M 24LC08B/16B MODULES 8K/16K I2C™ Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as 4 or 8 blocks of 256 bytes (4 x 256 x 8) or (8 x 256 x 8) • 2-wire serial interface bus, I2C compatible • Schmitt trigger inputs for noise suppression • Output slope control to eliminate ground bounce • 100 kHz (2.5V) and 400kHz (5V) compatibility • Self-timed write cycle (including auto-erase) • Page-write buffer for up to 16 bytes • 2 ms typical write cycle time for page-write • ESD protection > 4,000V • 1,000,000 ERASE/WRITE cycles guaranteed • Data retention > 200 years • Temperature range - Commercial (C): 0˚C to +70˚C DESCRIPTION The Microchip Technology Inc. 24LC08B/16B are 8K and 16K bit Electrically Erasable PROMs in ISO modules for smart card applications. The device is organized as four or eight blocks of 256 x 8-bit memory with a 2-wire serial interface. The 24LC08B and 24LC16B also have a page-write capability for up to 16 bytes of data. ISO MODULE LAYOUT VDD VSS SCL SDA BLOCK DIAGRAM HV GENERATOR I/O CONTROL LOGIC MEMORY CONTROL LOGIC XDEC EEPROM ARRAY PAGE LATCHES SDA SCL YDEC VCC VSS SENSE AMP R/W CONTROL I2C is a trademark of Philips Corporation. 1997 Microchip Technology Inc. DS21224A-page 1 24LC08B/16B MODULES 1.0 ELECTRICAL CHARACTERISTICS 1.1 Maximum Ratings* TABLE 1-1: VCC...................................................................................7.0V All inputs and outputs w.r.t. VSS ................-0.6V to VCC +1.0V Storage temperature ..................................... -65˚C to +150˚C Ambient temp. with power applied................. -65˚C to +125˚C Soldering temperature of leads (10 seconds) ............. +300˚C ESD protection on all pins ..................................................≥ 4 kV PIN FUNCTION TABLE Name Function VSS Ground SDA Serial Data SCL Serial Clock VCC +2.5V to 5.5V Power Supply *Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-2 DC CHARACTERISTICS All Parameters apply across the specified operating ranges unless otherwise noted. Parameter SCL and SDA pins: High level input voltage Low level input voltage Commercial (C): Tamb = 0˚C to +70˚C, VCC = 2.5V to 5.5V Symbol Min. VIH 0.7 VCC VIL Hysteresis of Schmitt trigger inputs VHYS Low level output voltage VOL Max. Units Conditions V (Note) 0.3 VCC V (Note) — V Vcc ≥ 2.5V (Note) 0.40 V IOL = 3.0 mA, VCC = 4.5V IOL = 2.1 mA, VCC = 2.5V 0.05 VCC Input leakage current ILI -10 10 µA VIN = VCC or VSS Output leakage current ILO -10 10 µA VOUT = VCC or VSS CIN, COUT — 10 pF VCC = 5.0V (Note) Tamb = 25˚C, f = 1 MHz ICC Write — 3 mA VCC = 5.5V, SCL = 400 kHz Pin capacitance (all inputs/outputs) Operating current Standby current ICC Read — 1 mA VCC = 5.5V, SCL = 400 kHz ICCS — 100 µA VCC = 5.5V, SDA = SCL = VCC Note: This parameter is periodically sampled and not 100% tested. DS21224A-page 2 1997 Microchip Technology Inc. 24LC08B/16B MODULES TABLE 1-3 AC CHARACTERISTICS All parameters apply across the specified operat- Vcc = 2.5V to 5.5V ing ranges unless otherwise noted. Commercial (C): Parameter Tamb = 0 °C to +70°C Vcc = 2.5V - 5.5V Vcc = 4.5V - 5.5V STD MODE FAST MODE Units Symbol Remarks Min. Max. Min. Max. Clock frequency Clock high time Clock low time SDA and SCL rise time SDA and SCL fall time START condition hold time FCLK THIGH TLOW TR TF THD:STA — 4000 4700 — — 4000 100 — — 1000 300 — — 600 1300 — — 600 400 — — 300 300 — kHz ns ns ns ns ns START condition setup time TSU:STA 4700 — 600 — ns Data input hold time Data input setup time STOP condition setup time Output valid from clock Bus free time THD:DAT TSU:DAT TSU:STO TAA TBUF 0 250 4000 — 4700 — — — 3500 — 0 100 600 — 1300 — — — 900 — ns ns ns ns ns TOF — 250 250 ns TSP — 50 20 +0.1 CB — (Note 2) Time the bus must be free before a new transmission can start (Note 1), CB ≤ 100 pF 50 ns (Notes 1, 3) TWC — 1M 10 — — 1M 10 — Output fall time from VIH minimum to VIL maximum Input filter spike suppression (SDA and SCL pins) Write cycle time Endurance (Note 1) (Note 1) After this period the first clock pulse is generated Only relevant for repeated START condition (Note 2) ms Byte or Page mode cycles 25°C, VCC = 5.0V, Block Mode (Note 4) Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions. 3: The combined TSP and VHYS specifications are due to Schmitt trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. 