6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M PACKAGE SCHEMATIC ANODE 1 6 MAIN TERM. 6 6 5 NC* CATHODE 2 1 N/C 3 1 4 MAIN TERM. *DO NOT CONNECT (TRIAC SUBSTRATE) 6 1 DESCRIPTION The MOC3051-M and MOC3052-M consist of a AlGaAs infrared emitting diode optically coupled to a non-zero-crossing silicon bilateral AC switch (triac). These devices isolate low voltage logic from 115 and 240 Vac lines to provide random phase control of high current triacs or thyristors. These devices feature greatly enhanced static dv/dt capability to ensure stable switching performance of inductive loads. FEATURES • • • • • Excellent IFT stability—IR emitting diode has low degradation High isolation voltage—minimum 7500 peak VAC Underwriters Laboratory (UL) recognized—File #E90700 600V peak blocking voltage VDE recognized (File #94766) - Ordering option V (e.g. MOC3052V-M) APPLICATIONS • • • • • • • • Solenoid/valve controls Lamp ballasts Static AC power switch Interfacing microprocessors to 115 and 240 Vac peripherals Solid state relay Incandescent lamp dimmers Temperature controls Motor controls © 2004 Fairchild Semiconductor Corporation Page 1 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Parameters Symbol Device Value Units Storage Temperature TSTG All -40 to +150 °C Operating Temperature TOPR All -40 to +85 °C Lead Solder Temperature TSOL All 260 for 10 sec °C TJ All -40 to +100 °C VISO All 7500 Vac(pk) PD All 330 mW 4.4 mW/°C Continuous Forward Current IF All 60 mA Reverse Voltage VR All 3 V PD All Off-State Output Terminal Voltage VDRM All Peak Repetitive Surge Current (PW = 100 ms, 120 pps) ITSM All TOTAL DEVICE Junction Temperature Range Isolation Surge Voltage(3) (peak AC voltage, 60Hz, 1 sec duration) Total Device Power Dissipation @ 25°C Derate above 25°C EMITTER Total Power Dissipation 25°C Ambient Derate above 25°C 100 mW 1.33 mW/°C 600 V DETECTOR Total Power Dissipation @ 25°C Ambient PD Derate above 25°C © 2004 Fairchild Semiconductor Corporation Page 2 of 11 All 1 A 300 mW 4 mW/°C 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameters Test Conditions Symbol Device Min Typ* Max Units EMITTER IF = 10 mA VF All 1.15 1.5 V VR = 3 V IR All 0.05 100 µA Peak Blocking Current, Either Direction VDRM, IF = 0 (note 1) IDRM All 10 100 nA Peak On-State Voltage, Either Direction ITM = 100 mA peak, IF = 0 VTM All 1.7 2.5 V Critical Rate of Rise of Off-State Voltage IF = 0 (figure 7, @400V) dv/dt All Input Forward Voltage Reverse Leakage Current DETECTOR 1000 V/µs TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified.) DC Characteristics Test Conditions Symbol LED Trigger Current, either direction Main terminal Voltage = 3V (note 2) IFT Holding Current, Either Direction IH Device Min Typ* Max MOC3051-M 15 MOC3052-M 10 All 280 Units mA µA *Typical values at TA = 25°C Note 1. Test voltage must be applied within dv/dt rating. 2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max 15 mA for MOC3051, 10 mA for MOC3052 and absolute max IF (60 mA). 3. Isolation surge votlage, VISO, is an internal device breakdown rating. For this text, pins 1 and 2 are common, and pins 4, 5 and 6 are common. © 2004 Fairchild Semiconductor Corporation Page 3 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M Figure. 2 On-State Characteristics 800 1.7 600 ON-STATE CURRENT - ITM (mA) VF - FORWARD VOLTAGE (V) Figure. 1 LED Forward Voltage vs. Forward Current 1.8 1.6 1.5 1.4 TA = -55oC 1.3 TA = 25oC 1.2 400 200 0 -200 -400 TA = 100oC -600 1.1 -800 -3 1.0 1 10 -2 100 -1 0 1 2 3 ON-STATE VOLTAGE - VTM (V) IF - LED FORWARD CURRENT (mA) Figure. 4 LED Current Required to Trigger vs. LED Pulse Width Figure. 3 Trigger Current vs. Ambient Temperature IFT, NORMALIZED LED TRIGGER CURRENT 1.4 TRIGGER CURRENT - I FT (NORMALIZED) 1.3 1.2 1.1 1.0 0.9 25 NORMALIZED TO: PWin ≥ 100 µs 20 15 10 5 0 1 2 5 10 20 50 100 0.8 PWin, LED TRIGGER PULSE WIDTH (µs) 0.7 NORMALIZED TO TA = 25°C 0.6 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE - TA (oC) IF versus Temperature (normalized) This graph (figure 3) shows the increase of the trigger current when the device is expected to operate at an ambient temperature below 25°C. Multiply the normalized IFT shown this graph with the data sheet guaranteed IFT. Example: TA = -40°C, IFT = 10 mA IFT @ -40°C = 10 mA x 1.4 = 14 mA IFT in the graph IFT versus (PW) is normalized in respect to the minimum specified IFT for static condition, which is specified in the device characteristic. The normalized IFT has to be multiplied with the devices guaranteed static trigger current. Phase Control Considerations LED Trigger Current versus PW (normalized) Random Phase Triac drivers are designed to be phase controllable. They may be triggered at any phase angle within the AC © 2004 Fairchild Semiconductor Corporation sine wave. Phase control may be accomplished by