PHILIPS 74ALVC374PW

INTEGRATED CIRCUITS
DATA SHEET
74ALVC374
Octal D-type flip-flop; positive
edge-trigger; 3-state
Product specification
File under Integrated Circuits, IC24
2002 Feb 26
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
FEATURES
DESCRIPTION
• Wide supply voltage range from 1.65 to 3.6 V
The 74ALVC374 is a high-performance, low-power,
low-voltage, Si-gate CMOS device and superior to most
advanced CMOS compatible TTL families.
• Complies with JEDEC standard:
JESD8-7 (1.65 to 1.95 V)
JESD8-5 (2.3 to 2.7 V)
JESD8B/JESD36 (2.7 to 3.6 V).
The 74ALVC374 is an octal D-type flip-flop featuring
separate D-type inputs for each flip-flop and 3-state
outputs for bus oriented applications. A clock (CP) input
and an output enable (OE) input are common to all
flip-flops.
• 3.6 V tolerant inputs/outputs
• CMOS LOW power consumption
• Direct interface with TTL levels (2.7 to 3.6 V)
The eight flip-flops will store the state of their individual
D-inputs that meet the set-up and hold times requirements
on the LOW-to-HIGH CP transition.
• Power-down mode
• Latch-up performance exceeds ≤250 mA
• ESD protection:
2000 V Human Body Model (JESD22-A 114-A)
200 V Machine Model (JESD22-A 115-A).
When OE is LOW, the contents of the eight flip-flops is
available at the outputs. When OE is HIGH, the outputs go
to the high-impedance OFF-state. Operation of the
OE input does not affect the state of the flip-flops.
The ‘374’ is functionally identical to the ‘574’, but the ‘574’
has a different pin arrangement.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C.
SYMBOL
tPHL/tPLH
PARAMETER
propagation delay CP to Qn
CI
input capacitance
CPD
power dissipation capacitance per buffer
CONDITIONS
UNIT
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ
3.1
ns
VCC = 2.5 V; CL = 30 pF; RL = 500 Ω
2.3
ns
VCC = 2.7 V; CL = 50 pF; RL = 500 Ω
2.5
ns
VCC = 3.3 V; CL = 50 pF; RL = 500 Ω
2.5
ns
3.5
pF
outputs enable
21
pF
outputs disabled
13
pF
VCC = 3.3 V; notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
2. The condition is VI = GND to VCC.
2002 Feb 26
TYPICAL
2
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
ORDERING INFORMATION
PACKAGES
TYPE NUMBER
PINS
PACKAGE
MATERIAL
CODE
74ALVC374D
20
SO
plastic
SOT163-1
74ALVC374PW
20
TSSOP
plastic
SOT360-1
FUNCTION TABLE
See note 1.
INPUT
Load and read register
Latch and read register
OE
CP
Dn
L
↑
l
L
L
L
↑
h
H
H
H
↑
l
L
Z
H
↑
h
H
Z
Note
1. H = HIGH voltage level;
h = HIGH voltage level one set-up time prior to the HIGH-to-LOW CP transition;
L = LOW voltage level;
l = LOW voltage level one set-up time prior to the HIGH-to-LOW CP transition;
↑ = LOW-to-HIGH clock transition;
Z = high-impedance OFF-state.
PINNING
PIN
1
SYMBOL
OE
DESCRIPTION
output enable input (active LOW)
2, 5, 6, 9, 12, 15, 16, 19 Q0 to Q7
3-state flip-flop outputs
3, 4, 7, 8, 13, 14, 17, 18 D0 to D7
data inputs
10
GND
ground (0 V)
11
CP
clock input (LOW-to-HIGH, edge triggered)
20
VCC
supply voltage
2002 Feb 26
OUTPUTS
INTERNAL
FLIP-FLOPS
OPERATING MODES
3
Q0 to Q7
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
handbook, halfpage
OE 1
20 VCC
Q0 2
19 Q7
74ALVC374
3
18 D7
D0 3
11
handbook, halfpage
4
D1 4
17 D6
Q1 5
16 Q6
8
15 Q5
13
374
Q2 6
D2 7
14 D5
D3 8
13 D4
Q3 9
12 Q4
GND 10
11 CP
7
14
17
18
CP
D0
Q0
D1
Q1
D2
Q2
D3
Q3
D4
Q4
D5
Q5
D6
Q6
D7
OE
1
Q7
2
5
6
9
12
15
16
19
MNA195
MNA194
Fig.1 Pin configuration.