4: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained on our BBS or website. FIGURE 1-1: BUS TIMING DATA TR TF THIGH TLOW SCL TSU:STA SDA IN THD:DAT TSU:DAT TSU:STO THD:STA TSP TAA THD:STA TAA TBUF SDA OUT 1997 Microchip Technology Inc. DS21224A-page 3 24LC08B/16B MODULES 2.0 PAD DESCRIPTIONS 4.0 2.1 SDA (Serial Data) The following bus protocol has been defined: This is a Bi-directional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal, therefore the SDA bus requires a pull-up resistor to VCC (typical 10Ω). For normal data transfer SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the START and STOP conditions. 2.2 SCL (Serial Clock) This input is used to synchronize the data transfer from and to the device. 3.0 FUNCTIONAL DESCRIPTION The 24LC08B/16B supports a Bi-directional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, and a device receiving data as receiver. The bus has to be controlled by a master device which generates the serial clock (SCL), controls the bus access, and generates the START and STOP conditions, while the 24LC08B/16B works as slave. Both, master and slave can operate as transmitter or receiver but the master device determines which mode is activated. BUS CHARACTERISTICS • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data line while the clock line is HIGH will be interpreted as a START or STOP condition. Accordingly, the following bus conditions have been defined (Figure 5-2). 4.1 Bus not Busy (A) Both data and clock lines remain HIGH. 4.2 Start Data Transfer (B) A HIGH to LOW transition of the SDA line while the clock (SCL) is HIGH determines a START condition. All commands must be preceded by a START condition. 4.3 Stop Data Transfer (C) A LOW to HIGH transition of the SDA line while the clock (SCL) is HIGH determines a STOP condition. All operations must be ended with a STOP condition. 4.4 Data Valid (D) The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal. The data on the line must be changed during the LOW period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of the data bytes transferred between the START and STOP conditions is determined by the master device and is theoretically unlimited, although only the last 16 will be stored when doing a write operation. When an overwrite does occur it will replace data in a first in first out fashion. DS21224A-page 4 1997 Microchip Technology Inc. 24LC08B/16B MODULES 4.5 5.0 Acknowledge Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this acknowledge bit. Note: The 24LC08B/16B does not generate any acknowledge bits if an internal programming cycle is in progress. The device that acknowledges, has to pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by NOT generating an acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24LC08B/16B) will leave the data line HIGH to enable the master to generate the STOP condition. DEVICE ADDRESSING A control byte is the first byte received following the start condition from the master device. The control byte consists of a 4-bit control code, for the 24LC08B/16B this is set as 1010 binary for read and write operations. The next three bits of the control byte are the block select bits (B2, B1, B0). They are used by the master device to select which of the eight 256 word blocks of memory are to be accessed. These bits are in effect the three most significant bits of the word address. The last bit of the control byte defines the operation to be performed. When set to one a read operation is selected, when set to zero a write operation is selected. Following the start condition, the 24LC08B/16B monitors the SDA bus checking the device type identifier being transmitted, upon a 1010 code the slave device outputs an acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24LC08B/ 16B will select a read or write operation. Operation Control Code Block Select R/W Read 1010 Block Address 1 Write 1010 Block Address 0 FIGURE 5-1: CONTROL BYTE ALLOCATION START READ/WRITE SLAVE ADDRESS 1 FIGURE 5-2: SCL (A) 0 1 0 B2 R/W B1 A B0 DATA TRANSFER SEQUENCE ON THE SERIAL BUS (B) (D) START CONDITION ADDRESS OR ACKNOWLEDGE VALID (D) (C) (A) SDA 1997 Microchip Technology Inc. DATA ALLOWED TO CHANGE STOP CONDITION DS21224A-page 5 24LC08B/16B MODULES 6.0 WRITE OPERATIONS 6.2 6.1 Byte Write The write control byte, word address and the first data byte are transmitted to the 24LC08B/16B in the same way as in a byte write. But instead of generating a stop condition the master transmits up to 16 data bytes to the 24LC08B/16B which are temporarily stored in the on-chip page buffer and will be written into the memory after the master has transmitted a stop condition. After the receipt of each word, the four lower order address pointer bits are internally incremented by one. The higher order seven bits of the word address remains constant. If the master should transmit more than 16 words