an AC line zero cross detector and a variable pulse delay generator which is synchronized to the zero cross detector. The same task can be accomplished by a microprocessor which is synchronized to the AC zero crossing. The phase controlled trigger current may be a very short pulse which saves energy delivered to the input LED. LED trigger pulse currents shorter than 100 µs must have an increased amplitude as shown on Figure 4. This graph shows the dependency of the trigger current IFT versus the pulse width can be seen on the chart delay t(d) versus the LED trigger current. Example: Guaranteed IFT = 10 mA, Trigger pulse width PW = 3 µs IFT (pulsed) = 10 mA x 5 = 50 mA Page 4 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M Minimum LED Off Time in Phase Control Applications AC SINE In Phase control applications one intends to be able to control each AC sine half wave from 0 to 180 degrees. Turn on at zero degrees means full power and turn on at 180 degree means zero power. This is not quite possible in reality because triac driver and triac have a fixed turn on time when activated at zero degrees. At a phase control angle close to 180 degrees the driver’s turn on pulse at the trailing edge of the AC sine wave must be limited to end 200 ms before AC zero cross as shown in Figure 5. This assures that the triac driver has time to switch off. Shorter times may cause loss of control at the following half cycle. 180° 0ϒ LED PW LED CURRENT LED TURN OFF MIN 200 µs Figure 5. Minimum Time for LED Turn–Off to Zero Cross of AC Trailing Edge Figure. 7 Leakage Current, I DRM vs. Temperature 10000 IDRM, LEAKAGE CURRENT (nA) Figure. 6 Holding Current, I H vs. Temperature IH, HOLDING CURRENT (mA) 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 1000 100 10 1 0.1 0 - 40 - 30 - 20 -10 0 10 20 30 40 50 60 70 80 0.1 -40 TA , AMBIENT TEMPERATURE (oC) -20 0 20 40 60 80 100 TA , AMBIENT TEMPERATURE (oC) IFT versus dv/dt IFT, LED TRIGGER CURRENT (NORMALIZED) Figure. 8 LED Trigger Current, I FT vs. dv/dt 1.5 1.4 NORMALIZED TO: IFT at 3 V 1.3 1.2 1.1 Triac drivers with good noise immunity (dv/dt static) have internal noise rejection circuits which prevent false triggering of the device in the event of fast raising line voltage transients. Inductive loads generate a commutating dv/dt that may activate the triac drivers noise suppression circuits. This prevents the device from turning on at its specified trigger current. It will in this case go into the mode of “half waving” of the load. Half waving of the load may destroy the power triac and the load. 1 Figure 8 shows the dependency of the triac drivers IFT versus the reapplied voltage rise with a Vp of 400 V. This dv/dt condition simulates a worst case commutating dv/dt amplitude. 0.9 0.8 0.7 0.6 0.5 0.001 0.01 0.1 1 10 dv/dt (V/ µs) © 2004 Fairchild Semiconductor Corporation 100 1000 10000 It can be seen that the IFT does not change until a commutating dv/dt reaches 1000 V/ms. The data sheet specified IFT is therefore applicable for all practical inductive loads and load factors. Page 5 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M t(delay), t(f) versus IFT Figure 9. Delay Time, t(d), and Fall Time, t(f), vs. LED Trigger Current The triac driver’s turn on switching speed consists of a turn on delay time t(d) and a fall time t(f). Figure 9 shows that the delay time depends on the LED trigger current, while the actual trigger transition time t(f) stays constant with about one micro second. t(delay) AND t(fall) (µ s) 100 t(d) 10 t(f) 1 0.1 10 The delay time is important in very short pulsed operation because it demands a higher trigger current at very short trigger pulses. This dependency is shown in the graph IFT versus LED PW. 20 30 40 50 The turn on transition time t(f) combined with the power triac’s turn on time is important to the power dissipation of this device. 60 I FT, LED TRIGGER CURRENT (mA) SCOPE ZERO CROSS DETECTOR IFT 115 VAC VTM EXT. SYNC +400 Vdc FUNCTION GENERATOR t(d) RTEST t(f) R = 1 kΩ Vout PULSE INPUT APPLIED VOLTAGE WAVEFORM MERCURY WETTED RELAY CTEST D.U.T. ISOL. TRANSF. 10 kΩ X100 SCOPE PROBE τRC Figure 10. Static dv/dt Test Circuit © 2004 Fairchild Semiconductor Corporation DUT 100 Ω 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 252 V dv/dt = IFT AC Vmax = 400 V 0 VOLTS VTM PHASE CTRL. PW CTRL. PERIOD CTRL. Vo AMPL. CTRL. 0.63 V τRC = τ 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τRC is measured at this point and recorded. Page 6 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M APPLICATIONS GUIDE VCC TRIAC DRIVER RLED POWER TRIAC Basic Triac Driver Circuit The new random phase triac driver family MOC3052-M and MOC3051-M are very immune to static dv/dt which allows snubberless operations in all applications where external generated noise in the AC line is below its