AOS Semiconductor Product Reliability Report AOD2922, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD2922. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD2922 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be routine monitored for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Reliability Stress Test Summary and Results Reliability Evaluation I. Product Description: • Latest Trench Power AlphaMOS (αMOS MV) technology • Very Low RDS(ON) • Low Gate Charge • Optimized for fast-switching applications • RoHS and Halogen-Free Compliant Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond Mold Material Moisture Level AOD2922 Standard sub-micron 100V N-Channel AlphaMOS TO252 Bare Cu Soft solder Al & Cu wire Epoxy resin with silica filler Up to Level 1 2 III. Reliability Stress Test Summary and Results Test Item* Test Condition Time Point Total Sample Size** Number of Failures Reference Standard MSL Precondition 168hr 85°C / 85%RH + 3 cycle reflow@260°C (MSL 1) - 3003pcs 0 JESD22-A113 HTGB Temp = 150°C , Vgs=100% of Vgsmax 168 / 500 / 1000 hrs 539pcs HTRB Temp = 150°C , Vds=80% of Vdsmax 168 / 500 / 1000 hrs 539pcs HAST 130°C , 85%RH, 33.3 psi, Vds = 80% of Vdsmax before arcing (typically ≤42V) 96 hrs 924 pcs 0 JESD22-A110 Pressure Pot 121°C , 29.7psi, RH=100% 96 hrs 924 pcs 0 JESD22-A102 Temperature Cycle -65°C to 150°C , air to air, 250 / 500 cycles 1155 pcs 0 JESD22-A104 0 JESD22-A108 0 JESD22-A108 **Note: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 4.90 MTTF = 23277 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 4.90 9 MTTF = 10 / FIT = 23277 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from burn-in tests H = Duration of burn-in testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 130 deg C 150 deg C 2.59 1 3