TI AM26LS31C

AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
FEATURES
DESCRIPTION/ORDERING INFORMATION
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
4A
4Y
4Z
G
3Z
3Y
3A
NC
V CC
3
2
1
20 19
4A
1A
FK PACKAGE
(TOP VIEW)
1Z
4
18 4Y
G
5
17 4Z
NC
6
16 NC
2Z
7
15 G
2Y
8
14 3Z
3Y
10 11 12 13
3A
9
NC
The AM26LS31 is a quadruple complementary-output
line driver designed to meet the requirements of ANSI
TIA/EIA-422-B
and
ITU
(formerly
CCITT)
Recommendation V.11. The 3-state outputs have
high-current capability for driving balanced lines such
as twisted-pair or parallel-wire transmission lines, and
they are in the high-impedance state in the power-off
condition. The enable function is common to all four
drivers and offers the choice of an active-high or
active-low enable (G, G) input. Low-power Schottky
circuitry reduces power consumption without
sacrificing speed.
1
GND
•
1A
1Y
1Z
G
2Z
2Y
2A
GND
1Y
•
•
•
•
D, DB, N, NS, J, OR W PACKAGE
(TOP VIEW)
Meets or Exceeds the Requirements of ANSI
TIA/EIA-422-B and ITU
Operates From a Single 5-V Supply
TTL Compatible
Complementary Outputs
High Output Impedance in Power-Off
Conditions
Complementary Output-Enable Inputs
2A
•
ORDERING INFORMATION
PACKAGE (1)
TA
PDIP – N
0°C to 70°C
–55°C to 125°C
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
Tube
AM26LS31CN
Tube
AM26LS31CD
Tape and reel
AM26LS31CDR
SOP – NS
Tape and reel
AM26LS31CNSR
26LS31
SSOP – DB
Tape and reel
AM26LS31CDBR
SA31C
CDIP – J
Tube
AM26LS31MJB
AM26LS31MJB
LCCC – FK
Tube
AM26LS31MFKB
AM26LS31MFKB
CFP – W
Tube
AM26LS31MWB
AM26LS31MWB
SOIC – D
AM26LS31CN
AM26LS31C
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1979–2006, Texas Instruments Incorporated
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
FUNCTION TABLE (1)
(EACH DRIVER)
INPUT
A
(1)
ENABLES
OUTPUTS
G
G
Y
Z
H
H
X
H
L
L
H
X
L
H
H
X
L
H
L
L
X
L
L
H
X
L
H
Z
Z
H = high level, L = low level,
X = irrelevant,
Z = high impedance (off)
LOGIC DIAGRAM (POSITIVE LOGIC)
G
G
4
12
2
1A
1
3
6
2A
7
5
10
3A
9
11
14
4A
2
15
13
Submit Documentation Feedback
1Y
1Z
2Y
2Z
3Y
3Z
4Y
4Z
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
SCHEMATIC (EACH DRIVER)
Input A
V
22 kΩ
9Ω
9Ω
Output Z
Output Y
Common to All Four Drivers
VCC
22 kΩ
V
22 kΩ
To Three Other Drivers
Enable G
Enable G
GND
All resistor values are nominal.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
voltage (2)
VCC
Supply
VI
Input voltage
Output off-state voltage
θJA
Package thermal impedance (3)
Tstg
(1)
(2)
(3)
Storage temperature range
V
7
V
5.5
V
73
DB package
82
N package
67
NS package
64
J package
–65
UNIT
7
D package
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Lead temperature 1,6 mm (1/16 in) from case for 60 s
MAX
°C/W
260
°C
300
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential output voltage VOD, are with respect to network GND.