handbook, halfpage
1
11
3
Fig.2 Logic symbol.
handbook, halfpage
EN
3
D0
Q0
2
4
D1
Q1
5
2
7
D2
Q2
6
5
8
D3
Q3
9
13
D4
14
D5
17
D6
Q6 16
18
D7
Q7 19
C1
1D
4
7
6
8
9
13
12
14
15
17
16
18
19
3-STATE
OUTPUTS
Q4 12
Q5 15
11 CP
1 OE
MNA197
MNA196
Fig.3 IEE/IEC logic symbol.
2002 Feb 26
FF1
to
FF8
Fig.4 Function diagram.
4
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
D0
handbook, full pagewidth
D1
D
D2
D
Q
Q
D
FF2
FF1
Q
D4
D
FF3
CP
CP
D3
Q
D5
D
FF4
CP
74ALVC374
Q
D
FF5
CP
D6
Q
D
FF6
CP
D7
Q
D
FF7
CP
Q
FF8
CP
CP
CP
OE
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
MNA449
Fig.5 Logic diagram.
2002 Feb 26
5
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
1.65
3.6
V
VI
input voltage
0
3.6
V
VO
output voltage
VCC
V
Tamb
operating ambient temperature
tr, tf
input rise and fall times
enable mode; VCC = 1.65 to 3.6 V 0
disable mode; VCC = 1.65 to 3.6 V 0
3.6
V
Power-down mode; VCC = 0 V
0
3.6
V
−40
+85
°C
VCC = 1.65 to 2.7 V
0
20
ns/V
VCC = 2.7 to 3.6 V
0
10
ns/V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
VCC
supply voltage
IIK
input diode current
VI
input voltage
IOK
output diode current
VO
output voltage
CONDITIONS
MIN.
MAX.
UNIT
−0.5
+4.6
V
−
−50
mA
−0.5
+4.6
V
VO > VCC or VO < 0
−
±50
mA
enable mode; notes 1 and 2
−0.5
VCC + 0.5
V
disable mode
−0.5
+4.6
V
Power-down mode; note 2
−0.5
+4.6
V
VO = 0 to VCC
−
±50
mA
VI < 0
IO
output diode current
IGND, ICC
VCC or GND current
−
±100
mA
Tstg
storage temperature
−65
+150
°C
Ptot
power dissipation per package
SO package
above 70 °C derate linearly with
8 mW/K
−
500
mW
TSSOP package
above 60 °C derate linearly with
5.5 mW/K
−
500
mW
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation.
2002 Feb 26
6
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
DC CHARACTERISTICS
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
VIL
VOL
VOH
−40 to +85
PARAMETER
VCC (V)
OTHER
VIH
Tamb (°C)
HIGH-level input
voltage
LOW-level input
voltage
LOW-level output
voltage
HIGH-level output
voltage
MIN.
TYP.(1)
UNIT
MAX.