prior to generating the stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the stop condition is received an internal write cycle will begin (Figure 6-2). Following the start condition from the master, the device code (4 bits), the block address (3 bits), and the R/W bit which is a logic low is placed onto the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow after it has generated an acknowledge bit during the ninth clock cycle. Therefore the next byte transmitted by the master is the word address and will be written into the address pointer of the 24LC08B/16B. After receiving another acknowledge signal from the 24LC08B/16B the master device will transmit the data word to be written into the addressed memory location. The 24LC08B/ 16B acknowledges again and the master generates a stop condition. This initiates the internal write cycle, and during this time the 24LC08B/16B will not generate acknowledge signals (Figure 6-1). FIGURE 6-1: BYTE WRITE BUS ACTIVITY MASTER S T A R T SDA LINE S CONTROL BYTE WORD ADDRESS A C K A C K A C K FIGURE 6-2: S T O P DATA P BUS ACTIVITY PAGE WRITE S BUS ACTIVITY T A MASTER R T SDA LINE Page Write CONTROL BYTE WORD ADDRESS (n) DATA n S T O P DATA n + 15 DATA n + 1 S BUS ACTIVITY DS21224A-page 6 P A C K A C K A C K A C K A C K 1997 Microchip Technology Inc. 24LC08B/16B MODULES 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the stop condition for a write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a start condition followed by the control byte for a write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next read or write command. See Figure 7-1 for flow diagram. FIGURE 7-1: ACKNOWLEDGE POLLING FLOW Send Write Command 8.0 Read operations are initiated in the same way as write operations with the exception that the R/W bit of the slave address is set to one. There are three basic types of read operations: current address read, random read, and sequential read. 8.1 Send Start Send Control Byte with R/W = 0 Next Operation Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, first the word address must be set. This is done by sending the word address to the 24LC08B/16B as part of a write operation. After the word address is sent, the master generates a start condition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set. Then the master issues the control byte again but with the R/W bit set to a one. The 24LC08B/ 16B will then issue an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer but does generate a stop condition and the 24LC08B/16B discontinues transmission (Figure 8-2). Send Stop Condition to Initiate Write Cycle YES Current Address Read The 24LC08B/16B contains an address counter that maintains the address of the last word accessed, internally incremented by one. Therefore, if the previous access (either a read or write operation) was to address n, the next current address read operation would access data from address n + 1. Upon receipt of the slave address with R/W bit set to one, the 24LC08B/16B issues an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer but does generate a stop condition and the 24LC08B/16B discontinues transmission (Figure 8-1). 8.2 Did Device Acknowledge (ACK = 0)? READ OPERATIONS NO 8.3 Sequential Read Sequential reads are initiated in the same way as a random read except that after the 24LC08B/16B transmits the first data byte, the master issues an acknowledge as opposed to a stop condition in a random read. This directs the 24LC08B/16B to transmit the next sequentially addressed 8 bit word (Figure 8-3). To provide sequential reads the 24LC08B/16B contains an internal address pointer which is incremented by one at the completion of each operation. This address pointer allows the entire memory contents to be serially read during one operation. 8.4 Noise Protection The 24LC08B/16B employs a VCC threshold detector circuit which disables the internal erase/write logic if the VCC is below 1.5 volts at nominal conditions. The SCL and SDA inputs have Schmitt trigger and filter circuits which suppress noise spikes to assure proper device operation even on a noisy bus. 1997 Microchip Technology Inc. DS21224A-page 7 24LC08B/16B MODULES FIGURE 8-1: CURRENT ADDRESS READ BUS ACTIVITY MASTER S T A R T SDA LINE S CONTROL BYTE S T O P DATA n P A C K BUS ACTIVITY N O A C K FIGURE 8-2: RANDOM READ BUS ACTIVITY MASTER S T A R T CONTROL BYTE S T A R T WORD ADDRESS (n) S S T O P DATA (n) P S SDA LINE A C K BUS ACTIVITY FIGURE 8-3: CONTROL BYTE N O A C K A C K A C K SEQUENTIAL READ BUS ACTIVITY MASTER CONTROL BYTE DATA n DATA n + 1 DATA n + 2 S T O P