicator. In a typical application,
where a voltage regulator is being used to supply
power to a system, the Power Fail comparator would
monitor the input voltage to the regulator while the VDD
monitor would measure the output voltage of the
regulator. Both PFO and RESET would drive interrupt
pins of a microcontroller.
The Power Fail detector may be used as a Wake-up or
Watchdog Timer. The Typical Application circuit shows
an RC network on PFI with the capacitor tied to a
tristated µC I/O pin. If R4 is 1 MΩ and C2 is 10µF, the
time constant is roughly ten seconds. The µC resets
the RC network by driving the I/O tied to PFI low and
then tristating it. The RC network will ramp to 1.23V in
roughly 9 seconds, assuming a VBATT of 3.0V. With
PFO tied to a µC input or interrupt, the µC will see a low
to high transition on PFO when the voltage on PFI
exceeds 1.23V. The PFO output is specified to be valid
for V DD = 1.3 to 5.5V.
 2002 Microchip Technology Inc.
TC3401
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
Package marking data not available at this time.
4.2
Taping Forms
Component Taping Orientation for 16-Pin QSOP (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Reel Size, Number of Components Per Reel and Reel Size
Package
16-Pin QSOP (N)
 2002 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
DS21410B-page 11
TC3401
4.3
Package Dimensions
16-Pin PDIP (Narrow)
PIN 1
.270 (6.86)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.770 (19.56)
.740 (18.80)
.310 (7.87)
.290 (7.37)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.014 (0.36)
.008 (0.20)
10° MAX.
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.070 (1.78)
.045 (1.14)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
16-Pin QSOP (Narrow)
PIN 1
.157 (3.99)
.150 (3.81) .244 (6.20)
.228 (5.80)
.196 (4.98)
.189 (4.80)
.010 (0.25)
.004 (0.10)
.069 (1.75)
.053 (1.35)
.025
(0.635)
TYP.
.012 (0.31)
.008 (0.21)
8°
MAX.
.010 (0.25)
.007 (0.19)
.050 (1.27)
.016 (0.41)
Dimensions: inches (mm)
DS21410B-page 12
 2002 Microchip Technology Inc.
TC3401
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
© 2002 Microchip Technology Inc.
DS21410B-page 13
TC3401
NOTES:
DS21410B-page 14
© 2002 Microchip Technology Inc.
TC3401
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro ® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21410B-page 15
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Japan
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Rocky Mountain
China - Beijing
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
San Jose
China - Hong Kong SAR
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
New York
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
05/01/02
*DS21410B*
DS21410B-page 16
 2002 Microchip Technology Inc.