ONSEMI NCP1205

NCP1205
Single Ended PWM
Controller Featuring QR
Operation and Soft
Frequency Foldback
The NCP1205 combines a true Current Mode Control modulator
and a demagnetization detector to ensure full Discontinuous
Conduction Mode in any load/line conditions and minimum drain
voltage switching (Quasi–Resonant operation, also called critical
conduction operation). With its inherent Variable Frequency Mode
(VFM), the controller decreases its operating frequency at constant
peak current whenever the output power demand diminishes.
Associated with automatic multiple valley switching, this unique
architecture guarantees minimum switching losses and the lowest
power drawn from the mains when operating at no–load conditions.
Thus, the NCP1205 is optimal for applications targeting the newest
International Energy Agency (IEA) recommendations for standby
power.
The internal High–Voltage current source provides a reliable
charging path for the VCC capacitor and ensures a clean and short
start–up sequence without deteriorating the efficiency once off.
The continuous feedback signal monitoring implemented with an
Over–Current fault Protection circuitry (OCP) makes the final design
rugged and reliable. An internal Over Voltage Protection (OVP) circuit
continuously monitors the VCC pin and stops the IC whenever its level
exceeds 36 V. The DIP14 offers an adjustable version of the OVP
threshold via an external resistive network.
http://onsemi.com
MARKING
DIAGRAMS
8
8
1
1
14
PDIP–14
P SUFFIX
CASE 646
14
A
WL
YY
WW
• Natural Drain Valley Switching for Lower EMI and Quasi–Resonant
Operation (QR)
•
•
•
•
•
•
•
•
•
•
at Light–Load
Adjustable Maximum Switching Frequency
Internal 200 ns Leading Edge Blanking on Current Sense
250 mA Sink and Source Driver
Wide Operating Voltages: 8.0 to 36 V
Wide UVLO Levels: 7.2 to 15 V Typical
Auto–Recovery Internal Short–Circuit Protection (OCP)
Integrated 3.0 mA Typ. Start–Up Source
Current Mode Control
Adjustable Over–Voltage Level
Available in DIP8 and DIP14 Package
NCP1205P2
AWLYYWW
1
1
Features
• Smooth Frequency Foldback for Low Standby and Minimum Ripple
NCP1205P
AWL
YYWW
PDIP–8
N SUFFIX
CASE 626
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
NCP1205P
PDIP–8
50 Units/Rail
NCP1205P2
PDIP–14
25 Units/Rail
Applications
•
•
•
•
High Power AC/DC Adapters for Notebooks, etc.
Offline Battery Chargers
Power Supplies for DVD, CD Players, TVs, Set–Top Boxes, etc.
Auxiliary Power Supplies (USB, Appliances, etc.)
 Semiconductor Components Industries, LLC, 2002
April, 2002 – Rev. 2
1
Publication Order Number:
NCP1205/D
NCP1205
PIN CONNECTIONS
HV 1
14 NC
NC 2
13 VCC
Demag 3
HV 1
Demag 2
12 Drive
8 VCC
FB 4
11 Isense
7 Drive
Ct 5
10 GND
FB 3
6 Isense
Ct 4
5 GND
OVP 6
9 NC
NC 7
8 NC
PDIP–8
PDIP–14
PIN FUNCTION DESCRIPTION
Pin No.
DIP8
DIP14
Pin Name
1
1
HV
2
3
Demag
3
4
4
Function
Description
Start–up rail
Connected to the rectified HV rail, this pin provides a charging path to
VCC bulk capacitor.
Zero primary–current
detection
This pin ensures the re–start of the main switcher when operating in
free–run.
FB
Feedback signal to
control the PWM
This level modulates the peak current level in free–running operation
and modulates the frequency in VFM operation.
5
Ct
Timing capacitor
By adding a capacitor from Ct to the ground, the user selects the
minimum/maximum operating frequency.
5
10
Gnd
The IC’s ground
NA
6
OVP
Overvoltage input
By applying a 2.8 V typical level on this pin, the IC is permanently
latched–off until VCC falls below UVLOL.
6
11
Isense
The primary–current
sensing pin
This pin senses the primary current via an external shunt resistor.