1.65 to 1.95 0.65 × VCC −
−
V
−
−
V
V
2.3 to 2.7
1.7
2.7 to 3.6
2
−
−
1.65 to 1.95 −
−
0.35 × VCC V
2.3 to 2.7
−
−
0.7
V
2.7 to 3.6
−
−
0.8
V
VI = VIH or VIL; IO = 100 µA
1.65 to 3.6
−
−
0.2
V
VI = VIH or VIL; IO = 6 mA
1.65
−
0.11
0.3
V
VI = VIH or VIL; IO = 12 mA
2.3
−
0.17
0.4
V
VI = VIH or VIL; IO = 18 mA
2.3
−
0.25
0.6
V
VI = VIH or VIL; IO = 12 mA
2.7
−
0.16
0.4
V
VI = VIH or VIL; IO = 18 mA
3.0
−
0.23
0.4
V
VI = VIH or VIL; IO = 24 mA
3.0
−
0.30
0.55
V
VI = VIH or VIL; IO = −100 µA 1.65 to 3.6
VCC − 0.2
−
−
V
VI = VIH or VIL; IO = −6 mA
1.65
1.25
1.51
−
V
VI = VIH or VIL; IO = −12 mA
2.3
1.8
2.10
−
V
VI = VIH or VIL; IO = −18 mA
2.3
1.7
2.01
−
V
VI = VIH or VIL; IO = −12 mA
2.7
2.2
2.53
−
V
VI = VIH or VIL; IO = −18 mA
3.0
2.4
2.76
−
V
VI = VIH or VIL; IO = −24 mA
3.0
2.2
2.68
−
V
II
input leakage
current
VI = 3.6 V or GND
3.6
−
±0.1
±5
µA
IOZ
3-state output
OFF-state current
VI = VIH or VIL;
VO = 3.6 V or GND; note 2
1.65 to 3.6
−
0.1
±10
µA
Ioff
power OFF leakage VI or VO = 0 to 3.6 V
current
0.0
−
±0.1
±10
µA
ICC
quiescent supply
current
VI = VCC or GND; IO = 0
3.6
−
0.2
10
µA
∆ICC
additional
quiescent supply
current per input
pin
VI = VCC − 0.6 V; IO = 0
3.0 to 3.6
−
5
750
µA
Notes
1. All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
2. For transceivers, the parameter IOZ includes the input leakage current.
2002 Feb 26
7
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
AC CHARACTERISTICS
TEST CONDITIONS
SYMBOL
tPZH/tPZL
tPHZ/tPLZ
tW
tsu
th
fmax
−40 to +85
PARAMETER
WAVEFORMS
tPHL/tPLH
Tamb (°C)
propagation delay CP to Qn
3-state output enable time
OE to Qn
3-state output disable time
OE to Qn
clock pulse with HIGH or LOW
set-up time Dn to CP
hold time Dn to CP
see Figs 6 and 9
see Figs 8 and 9
see Figs 8 and 9
see Figs 7 and 9
see Figs 7 and 9
see Figs 7 and 9
maximum clock pulse frequency see Figs 6 and 9
Note
1. All typical values are measured at Tamb = 25 °C.
2002 Feb 26
8
VCC (V)
MIN.
TYP.(1)
UNIT
MAX.
1.65 to 1.95
1.0
3.1
6.4
ns
2.3 to 2.7
1.0
2.3
3.9
ns
2.7
1.0
2.5
3.6
ns
3.0 to 3.6
1.0
2.5
3.6
ns
1.65 to 1.95
1.0
3.2
6.4
ns
2.3 to 2.7
1.0
2.6
4.5
ns
2.7
1.0
3.2
4.6
ns
3.0 to 3.6
1.0
2.4
4.0
ns
1.65 to 1.95
1.5
3.6
7.0
ns
2.3 to 2.7
1.0
2.3
4.4
ns
2.7
1.5
2.9
4.4
ns
3.0 to 3.6
1.0
2.8
4.4
ns
1.65 to 1.95
3.8
1.1
−
ns
2.3 to 2.7
3.3
0.9
−
ns
2.7
3.3
0.8
−
ns
3.0 to 3.6
3.3
1.2
−
ns
1.65 to 1.95
0.8
−0.1
−
ns
2.3 to 2.7
0.8
0.1
−
ns
2.7
0.8
0.3
−
ns
3.0 to 3.6
0.8
0.0
−
ns
1.65 to 1.95
0.8
−0.1
−
ns
2.3 to 2.7
0.8
0.1
−
ns
2.7
0.8
0.4
−
ns
3.0 to 3.6
0.7
−0.1
−
ns
2.3 to 2.7
100
200
−
MHz
2.7
100
200
−
MHz
3.0 to 3.6
150
300
−
MHz
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
AC WAVEFORMS
1/f max
handbook, full pagewidth
VI
VM
CP input
GND
tW
tPHL
tPLH
VM
Qn output
MNA200
INPUT
VCC
VM
VI
tr = tf
1.65 to 1.95 V
0.5 × VCC
VCC
≤ 2.0 ns
2.3 to 2.7 V
0.5 × VCC
VCC
≤ 2.0 ns
2.7 V
1.5 V
2.7 V
≤ 2.5 ns
3.0 to 3.6 V
1.5 V
2.7 V
≤ 2.5 ns
Fig.6 Input Dn to output Qn propagation delay times, the clock pulse width and the clock pulse frequency.