guaranteed dv/dt withstand capability. For these applications a snubber circuit is not necessary when a noise insensitive power triac is used. Figure 11 shows the circuit diagram. The triac driver is directly connected to the triac main terminal 2 and a series Resistor R which limits the current to the triac driver. Current limiting resistor R must have a minimum value which restricts the current into the driver to maximum 1A. AC LINE R CONTROL Q LOAD RLED = (VCC - V F LED - V sat Q)/IFT R = Vp AC line/ITSM RET. Figure 11. Basic Driver Circuit R = Vp AC/ITM max rep. = Vp AC/1A The power dissipation of this current limiting resistor and the triac driver is very small because the power triac carries the load current as soon as the current through driver and current limiting resistor reaches the trigger current of the power triac. The switching transition times for the driver is only one micro second and for power triacs typical four micro seconds. VCC RLED TRIAC DRIVER POWER TRIAC RS R AC LINE MOV CS CONTROL LOAD Triac Driver Circuit for Noisy Environments RET. When the transient rate of rise and amplitude are expected to exceed the power triacs and triac drivers maximum ratings a snubber circuit as shown in Figure 12 is recommended. Fast transients are slowed by the R-C snubber and excessive amplitudes are clipped by the Metal Oxide Varistor MOV. Typical Snubber values RS = 33 Ω, CS = 0.01 µF MOV (Metal Oxide Varistor) protects triac and driver from transient overvoltages >VDRM max. Figure 12. Triac Driver Circuit for Noisy Environments Triac Driver Circuit for Extremely Noisy Environments, as specified in the noise standards IEEE472 and IEC255-4. Industrial control applications do specify a maximum transient noise dv/dt and peak voltage which is superimposed onto the AC line voltage. In order to pass this environment noise test a modified snubber network as shown in Figure 13 is recommended. POWER TRIAC VCC RLED TRIAC DRIVER R RS MOV AC LINE CS CONTROL LOAD RET. Recommended snubber to pass IEEE472 and IEC255-4 noise tests RS = 47 W, CS = 0.01 mF Figure 13. Triac Driver Circuit for Extremely Noisy Environments © 2004 Fairchild Semiconductor Corporation Page 7 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M Package Dimensions (Through Hole) Package Dimensions (Surface Mount) 0.350 (8.89) 0.320 (8.13) 0.350 (8.89) 0.320 (8.13) Pin 1 ID Pin 1 ID 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) Seating Plane Seating Plane 0.260 (6.60) 0.240 (6.10) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.070 (1.77) 0.040 (1.02) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.012 (0.30) 0.008 (0.20) 0.025 (0.63) 0.020 (0.51) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 0.390 (9.90) 0.332 (8.43) 0.100 [2.54] 0.035 (0.88) 0.006 (0.16) 0.020 (0.50) 0.016 (0.41) 15° 0.012 (0.30) Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.350 (8.89) 0.320 (8.13) Pin 1 ID 0.070 (1.78) 0.260 (6.60) 0.240 (6.10) Seating Plane 0.060 (1.52) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.425 (10.79) 0.100 (2.54) 0.305 (7.75) 0.200 (5.08) 0.115 (2.93) 0.030 (0.76) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) NOTE All dimensions are in inches (millimeters) © 2004 Fairchild Semiconductor Corporation Page 8 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M ORDERING INFORMATION Option Order Entry Identifier S Description S Surface Mount Lead Bend SD SR2 W T 0.4" Lead Spacing 300 V VDE 0884 300W Surface Mount; Tape and reel TV VDE 0884, 0.4" Lead Spacing 3S SR2V VDE 0884, Surface Mount 3SD SR2V VDE 0884, Surface Mount, Tape & Reel MARKING INFORMATION 1 MOC3051 2 X YY Q 6 V 3 4 5 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code, e.g., ‘3’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code *Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format. © 2004 Fairchild Semiconductor Corporation Page 9 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M Carrier Tape Specifications 12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 4.0 ± 0.1 0.30 ± 0.05 Ø1.5 MIN 1.75 ± 0.10 11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 10.1 ± 0.20 0.1 MAX 24.0 ± 0.3 Ø1.5 ± 0.1/-0 User Direction of Feed Reflow Profile (White Package, -M Suffix) Temperature (°C) 300 230°C, 10–30 s 250 245°C peak 200 150 Time above 183°C, 120–180 sec 100 Ramp up = 2–10°C/sec 50 • Peak reflow temperature: 245°C (package surface temperature) • Time of temperature higher than 183°C for 120–180 seconds • One time soldering reflow is recommended 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) © 2004 Fairchild Semiconductor Corporation Page 10 of 11 9/2/04 6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK) MOC3051-M MOC3052-M DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2004 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 11 of 11 9/2/04