7
12
Drv
This pin drives the
external switcher
The IC is able to deliver or absorb 250 mA peak currents while
delivering a clamped driving signal.
8
13
VCC
Powers the IC
A positive voltage up to 40 V typical can be applied upon this pin
before the IC stops.
–
1. DIP14 has different pinouts. Please see Pin Connections.
2. Pin 2, 7, 8, 9 and 14 are nonconnected on DIP14.
http://onsemi.com
2
NCP1205
R2
150
D2
1N4148
D6
1N5819
+
C14
22 µF
+
C1
10 µF
C10
470 µF
10 V
4x1N4007
R5
15
R8
22 k
* R10
15 k
R4
10
8
IC4
7
NCP1205P
6
3
2
5
4
SFH6156–2
R6
4.7 k
5V
+
C11
100 µF
10 V
+
D7
5.1 V
M2
MTD1N60E
1
Universal Input
L2
10 µH
C12
1 nF
R1
560
R3
3.3
C13
* Please refer to the application information section regarding this element.
1.5 nF Y1
Figure 1. Typical Application Example for DIP8 Version
+ C1
10 µF
ROVPU
4x1N4007
R2
15
R8
22 k
Universal Input
D6
1N5819
+
C14
33 µF/35 V
* R10
15 k
R5
15
D2
1N4148
C10
470 µF
10 V
5V
+
C11
47 µF
10 V
+
NCP1205P2
1
14
2
13
3
12
4
11
5
10
6
9
7
8
D7
4.3 V
M2
MTD1N60E
IC4
R4
6.8
SFH6156–2
ROVPL
L2
10 µH
R6
2.7 k
R3
3.3
C12
1 nF
* Please refer to the application information section regarding this element.
Figure 2. Typical Application Example for DIP14 Version
http://onsemi.com
3
R1
560
NCP1205
Startup
Over Voltage
Protection (VCC > 40 V)
HV 1
UVLOH = 15 V
UVLOL = 7.2 V
Internal VCC
Last Pulse of Demag
after 4 µs
Demag 2
8 VCC
Internal Regulator
7 DRV
DEMAG ?
Internal Clamp
Rf
Verr Max = 3 V
Verr Min = 10 mV
–
+
+
–
1/3
D
2.5 V
Ct 4
6 Isense
Driver
Current Comparator
–
+
FB 3
Clock
R Flip–Flop Q
250 mV – 1 V
Max Setpoint
Ri
5 Gnd
1V
VCC Pin 8
Verr
Lasts more than 128 ms?
––> Protection Circuitry
VCO Feedback
Toff = f (Verr)
Max Toff = f (Ct)
OVP
35 V Zener
–
+
+
–
250 mV Clamp
200 ns L.E.B
Over Current
Protection (OCP)
V(–) < 1.5 V
18 k
2.8 V
Figure 3. Internal Circuit Architecture for DIP8 Version
http://onsemi.com
4
+
–
NCP1205
VCC Pin 13
Startup
UVLOH = 15 V
UVLOL = 7.2 V
Over Voltage
Protection (VCC > 40 V)
HV 1
Internal Regulator
Last Pulse of Demag
after 4 µs
NC 2
Demag 3
12 DRV
Internal Clamp
Verr Max = 3 V
Verr Min = 10 mV
11 Isense
D
Ct 5
Over Current
Protection (OCP)
V(–) < 1.5 V
+
–
Driver
Current Comparator
–
+
2.5 V
250 mV – 1 V
Max Setpoint
+
–
R Flip–Flop Q
1/3
250 mV Clamp
FB 4
Clock
OVP
10 Gnd
200 ns L.E.B
9 NC
VCC Pin 13
1V
Verr
Lasts more than 128 ms?
––> Protection Circuitry
VCO Feedback
Toff = f (Verr)
Max Toff = f (Ct)
OVP
8 NC
35 V Zener
–
+
–
+
Ri
NC 7
13 VCC
DEMAG ?
Rf
OVP 6
14
Internal VCC
18 k
2.0 k
Figure 4. Internal Circuit Architecture for DIP14 Version
http://onsemi.com
5
2.8 V
+
–
NCP1205
MAXIMUM RATINGS
Value
Pin No.