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
3
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
Recommended Operating Conditions
MIN
NOM
MAX
AM26LS31C
4.75
5
5.25
AM26LS31M
4.5
5
5.5
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
V
IOH
High-level output current
–20
mA
IOL
Low-level output current
20
mA
TA
Operating free-air temperature
2
V
V
AM26LS31C
0
70
AM26LS31M
–55
125
°C
Electrical Characteristics (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
UNIT
–1.5
V
VIK
Input clamp voltage
VCC = MIN,
II = –18 mA
VOH
High-level output voltage
VCC = MIN,
IOH = –20 mA
VOL
Low-level output voltage
VCC = MIN,
IOL = 20 mA
0.5
IOZ
Off-state (high-impedance-state)
output current
VCC = MIN,
VO = 0.5 V
–20
VO = 2.5 V
20
II
Input current at maximum input voltage
VCC = MAX,
VI = 7 V
0.1
IIH
High-level input current
VCC = MAX,
VI = 2.7 V
20
µA
IIL
Low-level input current
VCC = MAX,
VI = 0.4 V
–0.36
mA
IOS
Short-circuit output current (3)
VCC = MAX
–150
mA
ICC
Supply current
VCC = MAX,
80
mA
(1)
(2)
(3)
2.5
V
–30
All outputs disabled
32
V
µA
mA
For C-suffix devices, VCC min = 4.75 V and VCC max = 5.25 V. For M-suffix devices, VCC min = 4.5 V and VCC max = 5.5 V.
All typical values are at VCC = 5 V and TA = 25°C.
Not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second.
Switching Characteristics
VCC = 5 V (see Figure 1)
PARAMETER
tPLH
Propagation delay time, low- to
high-level output
tPHL
Propagation delay time, high- to
low-level output
tPZH
Output enable time to high level
tPZL
Output enable time to low level
tPHZ
Output disable time from high level
tPLZ
Output disable time from low level
tSKEW
Output-to-output skew
4
TEST CONDITIONS
CL = 30 pF,
CL = 30 pF
TA = 25°C
MIN
AM26LS31M
TYP
MAX
MIN
MAX
14
20
30
14
20
30
RL = 75 Ω
25
40
60
RL = 180 Ω
37
45
68
21
30
45
23
35
53
1
6
9
S1 and S2 open
CL = 10 pF,
S1 and S2 closed
CL = 30 pF,
S1 and S2 open
Submit Documentation Feedback
UNIT
ns
ns
ns
ns
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
PARAMETER MEASUREMENT INFORMATION
Input A
(see Notes B
and C)
Test Point
3V
1.3 V
1.3 V
0V
VCC
tPLH
tPHL
180 Ω
VOH
1.5 V
Output Y
S1
From Output
Under Test
VOL
Skew
75 Ω
CL
(see Note A)
Skew
tPLH
tPHL
S2
VOH
1.5 V
Output Z
VOL
PROPAGATION DELAY TIMES AND SKEW
Enable G
(see Note D)
Enable G
TEST CIRCUIT
3V
1.5 V
1.5 V
See Note D
0V
tPZL
tPLZ
≈4.5 V
Waveform 1
(see Note E)
S1 Closed
S2 Open
S1 Closed
S2 Closed
≈1.5 V
1.5 V
VOL
0.5 V
tPZH
tPHZ
0.5 V
Waveform 2
(see Note E)
S1 Open
S2 Closed
1.5 V
VOH
≈1.5 V
≈0 V
S1 Closed
S2 Closed
ENABLE AND DISABLE TIME WAVEFORMS
NOTES: A.
B.
C.
D.
E.
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 15 ns, tf ≤ 6 ns.
When measuring propagation delay times and skew, switches S1 and S2 are open.
Each enable is tested separately.
Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
Figure 1. Test Circuit and Voltage Waveforms
Submit Documentation Feedback
5
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
4
VO − Y Output Voltage − V
Load = 470 Ω to GND
TA = 25°C
See Note A
3
4
VCC = 5 V
Load = 470 Ω to GND
See Note A
VCC = 5.25 V
VCC = 5 V
VO − Y Output Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
VCC = 4.75 V
2
1
0
3
TA = 70°C
TA = 0°C
TA = 25°C
2
1
0
0
1
2
3
0
1
VI − Enable G Input Voltage − V
2
3
VI − Enable G Input Voltage − V
Figure 2.
Figure 3.
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
6
6
VCC = 5.25 V
5
VCC = 5 V
VCC = 4.75 V
4
VO − Output Voltage − V
VO − Output Voltage − V
5
3
2
1
Load = 470 Ω to VCC
TA = 25°C
See Note B
0
0
1
4
TA = 70°C
3
TA = 25°C
TA = 0°C
2
1
VCC = 5 V
Load = 470 Ω to VCC
See Note B
0
2
3
0
VI − Enable G Input Voltage − V
Figure 4.
