ETC 5962-8762002XC

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Remove vendor CAGE 13919. Add device type 02. Add vendors
CAGE 31757 and 60024. Change to reflect MIL-H-38534 processing.
Editorial changes throughout.
91-09-13
Tim H. Noh
B
Table I, device type 01, correct output voltage peak and output
current peak tests.
00-01-11
Ray Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
REV
B
B
B
B
B
B
B
B
B
B
B
B
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
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11
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PMIC N/A
PREPARED BY
Gary Zahn
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
COLUMBUS, OHIO 43216-5000
CHECKED BY
Steve Duncan
APPROVED BY
Tim H. Noh
MICROCIRCUIT, HYBRID, LINEAR, HIGH
POWER OPERATIONAL AMPLIFIER
DRAWING APPROVAL DATE
87-09-16
REVISION LEVEL
B
SIZE
CAGE CODE
A
67268
SHEET
1 OF
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-87620
12
5962-E099-00
1. SCOPE
1.1 Scope. This drawing documents one product assurance class, class H (high reliability) and a choice of case outlines and
lead finishes are available and are reflected in the Part or Identifying Number (PIN).
1.2 PIN. The PIN shall be as shown in the following example:
5962-87620
01
X
Drawing number
Device type
(see 1.2.1)
~
~
~
X
~
~
~
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
01
02
42106, PA51M/883
42106-1, PA51M/883
High power operational amplifier
High power operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
See figure 1
See figure 1
Terminals
Package style
8
8
Flange mount
Flange mount
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings.
40 V dc maximum
VCC - 3 V
VCC
Supply voltage range ..................................................................
Differential input voltage .............................................................
Common mode input ..................................................................
Maximum power dissipation (PD):
Device type 01 ........................................................................
Device type 02 ........................................................................
Thermal resistance, junction-to-case (TJC):
Device type 01 ........................................................................
Device type 02 ........................................................................
Junction temperature (TJ)...........................................................
Lead temperature (soldering, 10 seconds) .................................
Storage temperature range.........................................................
80 W
97 W
1/
2/
2.2qC/W
1.8qC/W
+200qC
+300qC
-65qC to +150qC
1.4 Recommended operating conditions.
Supply voltage (VCC) ...............................................................
Operating temperature range:
Device type 01 (TA).................................................................
Device type 02 (TC) ................................................................
34 V dc
-55qC to +125qC
-55qC to +125qC
1/ At ambient temperature of +25 qC, derate at 2.2qC/W above ambient temperature of +25qC.
2/ At case temperature of +25qC, derate at 1.8qC/W above case temperature of +25qC.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with
MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the
device manufacturer's Quality Management (QM) plan or as designated for applicable device class. Therefore, the tests and
inspections herein may not be performed for applicable device class (see MIL-PRF-38534). Furthermore, the manufacturers
may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the
performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and on figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
3
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked as listed in MIL-HDBK103 and QML-38534.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
(2)
TA = +125(C minimum for device type 01 and TC = +125(C, minimum for device type 02.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55qC < TA < +125qC
Group A
subgroups
Limits
Device
type
VCC = 34 V dc
Min
Unit
Max
unless otherwise specified
Input offset voltage
VIO
TA = +25qC
Input offset voltage drift
DVIO
TA = -55qC and +125qC
Input bias current
IIB
1
01
-5
+5
2, 3
01
-40
+40
PV/qC
1
01
-20
+20
nA
-35
+35
-3
+3
-7
+7
-100
+100
2, 3
-200
+200
1
-100
+100
2, 3
-200
+200
2, 3
Input offset current
IIO
1
01
2, 3
Power supply rejection ratio
+PSRR
-PSRR
Common mode rejection
ratio
CMRR
-VCC = -34 V dc,
+VCC = +10 V to +40 V dc
1
+VCC = +34 V dc,
-VCC = -10 V to -40 V dc
VCM = 22 V, f = dc
01
1
01
2, 3
Supply current
ICC
VCM = 0 V, no load
Condition
Output voltage peak
VOP
01
IO = 10 A peak
4
01
IO = 10 A peak
4
5, 6
RL = 10 k:
5, 6
RL = 2.6 :, TA = +25qC
Voltage gain
AVS
RL = 10 k:
Slew rate
SR
RL = 6.5 :, TA = +25qC
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
PV/V
80
dB
-10
+10
mA
-26
V
26
RL = 10 k:
IOP
nA
76
1, 2, 3
Output current peak
mV
-30
30
4
01
10
A
4, 5, 6
01
94
dB
4
01
1.35
V/Ps
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
5
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
-55qC < TC < +125qC
Group A
subgroups
Limits
Device
type
VCC = 34 V dc
Min
Unit
Max
unless otherwise specified
Supply current
Input offset voltage
IS
VOS
VIN = 0 V dc, G = 100,