Symbol
Min
Max
Unit
13
Vin
–
45
V
–
–
RJA
–
–
–
100
100
°C/W
–
Operating Junction Temperature Range
Maximum Junction Temperature
–
–
–
–
TJ
TJmax
–
–
–25 to +125
150
°C
°C
Storage Temperature Range
–
–
Tstg
–
–60 to +150
°C
ESD Capability, HBM Model
All Pins
All Pins
–
–
2.0
kV
ESD Capability, Machine Model
All Pins
All Pins
–
–
200
V
3
3
–
–
5.0
mA
Rating
Power Supply Voltage
Thermal Resistance Junction–to–Air
DIP8
DIP14
Demagnetization Pin Current
DIP8
DIP14
8
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TJ = –25°C to +125°C, Max TJ = 150°C,
VCC = 12 V unless otherwise noted.)
Pin No.
DIP8
DIP14
Symbol
Min
Typ
Max
Unit
Input Threshold Voltage (Vpin2 increasing)
2
3
Vth
50
65
85
mV
Hysteresis (Vpin2 decreasing)
2
3
VH
–
30
–
mV
Input Clamp Voltage
High State (Ipin2 = 3.0 mA)
Low State (Ipin2 = –3.0 mA)
2
3
VCH
VCL
8.0
–0.9
10
–0.7
12
–0.5
Demag Propagation Delay
–
–
–
100
300
350
ns
No Demag Signal Activation
–
–
–
–
4.0
8.0
µs
Internal Input Capacitance at 1.0 V
2
3
Cpin2
–
10
–
pF
Demag Propagation Delay with 22 kΩ External Resistor
2
3
–
100
370
480
ns
Input Impedance at VFB = 3.0 V
3
4
Zin
–
50
–
kΩ
Internal Error Amplifier Closed Loop Gain
3
4
AVCL
–
–3.0
–
–
Internal Built–In Offset Voltage for Error Detection
–
–
Vref
2.2
2.5
2.8
V
Error Amplifier Level of VCO Take Over
–
–
–
–
1.0
–
V
Internal Divider from Internal Error Amp, Pin to Current
Setpoint
–
–
–
–
3.0
–
–
Internal Over Current Level
–
–
WLL
–
1.5
–
V
Fault Time Duration to Latch Activation @ Ct = 1.0 ηF
–
–
–
–
128
–
ms
Over Current Latch–Off Phase @ Ct = 1.0 ηF
–
–
–
–
1.0
–
s
Hysteresis when VFB goes back into Regulation
–
–
–
–
100
–
mV
VCC (Pin 8) Over Voltage Protection
8
13
OVP1
36
40
43
V
Over Voltage Protection Threshold for DIP14 Version
6
6
OVP2
2.5
2.8
3.1
V
Input Bias Current @ 1.0 V
6
11
IIB
–
0.02
–
µA
Maximum Current Setpoint
6
11
Vcl
0.9
1.0
1.1
V
Minimum Current Setpoint
6
11
Vmin
225
250
285
mV
Characteristics
Demagnetization Block
V
Feedback Path
Fault Detection Circuitry
Current Sense Comparator
http://onsemi.com
6
NCP1205
ELECTRICAL CHARACTERISTICS (continued) (For typical values TA = 25°C, for min/max values TJ = 25°C to +125°C,
Max TJ = 150°C, VCC = 12 V unless otherwise noted.)
Pin No.