DATA n + X P SDA LINE BUS ACTIVITY A C K A C K A C K A C K N O A C K DS21224A-page 8 1997 Microchip Technology Inc. 24LC08B/16B MODULES 9.0 SHIPPING METHOD The micromodules will be shipped to customers in clear plastic trays. Each tray holds 150 modules, and the trays can be stacked in a manner similar to shipping die in waffle packs. A tray drawing with dimensions is shown in Figure 9-1. FIGURE 9-1: TRAY DIMENSIONS 9.374 [238.09] 12.040 [305.82] 0.905 [22.99] 0.617 [15.68] R 0.300 [7.62] TYP 1997 Microchip Technology Inc. ANTISTATIC R 0.270 [6.86] TYP SMART CARD MODULES 14.000 [355.60] 0.500 [12.70] 0.860 [21.84] TYP. 0.980 [24.89] TYP 8.145 [206.88] DS21224A-page 9 DS21224A-page 10 A 0.007 [0.18] MAX. FR4 TAPE SECTION A-A 0.419 ± 0.002 [10.63 ± 0.05] GLOB SIZE 0.232 ± 0.002 [5.90 ± 0.05] DIE 0.004 [0.10] MAX. 0.015 [0.38] MAX. MIN 0.0235 [0.60] MAX. m IN (8x) 0.1043 ± 0.002 [2.65 ± 0.05] 0.1043 ± 0.002 [2.65 ± 0.05] VIA HOLES (8x) I.D. ¯ 0.026 [0.66] O.D. ¯ 0.042 [1.06] R. 0.059 [1.50] (4X) 0.209 ± 0.002 [5.31 ± 0.05] A COPPER BASE NICKEL PLATED, 150 GOLD FLASH 3-7 m IN 0.285 [7.24] MAX TYP. 0.146 ± 0.002 [3.71 ± 0.05] CONTACT SIDE 0.174 ± 0.002 [4.42 ± 0.05] FIGURE 9-2: 0.270 [6.86] MAX. 0.090 [2.29] MIN EPOXY FREE AREA (TYP.) 0.465 ± 0.002 [11.80 ± 0.05] DEVICE SIDE 24LC08B/16B MODULES MODULE DIMENSIONS 1997 Microchip Technology Inc. 24LC08B/16B MODULES 24LC08B/16B MODULES PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. 24LC08B/16B — /MT Package: Temperature Range: Device: MT = Micromodules in trays Blank = 0˚C to +70˚C 24LC08B 24LC16B 8K bit 2.5V I 2C Serial EEPROM in ISO Module 16K bit 2.5V I 2C Serial EEPROM in ISO Module Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office. 2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277. 3. The Microchip’s Bulletin Board, via your local CompuServe number (CompuServe membership NOT required). Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. 1997 Microchip Technology Inc. DS21224A-page 11 M WORLDWIDE SALES & SERVICE AMERICAS ASIA/PACIFIC EUROPE Corporate Office Hong Kong United Kingdom Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602-786-7200 Fax: 602-786-7277 Technical Support: 602 786-7627 Web: http://www.microchip.com Microchip Asia Pacific RM 3801B, Tower Two Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431 Arizona Microchip Technology Ltd. Unit 6, The Courtyard Meadow Bank, Furlong Road Bourne End, Buckinghamshire SL8 5AJ Tel: 44-1628-851077 Fax: 44-1628-850259 Atlanta India Microchip Technology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Microchip Technology Inc. India Liaison Office No. 6, Legacy, Convent Road Bangalore 560 025, India Tel: 91-80-229-4036 Fax: 91-80-559-9840 Boston Microchip Technology Inc. 5 Mount Royal Avenue Marlborough, MA 01752 Tel: 508-480-9990 Fax: 508-480-8575 Chicago Microchip Technology Inc. 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas Microchip Technology Inc. 14651 Dallas Parkway, Suite 816 Dallas, TX 75240-8809 Tel: 972-991-7177 Fax: 972-991-8588 Dayton Microchip Technology Inc. Two Prestige Place, Suite 150 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175 Los Angeles Microchip Technology Inc. 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 714-263-1888 Fax: 714-263-1338 New York Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934 Shanghai Microchip Technology RM 406 Shanghai Golden Bridge Bldg. 2077 Yan’an Road West, Hong Qiao District Shanghai, PRC 200335 Tel: 86-21-6275-5700 Fax: 86 21-6275-5060 France Arizona Microchip Technology SARL Zone Industrielle de la Bonde 2 Rue du Buisson aux Fraises 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 Müchen, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-39-6899939 Fax: 39-39-6899883 Singapore JAPAN Microchip Technology Taiwan Singapore Branch 200 Middle Road #07-02 Prime Centre Singapore 188980 Tel: 65-334-8870 Fax: 65-334-8850 Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa 222 Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Taiwan, R.O.C 8/29/97 Microchip Technology Taiwan 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel: 886 2-717-7175 Fax: 886-2-545-0139 Microchip Technology Inc. 150 Motor Parkway, Suite 416 Hauppauge, NY 11788 Tel: 516-273-5305 Fax: 516-273-5335 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Toronto Microchip Technology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253 All rights reserved. © 1997, Microchip Technology Incorporated, USA. 9/97 Printed on recycled paper. Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. DS21224A-page 12 1997 Microchip Technology Inc.