6
1
2
VI − Enable G Input Voltage − V
Figure 5.
A.
The A input is connected to VCC during testing of the Y outputs and to ground during testing of the Z outputs.
B.
The A input is connected to ground during testing of the Y outputs and to VCC during testing of the Z outputs.
Submit Documentation Feedback
3
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS (continued)
HIGH-LEVEL OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
5
4
VCC = 5.25 V
VOH − High-Level Output Voltage − V
VOH − High-Level Output Voltage − V
VCC = 5 V
See Note A
4
IOH = −20 mA
3
IOH = −40 mA
2
1
VCC = 5 V
3
VCC = 4.75 V
2
1
TA = 25°C
See Note A
0
0
0
25
50
75
0
−20
TA − Free-Air Temperature − °C
−40
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
1
VCC = 5 V
IOL = 40 mA
See Note B
0.9
VOL− Low-Level Output Voltage − V
VOL− Low-Level Output Voltage − V
−100
Figure 7.
LOW-LEVEL OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
0.4
−80
IOH − High-Level Output Current − mA
Figure 6.
0.5
−60
0.3
0.2
0.1
TA = 25°C
See Note B
0.8
0.7
0.6
0.5
VCC = 4.75 V
0.4
VCC = 5.25 V
0.3
0.2
0.1
0
0
0
25
50
75
0
TA − Free-Air Temperature − °C
Figure 8.
20
40
60
80
100
120
IOL − Low-Level Output Current − mA
Figure 9.
A.
The A input is connected to VCC during testing of the Y outputs and to ground during testing of the Z outputs.
B.
The A input is connected to ground during testing of the Y outputs and to VCC during testing of the Z outputs.
Submit Documentation Feedback
7
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS (continued)
Y OUTPUT VOLTAGE
vs
DATA INPUT VOLTAGE
5
4
5
VCC = 5.25 V
4
VCC = 5 V
VCC = 4.75 V
3
2
1
TA = 70°C
TA = 0°C
3
TA = 25°C
2
1
0
0
0
1
2
3
0
VI − Data Input Voltage − V
1
2
VI − Data Input Voltage − V
Figure 10.
8
No Load
VO − Y Output Voltage − V
VO − Y Output Voltage − V
No Load
TA = 25°C
Y OUTPUT VOLTAGE
vs
DATA INPUT VOLTAGE
Figure 11.
Submit Documentation Feedback
3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-7802301M2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59627802301M2A
AM26LS31
MFKB
5962-7802301MEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-7802301ME
A
AM26LS31MJB
5962-7802301MFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-7802301MF
A
AM26LS31MWB
5962-7802301Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
AM26LS31-W
ACTIVE
WAFERSALE
YS
0
3921
TBD
Call TI
Call TI
AM26LS31CD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26LS31C
AM26LS31CDBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
SA31C
AM26LS31CDBRE4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
SA31C
AM26LS31CDBRG4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
SA31C
AM26LS31CDE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26LS31C
AM26LS31CDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26LS31C
AM26LS31CDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 70
AM26LS31C
AM26LS31CDRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26LS31C
AM26LS31CDRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26LS31C
AM26LS31CN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
AM26LS31CN
Addendum-Page 1
59627802301Q2A
AM26LS31M
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
18-Oct-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AM26LS31CNE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
AM26LS31CN
AM26LS31CNSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26LS31
AM26LS31CNSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26LS31
AM26LS31MFKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59627802301M2A
AM26LS31
MFKB
AM26LS31MJB
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-7802301ME
A
AM26LS31MJB
AM26LS31MWB
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-7802301MF
A
AM26LS31MWB
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM26LS31, AM26LS31M :
• Catalog: AM26LS31
• Military: AM26LS31M
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
AM26LS31CDBR
SSOP
DB
16
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
AM26LS31CDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26LS31CDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26LS31CDRG4
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26LS31CDRG4
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AM26LS31CDBR
SSOP
DB
16
2000
367.0
367.0
38.0
AM26LS31CDR
SOIC
D
16
2500
333.2
345.9
28.6
AM26LS31CDR
SOIC
D
16
2500
367.0
367.0
38.0
AM26LS31CDRG4
SOIC
D
16
2500
367.0
367.0
38.0
AM26LS31CDRG4
SOIC
D
16
2500
333.2
345.9
28.6
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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