DIP8
DIP14
Symbol
Min
Typ
Max
Unit
Propagation Delay from Current Detection to Gate OFF
State
6
11
Tdel
–
200
250
ns
Leading Edge Blanking (LEB)
6
11
Tleb
–
200
–
ns
Minimum Frequency Operation @ Ct = 1.0 ηF and
VCC = 35 V
4
5
Fmin
–
0
–
kHz
Maximum Frequency Operation @ Ct = 1.0 ηF and
VCC = 35 V
4
5
Fmax
90
110
125
kHz
Minimum Ct Charging Current (Note 3)
4
5
ICtmin
–
0
–
µA
Maximum Ct Charging Current (Note 3)
4
5
ICtmax
280
350
420
µA
Discharge Time @ Ct = 1.0 ηF
4
5
–
–
500
–
ns
Output Voltage Rise Time @ CL = 1.0 ηF (V = 10 V)
7
12
tr
–
30
50
ns
Output Voltage Fall Time @ CL = 1.0 ηF (V = 10 V)
7
12
tf
–
30
50
ns
Clamped Output Voltage @ VCC = 35 V (Note 4)
7
12
VDRV
11
13
16
V
Voltage Drop on the Stage @ VCC = 10 V (Note 4)
12
12
VDRV
–
–
0.5
V
Startup Threshold (VCC Increasing)
8
13
UVLOH
13.5
15
16.5
V
Minimum Operating Voltage (VCC Decreasing)
8
13
UVLOL
6.5
7.2
8.0
V
Maximum Voltage, Pin 1 Grounded
1
1
–
–
450
–
V
Maximum Voltage, Pin 1 Decoupled (470 µF)
1
1
–
–
500
–
V
Startup Current Source Flowing through Pin 1
1
1
–
2.3
3.0
4.8
mA
Leakage Current in Offstate @ Vpin 1 = 500 V
1
1
–
–
32
70
µA
VCC less than UVLOH
8
13
–
–
1.5
1.8
mA
VCC = 35 V and Fsw = 2.0 kHz, CL = 1.0 ηF
8
13
–
–
1.2
3.0
mA
VCC = 35 V and Fsw = 125 kHz, CL = 1.0 ηF
8
13
–
–
3.0
4.0
mA
Startup Current to VCC Capacitor
8
13
–
1.4
–
–
mA
Characteristics
Current Sense Comparator (continued)
Frequency Modulator
Drive Output
Undervoltage Lockout
Startup Current Source
Device Current Consumption
3. Typical capacitor swing is between 0.5 V and 3.5 V.
4. Guaranteed by design, TJ = 25°C.
http://onsemi.com
7
NCP1205
125
SWITCHING FREQUENCY (kHz)
Ct CHARGING CURRENT (µA)
420
400
380
360
340
320
300
280
–50
0
50
100
100
95
0
50
Figure 6. Switching Frequency @ Ct = 1 nF
versus Temperature
15.5
15
14.5
14
0
50
100
150
150
100
Figure 5. Ct Charging Current versus
Temperature
MAXIMUM CURRENT SET POINT (mV)
START–UP THRESHOLD (V)
105
TEMPERATURE (°C)
1100
1050
1000
950
900
–50
0
50
100
150
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 7. Start–up Threshold versus
Temperature
Figure 8. Maximum Current Set Point versus
Temperature
MINIMUM OPERATING VOLTAGE (V)
43
VCC OVER VOLTAGE (V)
110
TEMPERATURE (°C)
16
42
41
40
39
38
37
36
–50
115
90
–50
150
16.5
13.5
–50
120
0
50
100
150
8
7.75
7.5
7.25
7
6.75
6.5
–50
0
50
100
150
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 9. VCC Over Voltage Protection versus
Temperature
Figure 10. Minimum Operating Voltage versus
Temperature
http://onsemi.com
8
NCP1205
APPLICATION INFORMATION
Introduction
By implementing a unique smooth frequency reduction
technique, the NCP1205 represents a major leap toward
low–power Switch–Mode Power Supply (SMPS) integrated
management. The circuit combines free–running operation
with minimum drain–source switching (so–called valley
switching), which naturally reduces the peak current stress
as well as the ElectroMagnetic Interferences (EMI). At
nominal output power, the circuit implements a traditional
current–mode SMPS whose peak current setpoint is given
by the feedback signal. However, rather than keeping the
switching frequency constant, each cycle is initiated by the
end of the primary demagnetization. The system therefore
operates at the boundary between Discontinuous
Conduction Mode (DCM) and Continuous Conduction
Mode (CCM). Figure 11 details this terminology:
L > Lc
IL
Not 0 at
Turn ON
IP
0
L = Lc
L < Lc
OFF
ON
IL(avg)
0 Before
Turn ON
Borderline
0
D/Fs
Dead–Time
Time
Figure 11. Defining the Conduction Mode, Discontinuous, Continuous and Borderline
valley switching. We will see later on how this is internally
implemented.
