4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 DESCRIPTION The FODM305X series consists of a galium arsenide diode driving a silicon bilateral switch housed in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm. The FODM305X series isolates low voltage logic from 115 and 240 Vac lines to provide random phase control of high current triacs or thyristors. It also features greatly enhanced static dv/dt capability to ensure stable switching performance of inductive loads. FEATURES PACKAGE DIMENSIONS • Compact 4-pin surface mount package (2.4 mm maximum standoff height) • Peak blocking voltage – 600V • Guaranteed static dv/dt of 1000 V/µs • Available in tape and reel quantities of 500 and 2500. • Applicable to Infrared Ray reflow (230°C max, 30 seconds.) • BSI, CSA and VDE certifications pending • UL (File# E90700) certified PIN 1 0.100 (2.54) TYP 0.020 (0.51) 0.012 (0.30) 0.287 (7.29) 0.248 (6.30) 0.173 (4.40) TYP APPLICATIONS • Solenoid/valve controls • Interfacing microprocessors to 115 and 240 Vac peripherals • Temperature controls • Solid state relays • Lamp ballast • Static AC power switch • Motor control • Incandescent lamp dimmers 0.026 (0.66) 0.169 (4.29) 0.154 (3.91) 0.094 (2.39) 0.079 (2.01) ANODE 1 MAIN 4 TERMINAL CATHODE 2 MAIN 3 TERMINAL 0.008 (0.20) 0.000 (0.0) 0.035 (0.89) 0.012 (0.30) 0.033 (0.85) 0.026 (0.65) NOTE All dimensions are in inches (millimeters) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter TOTAL PACKAGE Symbol Value Units Storage Temperature TSTG -40 to +125 °C Junction Temperature TJ 125 °C TOPR -40 to +85 °C Continuous Forward Current IF (avg) 60 mA Peak Forward Current (1 µs pulse, 300 pps.) IF (pk) 1 A VR 3 V PD 100 mW IT(RMS) 70 mA (RMS) VDRM 600 V PD 250 mW Operating Temperature EMITTER Reverse Input Voltage Power Dissipation (No derating required over operating temp. range) DETECTOR On-State RMS Current Off-State Output Terminal Voltage Power Dissipation (No derating required over operating temp. range) © 2003 Fairchild Semiconductor Corporation Page 1 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Device IF = 10 mA VF VR = 3 V IR Peak Blocking Current Either Direction VDRM = 600V, IF = 0 (note 1) Peak On-State Voltage Either Direction Min Typ* Max Unit All 1.20 1.5 V All 0.01 100 µA IDRM All 3 100 nA ITM = 100mA peak VTM All 2.0 2.5 V IF = 0 (Figure 8, note 2) dV/dt All EMITTER Input Forward Voltage Reverse Leakage Current DETECTOR Critical Rate of Rise of Off-State Voltage 1000 V/µs TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified) DC Characteristics LED Trigger Current Test Conditions Main Terminal Voltage = 3V (note 3) Holding Current, Either Direction Symbol Device IFT FODM3051 FODM3052 FODM3053 IH All Min Typ* Max Unit 15 10 5 mA 300 µA ISOLATION CHARACTERISTICS (TA = 25°C Unless otherwise specified) Characteristic Test Conditions Symbol Device Min t = 1 Minute VISO All 3750 Steady State Isolation Voltage Typ* Max Unit V(RMS) * All typicals at TA = 25°C Note 1. Test voltage must be applied within dv/dt rating. 2. This is static dv/dt. See Figure 1 for test circuit. Commutating dv/dt is function of the load-driving thyristor(s) only. 3. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for FODM3051, 10 mA for FODM3052, 5 mA for FODM3053) and absolute max IF (60 mA). © 2003 Fairchild Semiconductor Corporation Page 2 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 TYPICAL PERFORMANCE CURVES Fig. 1 LED Forward Voltage vs. Forward Current Fig. 2 Leakage Current vs. Ambient Temperature 1000 1.7 VDRM = 600V IDRM - LEAKAGE CURRENT (nA) VF - FORWARD VOLTAGE (V) 1.6 1.5 1.4 1.3 TA = -40°C 1.2 TA = 25°C 1.1 100 10 1 TA = 85°C 1.0 0.1 -40 0.9 1 100 10 -20 Fig. 3 Holding Current vs. Ambient Temperature 20 40 60 80 100 Fig. 4 Trigger Current vs. Ambient Temperature 1.4 5 VTM = 3V NORMALIZED TO TA = 25°C NORMALIZED TO TA = 25°C 1.3 I FT - TRIGGER CURRENT (NORMALIZED) I H - HOLDING CURRENT (NORMALIZED) 0 T A - AMBIENT TEMPERATURE (°C) IF - FORWARD CURRENT (mA) 2 1.0 0.5 0.2 0.1 -40 -20 0 20 40 60 80 1.2 1.1 1.0 0.9 0.8 100 0.7 -40 T A - AMBIENT TEMPERATURE (°C) 100 -20 T A - AMBIENT TEMPERATURE (°C) Fig. 6 Off-state Output Terminal Voltage vs. Ambient Temperature IFT - LED TRIGGER CURRENT (NORMALIZED) TA =T25°C A NORMALIZED TO PW IN >> 100µs 10 8 6 4 2 1.4 NORMALIZED TO TA = 25°C 1.3 1.2 (NORMALIZED) V DRM- OFF-STATE OUTPUT TERMINAL VOLTAGE Fig. 5 LED Current Required to Trigger vs. LED Pulse Width 12 1.1 1.0 0.9 0.8 0.7 0.6 -40 0 1 10 100 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) PW IN - LED TRIGGER PULSE WIDTH (µs) © 2003 Fairchild Semiconductor Corporation Page 3 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 Fig. 7 On-State Characteristics 800 TA = 25°C ITM - ON-STATE CURRENT (mA) 600 400 200 0 -200 -400 -600 -800 -6 -4 -2 0 2 4 6 VTM - ON-STATE VOLTAGE (V) 400V Vdc RTEST R = 10 kΩ CTEST PULSE INPUT MERCURY WETTED RELAY D.U.T. X100 SCOPE PROBE 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τRC is measured at this point and recorded. Vmax = 400 V APPLIED VOLTAGE WAVEFORM 252 V dv/dt = 0 VOLTS τRC 0.63 Vmax τRC 252 = τ RC Figure 8. Static dv/dt Test Circuit © 2003 Fairchild Semiconductor Corporation Page 4 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 ORDERING INFORMATION Option Description V VDE Approved R1 Tape and Reel (500 units) R2 Tape and Reel (2500 units) R3 Tape and Reel (500 units; unit 180° rotated) R4 Tape and Reel (2500 units; unit 180° rotated) R1V Tape and Reel (500 units) and VDE Approved R2V Tape and Reel (2500 units) and VDE Approved R3V Tape and Reel (500 units; unit 180° rotated) and VDE Approved R4V Tape and Reel (2500 units; unit 180° rotated) and VDE Approved MARKING INFORMATION 1 3051 2 V X YY M 6 3 4 5 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code © 2003 Fairchild Semiconductor Corporation Page 5 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 K0 FODM3053 P2 P0 t D0 E A0 W1 W B0 d F D1 P 2.54 Pitch Symbol Description Dimensions (mm) Tape Width W Tape Thickness t 0.30±0.20 Sprocket Hole Pitch P0 4.00±0.20 12.00±0.4 Sprocket Hole Dia. D0 1.55±0.20 Sprocket Hole Location E 1.75±0.20 Pocket Location F 5.50±0.20 P2 2.00±0.20 Pocket Pitch P 8.00±0.20 Pocket Dimension A0 4.40±0.20 B0 7.30±0.20 K0 2.30±0.20 Pocket Hole Dia. D1 1.55±0.20 Cover Tape Width W1 9.20 Cover Tape Thickness d 0.065±0.02 Max. Component Rotation or Tilt Devices Per Reel Reel Diameter © 2003 Fairchild Semiconductor Corporation 20˚ max R1 500 R2 2500 R1 178 mm (7") R2 330 mm (13") Page 6 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 Footprint Drawing for PCB Layout 0.024 (0.61) 0.060 (1.52) 0.310 (7.87) 0.190 (4.83) 0.100 (2.54) Recommended Infrared Reflow Soldering Profile Package Surface Temperature T (°C) (heating) to 30 s 230°C (peak temperature) 210°C 180°C to 60 s 150 s 90 s 60 s Time (s) • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended © 2003 Fairchild Semiconductor Corporation Page 7 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2003 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 8 of 8 11/10/03