VIN = 0 V dc, G = 100,
RCL = 0.1 :,
VCC = 10 V dc
RCL = 0.1 :,
VCC = 34 V dc
VIN = 0 V dc, G = 100,
RCL = 0.1 :,
VCC = 40 V dc
Input bias current (-IN)
Input offset current
Output voltage
+IS
-IS
IOS
VO
2/
2/
VIN = 0 V dc,
RBIAS < 100 M:
02
-16.0
+16.0
2
-22.5
+22.5
3
-21.2
+21.2
1
-10.0
+10.0
2
-16.5
+16.5
3
-15.2
+15.2
1
-11.2
+11.2
2
-17.7
+17.7
3
-16.7
+16.7
1
VIN = 0 V dc,
RBIAS < 100 M:
40.0
02
2, 3
10.0
02
2, 3
4, 5, 6
VCC = 34 V dc,
4, 5, 6
24
VCC = 18 V dc, IO = 10 A,
4, 6
10
VCC = 16 V dc, IO = 8 A,
RL = 1 :, TC = +125qC
5
8
RL = 1 :, TC = +25qC
4
nA
30.0
VCC = 40 V dc,
VCC = 16 V dc, RCL = 0.1 :,
nA
80.0
1
IO = 68 mA, RL = 500 :
nA
80.0
1
VIN = 0 V dc,
RBIAS < 100 M:
mV
40.0
02
2, 3
RL = 1 :, TC = +25qC and -55qC
ICL
13
1
2/
mA
10
2
IO = 4 A, RL = 6 :
Current limits
02
1, 3
RCL = 0.1 :, VCM = 0 V dc
VIN = 0 V dc, G = 100,
Input bias current (+IN)
2/
02
02
34
5.0
V
7.9
A
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
-55qC < TC < +125qC
Group A
subgroups
Limits
Device
type
VCC = 34 V dc
Min
Unit
Max
unless otherwise specified
Current limits
ICL
2/
VCC = 16 V dc,
RCL = 0.1 :, RL = 1 :,
4
02
4, 5, 6
02
5.0
7.9
A
1.0
mV
TC = +25qC
Stability/noise
EN
VCC = 34 V dc,
CL = 1.5 nF, G = 1
V/Ps
Slew rate
SR
VCC = 34 V dc,
4, 5, 6
02
Open loop gain
AOL
VCC = 34 V dc,
4, 5, 6
02
91
dB
Common mode rejection
CMR
VCC = 15 V dc,
VCM = 9 V dc, +f = dc
4, 5, 6
02
70
dB
1/
2/
VIN > 4 Vp-p, RL = 500 :
VIN > 4 Vp-p, RL = 500 :,
f = 15 Hz
1.0
10
During all group A testing, terminal connection F. O. (pin 7) is left open.
A current limiting resistor (RCL) is connected between CL+ to the output and CL- to the output during these tests.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
7
Case outline X.
Inches
Symbol
Millimeters
Min
Max
Min
Max
A
1.510
1.550
38.35
39.37
B
0.745
0.770
18.92
19.56
C
0.260
0.300
6.60
7.62
D
0.038
0.042
0.97
1.07
E
0.080
0.105
2.03
2.67
F
40q BSC
40q BSC
G
0.500 BSC
12.7 BSC
H
1.186 BSC
30.12 BSC
J
0.593 BSC
15.06 BSC
K
0.400
0.500
10.16
12.70
Q
0.151
0.161
3.84
4.09
R
0.980 1.020 24.89 25.91
NOTES:
1. Leads in true position within 0.010 inch (0.25 mm) R at MMC at seating plane.
2. The U. S. preferred system of measurement is the metric SI. This case outline was originally designed using inchpound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound shall
take precedence.
3. Pin numbers are for reference and may not be marked on package.
FIGURE 1. Case outline(s).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
8
Case outline Y.
Symbol
Inches
Millimeters
Min
Max
Min
Max
A
1.510
1.550
38.35
39.37
B
0.745
0.770
18.92
19.56
C
0.225
0.250
5.71
6.35
D
0.038
0.042
0.97
1.07
E
0.080
0.105
2.03
2.67
F
40q BSC
G
0.500 BSC
40q BSC
12.7 BSC
H
1.186 BSC
30.12 BSC
J
0.593 BSC
15.06 BSC
K
0.400
0.500
10.16
12.70
Q
0.151
0.161
3.84
4.09
R
0.980
1.020
24.89
25.91
NOTES:
1. Leads in true position within 0.010 inch (0.25 mm) R at MMC at seating plane.
2. The U. S. preferred system of measurement is the metric SI. This case outline was originally designed using inchpound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound shall
take precedence.
3. Pin numbers are for reference and may not be marked on package.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
9
Device type
01and 02
Case outline
X and Y
Terminal number
Terminal symbol
1
Output
2
+Current limit (CL+)
3
+VCC
4
+IN
5
-IN
6
-VCC
7
8
No connection
-Current limit (CL-)
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
10
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group
A test table)
Interim electrical parameters
1
Final electrical parameters
1*, 2, 3, 4, 5, 6
Group A test requirements
1, 2, 3, 4, 5, 6
Group C end-point electrical
parameters
1
* PDA applies to subgroup 1.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 7, 8, 9, 10, and 11 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1005 of MIL-STD-883.
(2)
TA = +125(C minimum for device type 01 and TC = +125(C, minimum for device type 02.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
11
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692,
Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, P. O. Box 3990, Columbus, Ohio 43216-5000,
or telephone (614) 692-0512.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-87620
A
REVISION LEVEL
B
SHEET
12
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 00-01-11
Approved sources of supply for SMD 5962-87620 are listed below for immediate acquisition only and shall be added
to MIL-HDBK-103 and QML-38534 during the next revision. MIL-HDBK-103 and QML-38534 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated
revision of MIL-HDBK-103 and QML-38534.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8762001XA
5962-8762001XC
5962-8762001YA
31757
31757
60024
42106
42106
PA51M/883
5962-8762002XA
5962-8762002XC
5962-8762002YA
31757
31757
60024
42106-1
42106-1
PA51M/883
1/ The lead finish shown for each PIN, representing a hermetic package, is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine
availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
31757
Micropac Industries, Incorporated
905 E. Walnut Street
Garland, TX 75040
Point of contact: 912 E. Walnut Street
Garland, TX 75040
60024
Apex Microtechnology Corporation
5980 N. Shannon Road
Tucson, AZ 85741
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.