The FLYBACK operation is mainly defined through a
simple formula:
When the output power demands decreases, the natural
switching frequency raises. As a natural result, switching
losses also increase and degrade the SMPS efficiency. To
overcome this problem, the maximum switching frequency
of the NCP1205 is clamped to typically 125 kHz. When the
free running mode (also called Borderline Control Mode,
BCM) reaches this clamp value, an internal
Voltage–Controlled Oscillator (VCO) takes over and starts
to decrease the switching frequency: we are in Variable
Frequency Mode (VFM). Please note that during this
transition phase, the peak current is not fixed but is still
decreasing because the output power demand does. At a
given state, the peak current reaches a minimum ceil
(typically 250 mV/Rsense), and cannot go further down: the
switching frequency continues its decrease down to a
possible minimum of 0 Hz (the IC simply stops switching).
During normal free–running operation and VFM, the
controller always ensures single or multiple drain–source
Pout 1 · Lp · Ip2 · Fsw
2
(eq. 1)
With:
Lp the primary transformer inductance (also called the
magnetizing inductance)
Ip the peak current at which the MOSFET is turned off
Fsw the nominal switching frequency
To adjust the transmitted power, the PWM controller can
play on the switching frequency or the peak current setpoint.
To refine the control, the NCP1205 offers the ability to play
on both parameters either altogether on an individual basis.
http://onsemi.com
9
NCP1205
Free–Running Operation
As previously said, the operating frequency at nominal load
is dictated by the external elements. We can split the different
switching sections in two separated instants. In the following
text we use the internal error voltage, Verr. This level is
elaborated as Figure 14 portrays. Verr is linked to VFB (pin 4)
by the following formula:
In order to clarify the device behavior, we can distinguish the
following simplified operating phases:
1. The load is at its nominal value. The SMPS operates in
borderline conduction mode and the switching
frequency is imposed by the external elements (Vin,
Lp, Ip, Vout). The MOSFET is turned on at the
minimum drain–source level.
2. The load starts to decrease and the free–running
frequency hits the internal clamp.
3. The frequency can no longer naturally increase
because of the clamp. The frequency is now controlled
by the internal VCO but remains constant. The peak
current finds no other option that diminishing to satisfy
equation (1).
4. The peak current has reached the internal minimum
ceiling level and is now frozen for the remaining
cycles.
5. To further reduce the transmitted power (VFB goes up),
the VCO decreases the switching frequency. In case of
output overshoot, the VCO could decrease the
frequency down to zero. When the overshoot has gone,
VFB diminishes again and the IC smoothly resumes its
operation.
Verr 10 3 · VFB
(eq. 2)
ON time: The ON time is given by the time it takes to
reach the peak current setpoint imposed by the level on FB
pin (pin 4). Since this level is internally divided by three, the
peak setpoint is simply:
Ipk 1
· Verr
3 · Rsense
(eq. 3)
The rising slope of the peak current is also dependent on
the inductance value and the rectified DC input voltage by:
dIL
VinDC
dt
Lp
(eq. 4)
By combining both equations, we obtain the ON time
definition:
ton Advantages of the Method
By implementing the aforementioned control scheme, the
NCP1205 brings the following advantages:
• Discontinuous only operation: in DCM, the Flyback is
a first order system (at low frequencies) and thus
naturally eases the feedback loop compensation.
• A low–cost secondary rectifier can be used due to
smooth turn–off conditions.
• Valley switching ensures minimum switching losses
brought by Coss and all the parasitic capacitances.
• By folding back the switching frequency, you turn the
system into Pulse Duration Modulation. This method
prevents from generating uncontrolled output ripple as
with hysteretic controllers.
• By letting you control the peak current value at which
the frequency goes down, you ensure that this level is
low enough to avoid transformer acoustic noise
generation even at audible frequencies.
