Preliminary Technical Data FEATURES 210˚C Precision Micropower Voltage Reference ADR225 PIN CONFIGURATION Extreme high temperature operation −40°C to +210°C, Ceramic flat pack (CFP) −40°C to +175°C, SOIC package Temperature coefficient: 20 ppm/°C, Ceramic Flat Pack (CFP) 10 ppm/°C, SOIC Package High output current: 10 mA Low supply current: 50 μA Max Initial accuracy: ±2mV Low dropout voltage APPLICATIONS Figure 1. 8-Lead Package Down-Hole Drilling and Instrumentation Avionics Heavy Industrial High Temperature Environments GENERAL DESCRIPTION BASIC VOLTAGE REFERENCE CONNECTIONS The ADR225 is a precision bandgap voltage reference specified for very high temperature operation. It uses a micro-power core topology and laser trimming of highly stable, thin-film resistors to achieve a very low temperature coefficient and high initial accuracy while consuming very little power. A maximum operating current of 50 μA and a low dropout voltage allows the device to function very well in battery-powered equipment. The circuit in Figure 2 illustrates the basic configuration for the ADR225. Note the 10 μF/0.1 μF bypass network on the input and at least 1 μF bypass capacitor on the output is required for proper device operation. It is recommended that no connections be made to Pin 1, Pin 3, Pin 5, Pin 7, and Pin 8. The reference is offered in an 8 lead SOIC plastic package with an operating temperature range of −40°C to +175°C. It is also available in an 8 lead ceramic flat pack (CFP) with an operating temperature range of −40°C to +210°C. Both devices are designed for robustness at extreme temperatures and are qualified for 1000 hours of operation at the maximum temperature rating. Figure 2. Basic Voltage Reference Connections Rev. PrA Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2013 Analog Devices, Inc. All rights reserved. ADR225 Preliminary Technical Data ELECTRICAL CHARACTERISTICS @ VS = 3.3V, TMin< TA < TMax , unless otherwise noted. Table 1. Parameter Symbol Conditions SUPPLY CURRENT Isy No load INITIAL ACCURACY1 VO IOUT = 0 mA ±2 ±10 ±2 mV TEMPERATURE COEFFICIENT2 TCVO/°C IOUT = 0 mA 10 30 20 ppm/°C LINE REGULATION ΔVO/ΔVIN 3.0 V ≤ VS ≤ 15 V, IOUT = 0 mA 5 40 5 ppm/V LOAD REGULATION3 ΔVO/ΔVLOAD VS = 5.0 V, 0 mA ≤ IOUT ≤ 10 mA 10 40 10 ppm/mA DROPOUT VOLTAGE V S − VO ILOAD = 10 mA 1.00 1.00 V NOISE VOLTAGE eN 0.1 Hz to 10 Hz 25 μV p-p 1 2 Min Typ Max SOIC −40°C ≤ TA ≤ +175°C 30 50 25 For proper operation, a 1 μF capacitor is required between the output pin and the GND pin of the device. TCVO is defined as the ratio of output change with temperature variation to the specified temperature range expressed in ppm/°C. TCVO = (VMAX − VMIN)/VO(TMAX − TMIN) 3 Min Typ Max CFP −40°C ≤ TA ≤ +210°C 35 Load regulation specification includes the effect of self-heating. Rev. PrA | Page 2 of 3 Unit μA Preliminary Technical Data ADR225 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Supply Voltage Output to GND Storage Temperature Range Operating Temperature Range SOIC Package CFP Package Junction Temperature Range SOIC Package CFP Package Lead Temperature (Soldering 60 sec) Rating −0.3 V to +15 V −0.3 V to VS + 0.3 V −65°C to +150°C −40°C to +175°C −40°C to +210°C −40°C to +175°C −40°C to +210°C 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR11525-0-7/13(PrA) θJA is specified for worst-case conditions; that is, θJA is specified s specified for the device soldered in the circuit board. Table 3. Package Type 8-Lead SOIC (R) 8-Lead CFP (RU) ESD CAUTION θJA 158 TBD θJC 43 TBD Unit °C/W °C/W