2002 Feb 26
9
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
VI
handbook, full pagewidth
VM
CP input
GND
tsu
tsu
th
th
VI
VM
Dn input
GND
VM
Qn output
MNA202
INPUT
VCC
VM
VI
tr = tf
1.65 to 1.95 V
0.5 × VCC
VCC
≤ 2.0 ns
2.3 to 2.7 V
0.5 × VCC
VCC
≤ 2.0 ns
2.7 V
1.5 V
2.7 V
≤ 2.5 ns
3.0 to 3.6 V
1.5 V
2.7 V
≤ 2.5 ns
The shaded areas indicate when the input is permitted to change for predictable output performance.
Fig.7 Data set-up and hold rimes for Dn to CP.
2002 Feb 26
10
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
VI
handbook, full pagewidth
OE input
VM
GND
t PLZ
t PZL
VCC
Qn output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
t PHZ
Qn output
HIGH-to-OFF
OFF-to-HIGH
t PZH
VOH
VY
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
MNA395
INPUT
VCC
VM
1.65 to 1.95 V
0.5 × VCC
VCC
≤ 2.0 ns
2.3 to 2.7 V
0.5 × VCC
VCC
≤ 2.0 ns
2.7 V
1.5 V
2.7 V
≤ 2.5 ns
VX = VOL + 0.3 V at VCC ≥ 2.7 V;
VX = VOL + 0.15 V at VCC < 2.7 V;
VY = VOH − 0.3 V at VCC ≥ 2.7 V;
VY = VOH − 0.15 V at VCC < 2.7 V.
3.0 to 3.6 V
1.5 V
2.7 V
≤ 2.5 ns
VOL and VOH are typical output voltage drop that occur with the output load.
VI
tr = tf
Fig.8 3-state enable and disable times.
2002 Feb 26
11
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
VEXT
handbook, full pagewidth
VCC
PULSE
GENERATOR
VI
RL
VO
D.U.T.
CL
RT
RL
MNA616
VCC
RL
VEXT
VI
CL
1.65 to 1.95 V
VCC
30 pF
1 kΩ
open
GND
2 × VCC
2.3 to 2.7 V
VCC
30 pF
500 Ω
open
GND
2 × VCC
2.7 V
2.7 V
50 pF
500 Ω
open
GND
6V
3.0 to 3.6 V
2.7 V
50 pF
500 Ω
open
GND
6V
tPLH/tPHL
tPZH/tPHZ
tPZL/tPLZ
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.9 Load circuitry for switching times.
2002 Feb 26
12
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
PACKAGE OUTLINES
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.419
0.043 0.043
0.055
0.394
0.016 0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
2002 Feb 26
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
13
o
8
0o
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1.0
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
2002 Feb 26
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
99-12-27
MO-153
14
o
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
SOLDERING
74ALVC374
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2002 Feb 26
15
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Feb 26
16
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2002 Feb 26
17
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
NOTES
2002 Feb 26
18
74ALVC374
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
NOTES
2002 Feb 26
19
74ALVC374
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA74
© Koninklijke Philips Electronics N.V. 2002
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/01/pp20
Date of release: 2002
Feb 26
Document order number:
9397 750 09438