Lp
VinDC
· Ip Lp · VERR
VinDC · 3 · Rsense
(eq. 5)
OFF time: The time taken by the demagnetization of the
transformer depends on the reset voltage applied at the
switch opening. During the conduction time of the
secondary diode, the primary side of the transformer
undergoes a reflected voltage of: [Np/Ns . (Vf + Vout)]. This
voltage applied on the primary inductance dictates the time
needed to decrease from Ip down to zero:
toff · Ip Lp
Np
· (Vout Vf)
Ns
(eq. 6)
Lp · Verr
Np
Ns
· (Vout Vf) · 3 · Rsense
By adding ton + toff, we obtain the natural switching
frequency of the SMPS operating in Borderline Conduction
Mode (BCM):
ton toff Detailed Description
The following sections describe the internal behavior of
the NCP1205.
Verr · Lp
·
3 · Rsense
1 VinDC · (Vout Vf)
1
Np
Ns
(eq. 7)
http://onsemi.com
10
NCP1205
If we now enter this formula into a spreadsheet, we can easily plot the switching frequency versus the output power demand:
SWITCHING FREQUENCY (Hz)
250000
Transition
BCM to VFM
200000
150000
Fmax
Fmax
100000
50000
VCO Action
0
0
5
10
15
20
OUTPUT POWER (W)
Figure 12. A Typical Behavior of Free Running Systems
with a Smooth Frequency Foldback with the NCP1205
the VCO frequency decreases with a typical small–signal
slope of –175 kHz/mV @ Verr = 500 mV down to
zero (typically at FB ≈ 3.3 V). The demagnetization
synchronization is however kept when the Toff expands.
The maximum switching frequency can be altered by
adjusting the Ct capacitor on pin 5. The 125 kHz maximum
operation ensures that the fundamental component stays
external from the international EMI CISPR–22
specification beginning.
The following drawing explains the philosophy behind
the idea:
The typical above diagram shows how the frequency
moves with the output power demand. The components used
for the simulation were: Vin = 300 V, Lp = 6.5 mH,
Vout = 10 V, Np/Ns = 12.
The red line indicates where the maximum frequency is
clamped. At this time, the VCO takes over and decreases the
switching frequency to the minimum value.
VCO Operation
The VCO is controlled from the Verr voltage. For Verr
levels above 1.0 V, the VCO frequency remains unchanged
at 125 kHz. As soon as Verr starts to decrease below 1.0 V,
Internal Verr
3V
VCO Frequency
is Fixed at 130 kHz
BCM Mode
Peak current
can change
1V
0.75 V
VCO Frequency
can Decrease
Peak Current is Fixed
Figure 13. When the Power Demand goes Low, the Peak Current is Frozen and the Frequency Decreases
Zero Crossing Detector
To detect the zero primary current, we make use of an
auxiliary winding. By coupling this winding to the primary,
we have a voltage image of the flux activity in the core.
Figure 13 details the shape of the signal in BCM.
The auxiliary winding for demagnetization needs to
be wired in Forward mode. However, the application
note describes an alternative solution showing how to wire
the winding in Flyback as well. As Figure 13 depicts, when
the MOSFET closes, the auxiliary winding delivers
(Naux/Np . Vin). At the switch opening, we couple the
auxiliary winding to the main output power winding and
thus deliver: (–Naux/Ns . Vout). When DCM occurs, the
ringing also takes place on the auxiliary winding. As soon
as the level crosses–up the internal reference level
(65 mV), a signal is internally sent to re–start the MOSFET.
Three different conditions can occur:
http://onsemi.com
11
NCP1205
Error Amplifier and Fault Detection
The NCP1205 features an internal error amplifier solely
used to detect an overcurrent problem. The application
assumes that all the error gain associated with the precise
reference level is located on the secondary side of the SMPS.
Various solutions can be purposely implemented such as the
TL431 or a dedicated circuit like the MC33341. In the
NCP1205, the internal OPAMP is used to create a virtual
ground permanently biased at 2.5 V (Figure 14), an internal
reference level. By monitoring this virtual ground further
called V(–), we have the possibility to confirm the good
behavior of the loop. If by any mean the loop is broken
(shorted optocoupler, open LED etc.) or the regulation
cannot be reached (true output short–circuit), the OPAMP
network is adjusted in order to no longer be able to ensure
the 2.5 V virtual point V(–). If V(–) passes down the 1.5 V
level (e.g. output shorted) for a time longer than 128 ms, then
the pulses are stopped for 8 x 128 ms. The IC enters a kind
of burst mode with bunch of pulses lasting 128 ms and
repeating every 8 x 128 ms. If the loop is restored within the
8 x 128 ms period, then the pulses are back again on the
output drive (synchronized with UVLOH).
