INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications • The IC06 74HC/HCT/HCU/HCMOS Logic Package Information • The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines 74HC7014 Hex non-inverting precision Schmitt-trigger Product specification Supersedes data of September 1993 File under Integrated Circuits, IC06 1998 Jul 08 Philips Semiconductors Product specification Hex non-inverting precision Schmitt-trigger FEATURES • Operating voltage 3 to 6 V QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns • Output capability: standard SYMBOL • category: SSI VT+ positive going threshold APPLICATIONS VT− • Wave and pulse shapers for highly noisy environments The 74HC7014 provides six precision Schmitt-triggers with non-inverting buffers. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The precisely defined trigger levels are lying in a window between 0.55 × VCC and 0.65 × VCC. This makes the circuit suitable to operate in a highly noisy environment. Input shorts are allowed to −1.5 V and 16 V without disturbing other channels. PARAMETER CONDITIONS TYPICAL UNIT CL = 50 pF; VCC = 5 V 3.1 V negative going threshold 2.9 V CI input capacitance 3.5 pF CPD power dissipation capacitance per gate 9 pF ICC DC supply current 3.0 mA DESCRIPTION The 74HC7014 is a high-speed Si-gate CMOS device. It is specified in compliance with JEDEC standard no. 7A. 74HC7014 notes 1 and 2 Notes to the quick reference data 1. CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz. fo = output frequency in MHz. CL = output load capacitance in pF. VCC = supply voltage in V. ∑ (CL × VCC2 × fo) = sum of outputs. 2. For HC the condition is VI = GND to VCC. ORDERING INFORMATION PACKAGE TYPE NUMBER PINS PIN POSITION MATERIAL CODE 74HC7014N 14 DIP plastic SOT27-1 74HC7014D 14 SO plastic SOT108-1 FUNCTION TABLE INPUT OUTPUT nA nY L L H H Note 1. H = HIGH voltage level L = LOW voltage level 1998 Jul 08 2 Philips Semiconductors Product specification Hex non-inverting precision Schmitt-trigger 74HC7014 PINNING PIN NO. SYMBOL NAME AND FUNCTION 1, 3, 5, 9, 11, 13 1A to 6A data inputs 2, 4, 6, 8, 10, 12 1Y to 6Y data outputs 7 GND ground (0 V) 14 VCC positive supply voltage Fig.1 Pin configuration. Fig.2 Logic symbol. Fig.5 Fig.4 Functional diagram. 1998 Jul 08 Logic diagram (one Schmitt-trigger). 3 Fig.3 IEC logic symbol. Philips Semiconductors Product specification Hex non-inverting precision Schmitt-trigger 74HC7014 DC CHARACTERISTICS FOR 74HC For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: standard Category: SSI TRANSFER CHARACTERISTICS FOR 74HC Voltages are referenced to GND (ground = 0 V) Tamb (°C) SYMBOL VT+ VT− VH ±II ICC 1998 Jul 08 PARAMETER TEST CONDITIONS −40 to +85 +25 −40 to +125 UNIT VCC (V) VI (V) MIN. TYP. MAX. MIN. MAX. MIN. MAX. positive-going threshold − − − − − 1.86 2.94 3.10 3.25 3.72 1.95 3.08 3.25 3.41 3.90 − − − − − 1.95 3.08 3.25 3.41 3.90 − − − − − 1.95 3.08 3.25 3.41 3.90 negative-going threshold 1.65 2.62 2.75 2.89 3.30 1.74 2.76 2.90 3.05 3.48 − − − − − 1.65 2.62 2.75 2.89 3.30 − − − − − 1.65 2.62 2.75 2.89 3.30 − − − − − hysteresis (VT+ − VT−) 50 100 120 130 160 120 180 200 210 240 − − − − − 50 100 120 130 160 − − − − − 50 100 120 130 160 − − − − − − − 0.1 − 1.0 − 1.0 µA 6.0 VCC or GND − − 0.5 − 5.0 − 5.0 µA 3.0 to 6.0 16 V or GND 2.1 7.5 13.0 mA 3.00 5.25 6.00 V 3.00 4.75 5.00 5.25 6.00 Figs.6 and 7 V 3.00 4.75 5.00 5.25 6.00 Figs.6 and 7 mV 3.00 4.75 5.00 5.25 6.00 Figs.6 and 7 input leakage current DC supply current − − − 0.7 3.0 3.7 1.4 6.0 7.4 − − − 1.8 7.5 10.0 4 − − − OTHER Philips Semiconductors Product specification Hex non-inverting precision Schmitt-trigger 74HC7014 AC CHARACTERISTICS FOR 74HC GND = 0 V; tr = tf = 6 ns; CL = 50 pF Tamb (°C) SYMBOL PARAMETER −40 to +85 +25 MIN. TYP. MAX. MIN. MAX. TEST CONDITIONS −40 to +125 MIN. UNIT MAX. VCC (V) WAVEFORMS tPHL propagation delay nA, nB to nY − − − 95 38 27 475 115 73 − − − 600 145 93 − − − 715 175 112 ns 3.00 4.75 6.00 Fig.8 tPLH propagation delay nA, nB to nY − − − 47 23 18 175 52 46 − − − 220 65 58 − − − 260 78 70 ns 3.00 4.75 6.00 Fig.8 tTHL/tTLH output transition time − − − 12 7 6 20 15 13 − − − 25 19 16 − − − 30 22 19 ns 3.00 4.75 6.00 Fig.8 TRANSFER CHARACTERISTIC WAVEFORMS Fig.7 Fig.6 Transfer characteristic. Waveforms showing the definition of VT+, VT− and VH. AC WAVEFORMS (1) VM = 50%; VI = GND to VCC. Fig.8 Waveforms showing the input (nA) to output (nY) propagation delay and the output transition times. 1998 Jul 08 5 Philips Semiconductors Product specification Hex non-inverting precision Schmitt-trigger 74HC7014 PACKAGE OUTLINES DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.2 inches 0.17 0.020 0.13 0.068 0.044 0.021 0.015 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT27-1 050G04 MO-001AA 1998 Jul 08 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 6 Philips Semiconductors Product specification Hex non-inverting precision Schmitt-trigger 74HC7014 SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.244 0.039 0.041 0.228 0.016 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06S MS-012AB 1998 Jul 08 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 7 o 8 0o Philips Semiconductors Product specification Hex non-inverting precision Schmitt-trigger Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP • The longitudinal axis of the package footprint must be parallel to the solder flow. SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 Jul 08 74HC7014 8 Philips Semiconductors Product specification Hex non-inverting precision Schmitt-trigger 74HC7014 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Jul 08 9