1. In BCM, every time the 65 mV line is crossed, the
switch is immediately turned–on. By accounting for
the internal Demag pin capacitance (10–15 pF
typical), you can introduce a fixed delay, which,
combined to the propagation delay, allows to precisely
re–start in the drain–source valley (minimum voltage
to reduce capacitive losses).
2. When the IC enters VFM, the VCO delivers a pulse
which is internally latched. As soon as the
demagnetization pulse appears, the logic re–starts the
MOSFET.
3. As can be seen from Figure 13, the parasitic
oscillations on the drain are subject to a natural
damping, mainly imputed to ohmic losses. At a given
point, the demag activity on the auxiliary winding
becomes too low to be detected. To avoid any re–start
problem, the TY72001 features an internal 4.0 µs
timeout delay. This timeout runs after each demag
pulse. If within 4.0 µs further to a demag pulse no
activity is detected, an internal signal is combined
with the VCO to actually re–start the MOSFET
(synchronized with Ct).
Drain Level
Valley
Switching
Possible Demag
65 mV
0V
2
Auxiliary Level
4 µs
IP = 0
Restart when Demag is too low
750.0 U
754.0 U
758.0 U
762.0 U
766.0 U
Figure 14. Core Reset Detection is done through
an Auxiliary Winding Operated in Forward
http://onsemi.com
12
NCP1205
Monitor
Rf
150 k
Vfb
Ri
50 k
V(–)
VHIGH = 3 V
VLOW = 5 mV
+
Vfb
2R
–
+
3
6
2
1
+
V1
2.5 V
+
–
5
Current
Setpoint
R
7
OCP
Circuitry
+
Vlow
1.5 V
Figure 15. This Typical Arrangement Allows for an Easy Fault Detection Management
To illustrate how the system reacts to a variable FB level,
we have entered the above circuit into a SPICE simulator
and observed the output waveforms. When FB is within
regulation, the error flag is low. However, as soon as FB
leaves its normal operating area, the OPAMP can no longer
keep the V(–) point and either goes to the positive top or
down to zero: the error flag goes high.
Because of the large amount of delay necessary for this
128 ms operation, the capacitor used for the timing is Ct,
connected from ground to pin 5. In normal VFM operation,
this timing capacitor serves as the VCO capacitor and the
error management circuit is transparent. As soon as an error
is detected (error flag goes high), an internal switch routes
Ct to the 128 ms generator. As a first effect, the switching
frequency is no longer controlled by the VCO (if the error
appears during VFM) and the system is relaxed to natural
BCM. The capacitor now ramps up and down to be further
divided and finally create the 128 ms delay.
6.500
Regulation Area
FB
4.500
Virtual Point
2.500
1.5 V
OCP Condition
500.0 M
Error Flag
1.000 M
3.000 M
5.000 M
7.000 M
9.000 M
Figure 16. By Monitoring the Internal Virtual Ground, the System can Detect the Presence of a Fault
http://onsemi.com
13
NCP1205
discharges toward ground. When the Vcc level crosses
UVLOL, a new startup sequence occurs. If the OVP has
gone, normal IC operation takes place. For different OVP
levels, the comparator input is accessible through pin 6 in the
DIP14 option.
As soon as the system recovers from the error, e.g. FB is
back within its regulation area, the IC operation comes back
to normal.
To avoid any system thermal runaway, another internal
8 x 128 ms delay is combined with the previous 128 ms. It
works as follows: the 128 ms delay is provided to account for
any normal transients that engender a temporary loss of
feedback (FB goes toward ground). However, when the
128 ms period is actually over (the feedback is definitively
lost) the IC stops the output driving pulses for a typical
period of 8 x 128 ms. During this mode, the rest of the
functions are still activated. For instance, in lack of pulses,
the self–supplied being no longer provided, the start–up
source turns on and off (when reaching the corresponding
UVLOL and UVLOH levels), creating an hiccup waveform
on the Vcc line. As soon as the feedback condition is
restored, the 8 x 128 ms is interrupted and, in synchronism
with the Vcc line, the IC is back to normal. The following
diagrams show how this mechanism takes place when FB is
down to zero (optocoupler opened) or up to Vcc
(optocoupler shorted). If we assume that the error is
permanently present, then a burst mode takes place with a
128/8 x 128 = 12.5% duty–cycle. The real transmitted
power is thus:
VCC
6
5V
5
10 V
4
10 V
3
10 V
2
–
+
Latched
OVP
7
2k
8
OVP
1
+
2.8 V
18 k
PoutBURST 1 · Lp · Ip2 · Fsw · DutyBURST
2
Overvoltage Detection (OVP)
OVP detection is done differently on the DIP8 and DIP14
versions. In the DIP8, because of available pin count, the
OVP is accomplished by monitoring the Vcc voltage. On the
DIP14, the device also monitors the Vcc level but in parallel,
the triggering point has been pin–out to allow precise OVP
selection. This pin can also be used to externally latch–off
the IC.
As mentioned, Over Voltage Conditions are detected by
monitoring the Vcc level. Figure 17 describes how three
10 V zener plus one 5.0 V zener are connected in series
together with a 18 kΩ to ground. As soon as Vcc exceeds
40 V typical, a current starts to flow in the 18 k resistor.
When the voltage developed across this element exceeds
2.8 V, an error is triggered and immediately latches the IC
off. In lack of switching pulses, the Vcc capacitor is no
longer refreshed by the auxiliary supply and slowly
Figure 17. In the DIP8 Version, the OVP Pad is not
Pinned Out and is Available with DIP14 Devices Only
Protecting Pin 1 Against Negative Spikes
As any CMOS controller, NCP1205 is sensitive to
negative voltages that could appear on it’s pins. To avoid any
adverse latch–up of the IC, we strongly recommend
inserting a 15 k resistor in series with pin 1 and the
high–voltage rail, as shown in Figures 18 and 19. This 15 k
resistor prevents from adversely latching the controller in
case of negative spikes appearing on the bulk capacitor
during the power–off sequence. Please note that this resistor
does not dissipate any continuous power and can therefore
be of low power type. Two 8.2 k can also be wired in series
to sustain the large DC voltage present on the bulk.
http://onsemi.com
14
NCP1205
OVP
VCC
40 V
UVLOH
UVLOL
Drive
Unit VCC Reaches UVLOL
Figure 18. When the VCC Voltage Goes Above the
Maximum Value, the Device Enters Safe Burst Mode
VCC
Arbitrary VCC Representation
UVLOH
UVLOL
Drive
8 x 128 ms maximum if loop does not
recover
V(–)
3.5 V
Loop Recovers
Here
1.5 V
128 ms
Figure 19. When the Internal V(–) Passes Below 1.5 V, the IC
Senses a Short–Circuit Event
http://onsemi.com
15
NCP1205
PACKAGE DIMENSIONS
PDIP–8
N SUFFIX
CASE 626–05
ISSUE L
8
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5
–B–
1
4
F
–A–
NOTE 2
L
C
J
–T–
N
SEATING
PLANE
D
H
M
K
G
0.13 (0.005)
M
T A
M
B
M
http://onsemi.com
16
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
--10
0.76
1.01
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
--10
0.030
0.040
NCP1205
PACKAGE DIMENSIONS
PDIP–14
P SUFFIX
CASE 646–06
ISSUE M
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
8
B
1
7
A
F
L
N
C
–T–
SEATING
PLANE
J
K
H
G
D 14 PL
M
0.13 (0.005)
M
http://onsemi.com
17
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
--10
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
18.80
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
--10
0.38
1.01
NCP1205
Notes
http://onsemi.com
18
NCP1205
Notes
http://onsemi.com
19
NCP1205
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: [email protected]
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Email: [email protected]
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
http://onsemi.com
20
NCP1205/D